the channel comprising at least one vertical portion

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H01L27/11556

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

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H01L27/11556the channel comprising at least one vertical portion

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor memory device and manufacturing method of the semicon...
- Patent number 11,688,682
- Issue date Jun 27, 2023
- SK hynix Inc.
- Jin Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including self-aligned conductive contacts
- Patent number 11,682,581
- Issue date Jun 20, 2023
- Micron Technology, Inc.
- Kar Wui Thong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell including cell transistor including control gate and ch...
- Patent number 11,682,667
- Issue date Jun 20, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for semiconductor chip hole geometry metrology
- Patent number 11,674,909
- Issue date Jun 13, 2023
- Yangtze Memory Technologies Co., Ltd.
- Le Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 11,676,836
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Jae Ick Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device
- Patent number 11,678,488
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Seokcheon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active protection circuits for semiconductor devices
- Patent number 11,676,917
- Issue date Jun 13, 2023
- Micron Technology, Inc.
- Michael A. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array structures for capacitive sense NAND memory
- Patent number 11,678,482
- Issue date Jun 13, 2023
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a staircase structure
- Patent number 11,678,481
- Issue date Jun 13, 2023
- Micron Technology, Inc.
- Rohit Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional flash memory device including channel structures...
- Patent number 11,678,489
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Jisung Cheon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory array with local line selector
- Patent number 11,672,123
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Jun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device with protruding separating portions
- Patent number 11,672,112
- Issue date Jun 6, 2023
- Kioxia Corporation
- Genki Kawaguchi
- G11 - INFORMATION STORAGE
Information Patent Grant
3D memory device including shared select gate connections between m...
- Patent number 11,670,370
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Aaron Yip
- G11 - INFORMATION STORAGE
Information Patent Grant
Sense line structures in capacitive sense NAND memory
- Patent number 11,670,379
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory device
- Patent number 11,670,382
- Issue date Jun 6, 2023
- Kioxia Corporation
- Takuya Futatsuyama
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,672,114
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Page buffer and memory device including the same
- Patent number 11,670,377
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Se Won Yun
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor storage device
- Patent number 11,672,113
- Issue date Jun 6, 2023
- Kioxia Corporation
- Kaihei Kato
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor devices
- Patent number 11,664,362
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Hyun Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, memory devices, and electronic systems
- Patent number 11,665,894
- Issue date May 30, 2023
- Micron Technology, Inc.
- Christopher J. Larsen
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods and apparatuses having strings of memory cells including a...
- Patent number 11,665,893
- Issue date May 30, 2023
- Micron Technology, Inc.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming assemblies having heavily doped regions
- Patent number 11,658,033
- Issue date May 23, 2023
- Micron Technology, Inc.
- Yushi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of the semicon...
- Patent number 11,658,113
- Issue date May 23, 2023
- SK hynix Inc.
- Jin Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies
- Patent number 11,658,132
- Issue date May 23, 2023
- Micron Technology, Inc.
- Rohit Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 11,657,874
- Issue date May 23, 2023
- Kioxia Corporation
- Sanad Bushnaq
- G11 - INFORMATION STORAGE
Information Patent Grant
Access operations in capacitive sense NAND memory
- Patent number 11,657,880
- Issue date May 23, 2023
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor devices including staircase structures
- Patent number 11,653,499
- Issue date May 16, 2023
- Micron Technology, Inc.
- Eric N. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with multiple tiers, and methods
- Patent number 11,653,497
- Issue date May 16, 2023
- Micron Technology, Inc.
- Toru Tanzawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 11,652,000
- Issue date May 16, 2023
- Kioxia Corporation
- Hidekazu Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory devices with bending prevention layers
- Patent number 11,652,068
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Sunil Shim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL NAND MEMORY DEVICE AND FABRICATION METHOD
- Publication number 20240237338
- Publication date Jul 11, 2024
- Yangtze Memory Technologies Co., Ltd.
- Longxiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MEMORY DEVICE AND METHOD OF FORMING SEAL STRUCTURE
- Publication number 20240234339
- Publication date Jul 11, 2024
- Macronix International Co., Ltd.
- Cheng-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND SYSTEM HAVING THE SAME
- Publication number 20240206164
- Publication date Jun 20, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zongliang Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20240188292
- Publication date Jun 6, 2024
- Yangtze Memory Technologies Co., Ltd.
- Cuicui Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND SYSTEM HAVING THE SAME
- Publication number 20240170389
- Publication date May 23, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jiajia Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING SACRIFICIAL LAYERS OF A STACK OF A THREE-DIMENS...
- Publication number 20240172437
- Publication date May 23, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhen GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY BLOCK, MEMORY-CELL GROUP AND MEMORY DEVICE
- Publication number 20240172438
- Publication date May 23, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Qiong ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY, FABRICATING METHOD THEREOF AND MEMORY SYSTEM
- Publication number 20240164097
- Publication date May 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jianquan JIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MEMORY DEVICE AND METHOD OF FORMING SEAL STRUCTURE
- Publication number 20240136305
- Publication date Apr 25, 2024
- Macronix International Co., Ltd.
- Cheng-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL NAND MEMORY DEVICE AND FABRICATION METHOD
- Publication number 20240138148
- Publication date Apr 25, 2024
- Yangtze Memory Technologies Co., Ltd.
- Longxiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEIVCE, MANUFACTURING METHOD THEREOF, AND...
- Publication number 20240130129
- Publication date Apr 18, 2024
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Jiayi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE, MANUFACTURING METHOD THEREOF, AND...
- Publication number 20240130130
- Publication date Apr 18, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jiayi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20240113012
- Publication date Apr 4, 2024
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MEMORY OPENING MONITORIN...
- Publication number 20240107758
- Publication date Mar 28, 2024
- SANDISK TECHNOLOGIES LLC
- Hiroyuki OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20240107760
- Publication date Mar 28, 2024
- Yangtze Memory Technologies Co., Ltd.
- Di Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20240107761
- Publication date Mar 28, 2024
- Yangtze Memory Technologies Co., Ltd.
- Di Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METH...
- Publication number 20240105622
- Publication date Mar 28, 2024
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METH...
- Publication number 20240105623
- Publication date Mar 28, 2024
- SANDISK TECHNOLOGIES LLC
- Ramy Nashed Bassely SAID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20240098993
- Publication date Mar 21, 2024
- Micron Technology, Inc.
- Andrew Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20240098989
- Publication date Mar 21, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhengliang Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCESS CIRCUITRY STRUCTURES FOR THREE-DIMENSIONAL MEMORY ARRAY
- Publication number 20240088044
- Publication date Mar 14, 2024
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES INCLUDING ISOLATION STRUCTURES EXHIBITING A WEAV...
- Publication number 20240081076
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Sidhartha Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
- Publication number 20240081051
- Publication date Mar 7, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhen GUO
- G11 - INFORMATION STORAGE
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20240071932
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STADIUM STRUCTURES, AND RELATED M...
- Publication number 20240071918
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20240074181
- Publication date Feb 29, 2024
- Yangtze Memory Technologies Co., Ltd.
- Linchun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING...
- Publication number 20240074200
- Publication date Feb 29, 2024
- SANDISK TECHNOLOGIES LLC
- Bing ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20240071498
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Yongjun Jeff Hu
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240074186
- Publication date Feb 29, 2024
- SK HYNIX INC.
- Jung Hyeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DIPOLE-CONTAINING BLOCKIN...
- Publication number 20240074170
- Publication date Feb 29, 2024
- SANDISK TECHNOLOGIES LLC
- Takashi YUDA
- H01 - BASIC ELECTRIC ELEMENTS

the channel comprising at least one vertical portion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor memory device and manufacturing method of the semicon...

Memory device including self-aligned conductive contacts

Memory cell including cell transistor including control gate and ch...

Systems and methods for semiconductor chip hole geometry metrology

Semiconductor device

Three-dimensional semiconductor memory device

Active protection circuits for semiconductor devices

Memory array structures for capacitive sense NAND memory

Methods of forming a staircase structure

Three-dimensional flash memory device including channel structures...

Three-dimensional memory array with local line selector

Semiconductor memory device with protruding separating portions

3D memory device including shared select gate connections between m...

Sense line structures in capacitive sense NAND memory

Memory device

Memory arrays and methods used in forming a memory array comprising...

Page buffer and memory device including the same

Semiconductor storage device

Semiconductor devices

Microelectronic devices, memory devices, and electronic systems

Methods and apparatuses having strings of memory cells including a...

Methods of forming assemblies having heavily doped regions

Semiconductor memory device and manufacturing method of the semicon...

Integrated assemblies

Semiconductor storage device

Access operations in capacitive sense NAND memory

Semiconductor devices including staircase structures

Semiconductor apparatus with multiple tiers, and methods

Semiconductor device, method of manufacturing semiconductor device,...

Vertical memory devices with bending prevention layers

Patents Applicationslast 30 patents

THREE-DIMENSIONAL NAND MEMORY DEVICE AND FABRICATION METHOD

3D MEMORY DEVICE AND METHOD OF FORMING SEAL STRUCTURE

THREE-DIMENSIONAL MEMORY DEVICES AND SYSTEM HAVING THE SAME

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

THREE-DIMENSIONAL MEMORY DEVICES AND SYSTEM HAVING THE SAME

METHOD FOR REMOVING SACRIFICIAL LAYERS OF A STACK OF A THREE-DIMENS...

MEMORY BLOCK, MEMORY-CELL GROUP AND MEMORY DEVICE

THREE-DIMENSIONAL MEMORY, FABRICATING METHOD THEREOF AND MEMORY SYSTEM

3D MEMORY DEVICE AND METHOD OF FORMING SEAL STRUCTURE

THREE-DIMENSIONAL NAND MEMORY DEVICE AND FABRICATION METHOD

THREE-DIMENSIONAL MEMORY DEIVCE, MANUFACTURING METHOD THEREOF, AND...

THREE-DIMENSIONAL MEMORY DEVICE, MANUFACTURING METHOD THEREOF, AND...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MEMORY OPENING MONITORIN...

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METH...

THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE LINE ISOLATION AND METH...

Memory Circuitry And Method Used In Forming Memory Circuitry

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

ACCESS CIRCUITRY STRUCTURES FOR THREE-DIMENSIONAL MEMORY ARRAY

ELECTRONIC DEVICES INCLUDING ISOLATION STRUCTURES EXHIBITING A WEAV...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR

Memory Circuitry And Method Used In Forming Memory Circuitry

MICROELECTRONIC DEVICES INCLUDING STADIUM STRUCTURES, AND RELATED M...

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DIPOLE-CONTAINING BLOCKIN...