the bump connectors being bonded to at least one common bonding area

Industry

CPC
H01L2224/1411

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1411the bump connectors being bonded to at least one common bonding area

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor assemblies using edge stacking and methods of manufac...
- Patent number 11,955,457
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging of light emitting diodes (LEDs)
- Patent number 11,837,585
- Issue date Dec 5, 2023
- CreeLED, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices including coax-like electrical connections and methods for...
- Patent number 11,837,565
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Saqib Kaleem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and amplifier assembly
- Patent number 11,736,067
- Issue date Aug 22, 2023
- Sumitomo Electric Industries, Ltd.
- Masahiro Tanomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-bump connection to interconnect structure and manufacturing m...
- Patent number 11,705,420
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,626,388
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making flip chip
- Patent number RE49286
- Issue date Nov 8, 2022
- Research & Business Foundation SUNGKYUNKWAN UNIV
- Seung Boo Jung
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,233,036
- Issue date Jan 25, 2022
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and manufacturing method
- Patent number 11,217,548
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect structure and method for forming same
- Patent number 11,133,274
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 10,943,888
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip and method of making flip chip
- Patent number RE48421
- Issue date Feb 2, 2021
- Research & Business Foundation SUNGKYUNKWAN UNIV
- Seung Boo Jung
Information Patent Grant
Method of making flip chip
- Patent number RE48422
- Issue date Feb 2, 2021
- Research & Business Foundation SUNGKYUNKWAN UNIV
- Seung Boo Jung
Information Patent Grant
Semiconductor assemblies using edge stacking and methods of manufac...
- Patent number 10,867,964
- Issue date Dec 15, 2020
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and amplifier assembly
- Patent number 10,862,433
- Issue date Dec 8, 2020
- Sumitomo Electric Industries, Ltd.
- Masahiro Tanomura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wafer level packaging of light emitting diodes (LEDs)
- Patent number 10,854,584
- Issue date Dec 1, 2020
- Cree, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect structure and method for forming same
- Patent number 10,700,025
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,643,935
- Issue date May 5, 2020
- Samsung Electronics Co., Ltd.
- Sung Young Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device capable of suppressing electromagnetic radiation...
- Patent number 10,504,853
- Issue date Dec 10, 2019
- Realtek Semiconductor Corporation
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 10,192,852
- Issue date Jan 29, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic component module and electronic...
- Patent number 10,177,108
- Issue date Jan 8, 2019
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor device structure and manufacturing method
- Patent number 10,163,843
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure-activated electrical interconnection by micro-transfer pri...
- Patent number 10,163,735
- Issue date Dec 25, 2018
- X-CELEPRINT LIMITED
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,109,611
- Issue date Oct 23, 2018
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure-activated electrical interconnection by micro-transfer pri...
- Patent number 10,103,069
- Issue date Oct 16, 2018
- X-CELEPRINT LIMITED
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,068,823
- Issue date Sep 4, 2018
- Rohm Co., Ltd.
- Hiroshi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated semiconductor devices and pas...
- Patent number 9,837,393
- Issue date Dec 5, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,831,212
- Issue date Nov 28, 2017
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 9,818,728
- Issue date Nov 14, 2017
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and manufacturing method
- Patent number 9,806,046
- Issue date Oct 31, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...
- Publication number 20240222325
- Publication date Jul 4, 2024
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE
- Publication number 20240047305
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Seungha OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230361170
- Publication date Nov 9, 2023
- MURATA MANUFACTURING CO., LTD.
- Fuminori MORISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Bump Connection to Interconnect Structure and Manufacturing M...
- Publication number 20230317661
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Bump Connection to Interconnect Structure and Manufacturing M...
- Publication number 20220139860
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES INCLUDING COAX-LIKE ELECTRICAL CONNECTIONS AND METHODS FOR...
- Publication number 20220059487
- Publication date Feb 24, 2022
- INFINEON TECHNOLOGIES AG
- Saqib KALEEM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING OF LIGHT EMITTING DIODES (LEDS)
- Publication number 20210104503
- Publication date Apr 8, 2021
- Cree, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...
- Publication number 20210091039
- Publication date Mar 25, 2021
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND AMPLIFIER ASSEMBLY
- Publication number 20210058039
- Publication date Feb 25, 2021
- Sumitomo Electric Industries, Ltd.
- Masahiro Tanomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Interconnect Structure and Method for Forming Same
- Publication number 20200328169
- Publication date Oct 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Structure and Manufacturing Method
- Publication number 20190131264
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Li-Guo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180323154
- Publication date Nov 8, 2018
- REALTEK SEMICONDUCTOR CORPORATION
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD
- Publication number 20180068967
- Publication date Mar 8, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Guo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180047698
- Publication date Feb 15, 2018
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH REDUNDANT ELECTRICAL CONNECTORS AND ASS...
- Publication number 20180026015
- Publication date Jan 25, 2018
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING OF MULTIPLE LIGHT EMITTING DIODES (LEDS) ON A...
- Publication number 20170271561
- Publication date Sep 21, 2017
- Cree, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170076981
- Publication date Mar 16, 2017
- XINTEC INC.
- Chien-Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20170040279
- Publication date Feb 9, 2017
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Wan-Ting CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Devices, Packaged Semiconductor Devices, and Packaging Me...
- Publication number 20160064348
- Publication date Mar 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP AND DISPLAY APPARATUS
- Publication number 20150303162
- Publication date Oct 22, 2015
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Junping BAO
- G02 - OPTICS
Information Patent Application
ELECTRONIC PART, ELECTRONIC APPARATUS, AND MOVING OBJECT
- Publication number 20140345928
- Publication date Nov 27, 2014
- SEIKO EPSON CORPORATION
- Yugo KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, AND METHOD FOR FORMING A CHIP ARRANGEMENT
- Publication number 20140332953
- Publication date Nov 13, 2014
- INFINEON TECHNOLOGIES AG
- Peter Ossimitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layout Structure of Heterojunction Bipolar Transistors
- Publication number 20140312390
- Publication date Oct 23, 2014
- Shu-Hsiao TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Interconnect Structure and Method for Forming Same
- Publication number 20140264930
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...
- Publication number 20140252652
- Publication date Sep 11, 2014
- SK HYNIX INC.
- Seong Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140203291
- Publication date Jul 24, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Koichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Silicon Via Structure and Method
- Publication number 20140203439
- Publication date Jul 24, 2014
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKA...
- Publication number 20140191406
- Publication date Jul 10, 2014
- PANASONIC CORPORATION
- Hiromitsu Takashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip Chip Interconnection Structure
- Publication number 20140145340
- Publication date May 29, 2014
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLEMENTING DECOUPLING DEVICES INSIDE A TSV DRAM STACK
- Publication number 20140117500
- Publication date May 1, 2014
- International Business Machines Corporation
- Joab D. Henderson
- H01 - BASIC ELECTRIC ELEMENTS

the bump connectors being bonded to at least one common bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor assemblies using edge stacking and methods of manufac...

Wafer level packaging of light emitting diodes (LEDs)

Devices including coax-like electrical connections and methods for...

Semiconductor device and amplifier assembly

Multi-bump connection to interconnect structure and manufacturing m...

Interconnect structure with redundant electrical connectors and ass...

Method of making flip chip

Interconnect structure with redundant electrical connectors and ass...

Semiconductor device structure and manufacturing method

Fan-out interconnect structure and method for forming same

Interconnect structure with redundant electrical connectors and ass...

Flip chip and method of making flip chip

Method of making flip chip

Semiconductor assemblies using edge stacking and methods of manufac...

Semiconductor device and amplifier assembly

Wafer level packaging of light emitting diodes (LEDs)

Fan-out interconnect structure and method for forming same

Semiconductor device

Electronic device capable of suppressing electromagnetic radiation...

Interconnect structure with redundant electrical connectors and ass...

Method of manufacturing electronic component module and electronic...

Semiconductor device structure and manufacturing method

Pressure-activated electrical interconnection by micro-transfer pri...

Semiconductor device

Pressure-activated electrical interconnection by micro-transfer pri...

Semiconductor device

Semiconductor package with integrated semiconductor devices and pas...

Semiconductor device

Interconnect structure with redundant electrical connectors and ass...

Semiconductor device structure and manufacturing method

Patents Applicationslast 30 patents

SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...

INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

Multi-Bump Connection to Interconnect Structure and Manufacturing M...

Multi-Bump Connection to Interconnect Structure and Manufacturing M...

DEVICES INCLUDING COAX-LIKE ELECTRICAL CONNECTIONS AND METHODS FOR...

WAFER LEVEL PACKAGING OF LIGHT EMITTING DIODES (LEDS)

SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...

SEMICONDUCTOR DEVICE AND AMPLIFIER ASSEMBLY

Fan-Out Interconnect Structure and Method for Forming Same

Semiconductor Device Structure and Manufacturing Method

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURE WITH REDUNDANT ELECTRICAL CONNECTORS AND ASS...

WAFER LEVEL PACKAGING OF MULTIPLE LIGHT EMITTING DIODES (LEDS) ON A...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

Packaging Devices, Packaged Semiconductor Devices, and Packaging Me...

INTEGRATED CIRCUIT CHIP AND DISPLAY APPARATUS

ELECTRONIC PART, ELECTRONIC APPARATUS, AND MOVING OBJECT

CHIP ARRANGEMENT, AND METHOD FOR FORMING A CHIP ARRANGEMENT

Layout Structure of Heterojunction Bipolar Transistors

Fan-Out Interconnect Structure and Method for Forming Same

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Through Silicon Via Structure and Method

MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKA...

Flip Chip Interconnection Structure

IMPLEMENTING DECOUPLING DEVICES INSIDE A TSV DRAM STACK