the coating being directly applied to the semiconductor body

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3171the coating being directly applied to the semiconductor body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having via protective layer
- Patent number 11,978,688
- Issue date May 7, 2024
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device, packaging structure, and electronic device
- Patent number 11,978,767
- Issue date May 7, 2024
- Huawei Technologies Co., Ltd.
- Zhaozheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,973,036
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, high electron mobility transistor and fabr...
- Patent number 11,967,642
- Issue date Apr 23, 2024
- Vanguard International Semiconductor Corporation
- Chih-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,961,813
- Issue date Apr 16, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with nanotube particles for enhanced performance and met...
- Patent number 11,961,781
- Issue date Apr 16, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,955,397
- Issue date Apr 9, 2024
- Vanguard International Semiconductor Corporation
- Shin-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic humidity sensor devices and methods of manufacture
- Patent number 11,953,460
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Ricky Alan Jackson
- G01 - MEASURING TESTING
Information Patent Grant
Methods and devices related to radio frequency devices
- Patent number 11,948,802
- Issue date Apr 2, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal dissipation in semiconductor devices
- Patent number 11,942,390
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme design for wafer singulation
- Patent number 11,942,436
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component built-in wiring board and method for manufactu...
- Patent number 11,935,801
- Issue date Mar 19, 2024
- Ibiden Co., Ltd.
- Yusuke Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,929,406
- Issue date Mar 12, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Qiyue Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Relating to passivation layers
- Patent number 11,929,296
- Issue date Mar 12, 2024
- X-FAB SARAWAK SDN. BHD.
- Raj Sekar Sethu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III nitride-based transistor device having a field plate
- Patent number 11,929,405
- Issue date Mar 12, 2024
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass and melt solder for the passivation of semiconductor components
- Patent number 11,926,565
- Issue date Mar 12, 2024
- Schott AG
- Linda Johanna Bartelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating high electron mobility transistor
- Patent number 11,929,407
- Issue date Mar 12, 2024
- Vanguard International Semiconductor Corporation
- Ting-En Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,929,318
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-on-insulator with crystalline silicon oxide
- Patent number 11,923,236
- Issue date Mar 5, 2024
- TURUN YLIOPISTO
- Pekka Laukkanen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory devices and methods of manufacturing the same
- Patent number 11,925,015
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Sang-yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked devices and methods of fabrication
- Patent number 11,916,054
- Issue date Feb 27, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device
- Patent number 11,908,875
- Issue date Feb 20, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Wei Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus having a functional structure delimited by a frame struct...
- Patent number 11,908,763
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Prashanth Makaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with press-fit contacts
- Patent number 11,901,273
- Issue date Feb 13, 2024
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanosheet transistor
- Patent number 11,901,438
- Issue date Feb 13, 2024
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for forming photonic integrated package
- Patent number 11,901,196
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method for fabricating the semicond...
- Patent number 11,903,200
- Issue date Feb 13, 2024
- SK hynix Inc.
- Yu Jeong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including integrated segments and methods of manufacturin...
- Patent number 11,894,327
- Issue date Feb 6, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with capacitor contact surrounded by conductiv...
- Patent number 11,895,823
- Issue date Feb 6, 2024
- Winbond Electronics Corp.
- Noriaki Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,887,935
- Issue date Jan 30, 2024
- Renesas Electronics Corporation
- Takehiro Ueda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND DEVICES RELATED TO RADIO FREQUENCY DEVICES
- Publication number 20240145253
- Publication date May 2, 2024
- Infineon Technologies Dresden GmbH & Co., KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND PO...
- Publication number 20240145363
- Publication date May 2, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vivek SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME
- Publication number 20240136203
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light Emitting Structure
- Publication number 20240136345
- Publication date Apr 25, 2024
- Apple Inc.
- John A. Higginson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURIN...
- Publication number 20240136310
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passive Device Dies With Measurement Structures
- Publication number 20240128261
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Chiang KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING MATERIAL FOR COMPOUNDS HAVING NON-STOICHIOMETRIC COMPOSITIO...
- Publication number 20240128144
- Publication date Apr 18, 2024
- THE UNIVERSITY OF TOKYO
- Junichi TAKEYA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128218
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND TOOL FOR FILM DEPOSITION
- Publication number 20240128078
- Publication date Apr 18, 2024
- NANYA TECHNOLOGY CORPORATION
- JI-FENG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FILM DEPOSITION
- Publication number 20240128077
- Publication date Apr 18, 2024
- NANYA TECHNOLOGY CORPORATION
- JI-FENG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Efficient Integration of a First Substrate without Solder Bumps wit...
- Publication number 20240128209
- Publication date Apr 18, 2024
- Newport Fab, LLC dba Tower Semiconductor Newport Beach
- Edward Preisler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DIE AND SEMICONDUCTOR DEVICE THEREOF
- Publication number 20240128123
- Publication date Apr 18, 2024
- Magnachip Semiconductor, Ltd.
- Jin Won JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microfluidic Channels for Cooling Hybrid Bonded Interfaces
- Publication number 20240128156
- Publication date Apr 18, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240128175
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Hyungsun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Diode Device and Method of Manufacturing the Same
- Publication number 20240128381
- Publication date Apr 18, 2024
- DIODES INCORPORATED
- Ching Chiu TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20240120264
- Publication date Apr 11, 2024
- DENSO CORPORATION
- Kenichiro TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME
- Publication number 20240113215
- Publication date Apr 4, 2024
- UNITED MICROELECTRONICS CORP.
- Po-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240113089
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, PREPARATION METHOD THEREFOR AND MEMORY
- Publication number 20240096700
- Publication date Mar 21, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR OPERATING THE SAME
- Publication number 20240096726
- Publication date Mar 21, 2024
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Haohua MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240096827
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD...
- Publication number 20240096845
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH MOBILITY TRANSISTOR ELEMENT RESULTING FROM IGTO OXIDE SEMICOND...
- Publication number 20240088270
- Publication date Mar 14, 2024
- IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
- Jae Kyeong JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICES AND METHODS OF FABRICATION
- Publication number 20240088120
- Publication date Mar 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POLYMER LAYER
- Publication number 20240071976
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE
- Publication number 20240071909
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240063030
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED SEMICONDUCTOR DIES
- Publication number 20240055313
- Publication date Feb 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd WYANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MESA DEVICE WITH STACK THIN FILM PASSIVATION
- Publication number 20240055312
- Publication date Feb 15, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Glenda Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE HAVING GRAPHENE LA...
- Publication number 20240047400
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS

the coating being directly applied to the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having via protective layer

Power semiconductor device, packaging structure, and electronic device

Semiconductor package structure and method of manufacturing the same

Semiconductor structure, high electron mobility transistor and fabr...

RF devices with enhanced performance and methods of forming the same

RF devices with nanotube particles for enhanced performance and met...

Semiconductor structure

Monolithic humidity sensor devices and methods of manufacture

Methods and devices related to radio frequency devices

Thermal dissipation in semiconductor devices

Passivation scheme design for wafer singulation

Electronic component built-in wiring board and method for manufactu...

Semiconductor device and method for manufacturing the same

Relating to passivation layers

Group III nitride-based transistor device having a field plate

Glass and melt solder for the passivation of semiconductor components

Method of fabricating high electron mobility transistor

Package structure and method of forming the same

Silicon-on-insulator with crystalline silicon oxide

Vertical memory devices and methods of manufacturing the same

Stacked devices and methods of fabrication

Display panel and display device

Apparatus having a functional structure delimited by a frame struct...

Power module with press-fit contacts

Nanosheet transistor

Method for forming photonic integrated package

Semiconductor memory device and method for fabricating the semicond...

Apparatus including integrated segments and methods of manufacturin...

Semiconductor device with capacitor contact surrounded by conductiv...

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

METHODS AND DEVICES RELATED TO RADIO FREQUENCY DEVICES

FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND PO...

PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME

Light Emitting Structure

APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURIN...

Passive Device Dies With Measurement Structures

SEALING MATERIAL FOR COMPOUNDS HAVING NON-STOICHIOMETRIC COMPOSITIO...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD AND TOOL FOR FILM DEPOSITION

SEMICONDUCTOR DEVICE AND A METHOD FOR FILM DEPOSITION

Efficient Integration of a First Substrate without Solder Bumps wit...

METHOD FOR FORMING SEMICONDUCTOR DIE AND SEMICONDUCTOR DEVICE THEREOF

Microfluidic Channels for Cooling Hybrid Bonded Interfaces

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Power Diode Device and Method of Manufacturing the Same

ELECTRONIC APPARATUS

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE, PREPARATION METHOD THEREFOR AND MEMORY

NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR OPERATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD

CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD...

HIGH MOBILITY TRANSISTOR ELEMENT RESULTING FROM IGTO OXIDE SEMICOND...

STACKED DEVICES AND METHODS OF FABRICATION

SEMICONDUCTOR DEVICE WITH A POLYMER LAYER

SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

COATED SEMICONDUCTOR DIES

MESA DEVICE WITH STACK THIN FILM PASSIVATION

SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE HAVING GRAPHENE LA...