the conductive materials containing organic materials or pastes

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H01L23/49883

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49883the conductive materials containing organic materials or pastes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,125,789
- Issue date Oct 22, 2024
- Micron Technology, Inc.
- Shigeru Sugioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside interconnection interface die for integrated circuits package
- Patent number 12,051,679
- Issue date Jul 30, 2024
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier structure connectable by electrically conductive...
- Patent number 12,009,315
- Issue date Jun 11, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Abderrazzaq Ifis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3-d printed devices formed with magnetic inks and methods of making...
- Patent number 11,845,219
- Issue date Dec 19, 2023
- Massachusetts Institute of Technology
- Theodore H. Fedynyshyn
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
3D printed ceramic structure with metal traces
- Patent number 11,756,799
- Issue date Sep 12, 2023
- HRL Laboratories, LLC
- Tobias Schaedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additively manufacturing fluorine-containing polymers
- Patent number 11,731,346
- Issue date Aug 22, 2023
- Honeywell Federal Manufacturing & Technologies, LLC
- Thomas Matthew Selter
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of fabricating a glass substrate with a plurality of vias
- Patent number 11,646,246
- Issue date May 9, 2023
- Samtec, Inc.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate with mixed pitch wiring
- Patent number 11,527,462
- Issue date Dec 13, 2022
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual sided thermal management solutions for integrated circuit pack...
- Patent number 11,460,499
- Issue date Oct 4, 2022
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,456,253
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Shigeru Sugioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filling materials and methods of filling through holes of a substrate
- Patent number 11,251,109
- Issue date Feb 15, 2022
- Samtec, Inc.
- Tim Mobley
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Printed electronics
- Patent number 11,161,996
- Issue date Nov 2, 2021
- E2IP TECHNOLOGIES INC.
- Xiangyang Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor structure employing conductive paste on lead frame
- Patent number 11,133,246
- Issue date Sep 28, 2021
- Vanguard International Semiconductor Corporation
- Chih-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices, corresponding device...
- Patent number 10,879,143
- Issue date Dec 29, 2020
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prepreg, printed circuit board, semiconductor package, and method f...
- Patent number 10,856,423
- Issue date Dec 1, 2020
- SHOWA DENKO MATERIALS CO., LTD.
- Yuji Tosaka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laminate and circuit board
- Patent number 10,849,231
- Issue date Nov 24, 2020
- Toppan Forms Co., Ltd.
- Akihito Mori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic component device
- Patent number 10,804,196
- Issue date Oct 13, 2020
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density chip-to-chip interconnection with silicon bridge
- Patent number 10,784,202
- Issue date Sep 22, 2020
- International Business Machines Corporation
- Francois Arguin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid crystal panel, method for fabricating thereof and display ap...
- Patent number 10,606,135
- Issue date Mar 31, 2020
- HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yung-jui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing of multi-layer circuits
- Patent number 10,446,412
- Issue date Oct 15, 2019
- PRINTCB LTD.
- Yiftah Karni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible micro-module
- Patent number 10,438,895
- Issue date Oct 8, 2019
- American Semiconductor, Inc.
- Douglas R. Hackler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin fluxed solder paste, and mount structure
- Patent number 10,440,834
- Issue date Oct 8, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirohisa Hino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal/two-dimensional nanomaterial hybrid conductive film and metho...
- Patent number 10,421,123
- Issue date Sep 24, 2019
- Korea Electrotechnology Research Institute
- Hee Jin Jeong
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Paste material, wiring member formed from the paste material, and e...
- Patent number 10,392,518
- Issue date Aug 27, 2019
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and method of manufacturing the same
- Patent number 10,362,672
- Issue date Jul 23, 2019
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reactively assisted ink for printed electronic circuits
- Patent number 10,308,828
- Issue date Jun 4, 2019
- The Charles Stark Draper Laboratory, Inc.
- Gregory M. Fritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reactively assisted ink for printed electronic circuits
- Patent number 10,240,058
- Issue date Mar 26, 2019
- The Charles Stark Draper Laboratory, Inc.
- Gregory M. Fritz
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Smart card module, smart card, and method for producing a smart car...
- Patent number 10,198,684
- Issue date Feb 5, 2019
- Infineon Technologies AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wire bonded electronic devices to round wire
- Patent number 10,172,240
- Issue date Jan 1, 2019
- Automated Assembly Corporation
- Robert Neuman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible interconnects, systems, and uses thereof
- Patent number 10,064,270
- Issue date Aug 28, 2018
- North Carolina State University
- Jesse S. Jur
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
3D Stacking Structure and Method of Fabricating the Same
- Publication number 20240282686
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILD UP MATERIAL ARCHITECTURE FOR MICROELECTRONIC PACKAGE DEVICE
- Publication number 20240006296
- Publication date Jan 4, 2024
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230144364
- Publication date May 11, 2023
- KOA Corporation
- Yasushi AKAHANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230062318
- Publication date Mar 2, 2023
- RENESAS ELECTRONICS CORPORATION
- Tatsuaki TSUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230011222
- Publication date Jan 12, 2023
- Micron Technology, Inc.
- Shigeru Sugioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE Z-DISAGGREGATION WITH LIQUID METAL INTERCONNECTS
- Publication number 20220399263
- Publication date Dec 15, 2022
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHICALLY DEFINED ELECTRICAL INTERCONNECTS FROM CONDUCTIVE P...
- Publication number 20220336341
- Publication date Oct 20, 2022
- ORMET CIRCUITS, INC.
- Catherine A. SHEARER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Interconnection Interface Die For Integrated Circuits Package
- Publication number 20220189934
- Publication date Jun 16, 2022
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Structure Connectable by Electrically Conductive...
- Publication number 20220068838
- Publication date Mar 3, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
- Publication number 20220059436
- Publication date Feb 24, 2022
- SAMTEC, INC.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20210351133
- Publication date Nov 11, 2021
- Micron Technology, Inc.
- Shigeru Sugioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE EMPLOYING CONDUCTIVE PASTE ON LEAD FRAME
- Publication number 20210305143
- Publication date Sep 30, 2021
- Vanguard International Semiconductor Corporation
- Chih-Yen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT TECHNOLOGY RELIABILITY MONITORING SYSTEM
- Publication number 20210282272
- Publication date Sep 9, 2021
- BAE Systems Controls Inc.
- Kevin E. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE WITH MIXED PITCH WIRING
- Publication number 20210183753
- Publication date Jun 17, 2021
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER PASTE COMPOSITION FOR CONFIGURABLE SINTERED INTERCONNECT AND...
- Publication number 20210024766
- Publication date Jan 28, 2021
- EoPlex Limited
- Joe CHOU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
- Publication number 20190322572
- Publication date Oct 24, 2019
- Samtec Inc.
- Tim MOBLEY
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
PRINTED ELECTRONICS
- Publication number 20190284422
- Publication date Sep 19, 2019
- GGI INTERNATIONAL
- Xiangyang LIU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HIGH-DENSITY CHIP-TO-CHIP INTERCONNECTION WITH SILICON BRIDGE
- Publication number 20190172787
- Publication date Jun 6, 2019
- International Business Machines Corporation
- Francois Arguin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREPREG, PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD F...
- Publication number 20190021175
- Publication date Jan 17, 2019
- Hitachi Chemical Company, Ltd.
- Yuji TOSAKA
- B32 - LAYERED PRODUCTS
Information Patent Application
STRUCTURAL BODY AND METHOD FOR MANUFACTURING SAME
- Publication number 20170347451
- Publication date Nov 30, 2017
- DAI NIPPON PRINTING CO., LTD.
- Masaaki ASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURAL BODY AND METHOD FOR MANUFACTURING SAME
- Publication number 20170181280
- Publication date Jun 22, 2017
- DAI NIPPON PRINTING CO., LTD.
- Masaaki ASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY THAT INCLUDES STACKED ELECTRONIC DEVICES
- Publication number 20160225707
- Publication date Aug 4, 2016
- Huiyang FEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD DESIGN FOR RELIABILITY ENHANCEMENT IN PACKAGES
- Publication number 20150364404
- Publication date Dec 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS
- Publication number 20150357304
- Publication date Dec 10, 2015
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND STRUCTURE
- Publication number 20150262965
- Publication date Sep 17, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD AND C...
- Publication number 20140370310
- Publication date Dec 18, 2014
- Applied Nanotech Holdings, Inc.
- Yuichi Kawato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WIRING DEVICE FOR SEMICONDUCTOR DEVICE, COMPOSITE WIRING DEVICE FOR...
- Publication number 20140299995
- Publication date Oct 9, 2014
- DAI NIPPON PRINTING CO., LTD.
- Susumu Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140284795
- Publication date Sep 25, 2014
- SK HYNIX INC.
- Sang Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERFORMANCE OF CONDUCTIVE COPPER PASTE USING COPPER FLAKE
- Publication number 20140287158
- Publication date Sep 25, 2014
- Intrinsiq Materials, Inc.
- Janet Heyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD
- Publication number 20140248741
- Publication date Sep 4, 2014
- Amir Wagiman
- H01 - BASIC ELECTRIC ELEMENTS

the conductive materials containing organic materials or pastes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of forming the same

Backside interconnection interface die for integrated circuits package

Component carrier structure connectable by electrically conductive...

3-d printed devices formed with magnetic inks and methods of making...

3D printed ceramic structure with metal traces

Additively manufacturing fluorine-containing polymers

Method of fabricating a glass substrate with a plurality of vias

Circuit substrate with mixed pitch wiring

Dual sided thermal management solutions for integrated circuit pack...

Semiconductor device and method of forming the same

Filling materials and methods of filling through holes of a substrate

Printed electronics

Semiconductor structure employing conductive paste on lead frame

Method of manufacturing semiconductor devices, corresponding device...

Prepreg, printed circuit board, semiconductor package, and method f...

Laminate and circuit board

Electronic component device

High-density chip-to-chip interconnection with silicon bridge

Liquid crystal panel, method for fabricating thereof and display ap...

Printing of multi-layer circuits

Flexible micro-module

Resin fluxed solder paste, and mount structure

Metal/two-dimensional nanomaterial hybrid conductive film and metho...

Paste material, wiring member formed from the paste material, and e...

Resin multilayer substrate and method of manufacturing the same

Reactively assisted ink for printed electronic circuits

Reactively assisted ink for printed electronic circuits

Smart card module, smart card, and method for producing a smart car...

Wire bonded electronic devices to round wire

Flexible interconnects, systems, and uses thereof

Patents Applicationslast 30 patents

3D Stacking Structure and Method of Fabricating the Same

BUILD UP MATERIAL ARCHITECTURE FOR MICROELECTRONIC PACKAGE DEVICE

ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

PACKAGE SUBSTRATE Z-DISAGGREGATION WITH LIQUID METAL INTERCONNECTS

LITHOGRAPHICALLY DEFINED ELECTRICAL INTERCONNECTS FROM CONDUCTIVE P...

Backside Interconnection Interface Die For Integrated Circuits Package

Component Carrier Structure Connectable by Electrically Conductive...

FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE EMPLOYING CONDUCTIVE PASTE ON LEAD FRAME

SURFACE MOUNT TECHNOLOGY RELIABILITY MONITORING SYSTEM

CIRCUIT SUBSTRATE WITH MIXED PITCH WIRING

SILVER PASTE COMPOSITION FOR CONFIGURABLE SINTERED INTERCONNECT AND...

FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE

PRINTED ELECTRONICS

HIGH-DENSITY CHIP-TO-CHIP INTERCONNECTION WITH SILICON BRIDGE

PREPREG, PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD F...

STRUCTURAL BODY AND METHOD FOR MANUFACTURING SAME

STRUCTURAL BODY AND METHOD FOR MANUFACTURING SAME

ELECTRONIC ASSEMBLY THAT INCLUDES STACKED ELECTRONIC DEVICES

PAD DESIGN FOR RELIABILITY ENHANCEMENT IN PACKAGES

FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS

WIRE BONDING METHOD AND STRUCTURE

COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD AND C...

WIRING DEVICE FOR SEMICONDUCTOR DEVICE, COMPOSITE WIRING DEVICE FOR...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PERFORMANCE OF CONDUCTIVE COPPER PASTE USING COPPER FLAKE

PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD