the connected bonding areas being not aligned with respect to each other

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/08121the connected bonding areas being not aligned with respect to each other

Industries

Patents Grantslast 30 patents

Information Patent Grant
Packaged multi-chip semiconductor devices and methods of fabricatin...
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- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
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- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Metal-dielectric bonding method and structure
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- Issue date May 7, 2024
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
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- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat metal features for microelectronics applications
- Patent number 11,908,739
- Issue date Feb 20, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding alignment marks at bonding interface
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- Issue date Jan 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
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- Issue date Oct 24, 2023
- Yangtze Memory Technologies Co., Ltd.
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Semiconductor device, manufacturing method, solid state image senso...
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Semiconductor device, method of manufacturing semiconductor device,...
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- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
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- Issue date Jun 6, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System on integrated chips and methods of forming same
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- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
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Information Patent Grant
Packaged multi-chip semiconductor devices and methods of fabricatin...
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Information Patent Grant
Metal-dielectric bonding method and structure
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
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- Invensas LLC
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,335,656
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding alignment marks at bonding in interface
- Patent number 11,289,422
- Issue date Mar 29, 2022
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 11,282,802
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,264,345
- Issue date Mar 1, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective recess of interconnects for probing hybrid bond devices
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- Issue date Nov 30, 2021
- Intel Corporation
- Brennen K. Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and imaging device
- Patent number 11,069,735
- Issue date Jul 20, 2021
- Sony Corporation
- Kengo Kotoo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,069,658
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
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- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,985,102
- Issue date Apr 20, 2021
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 10,950,637
- Issue date Mar 16, 2021
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment, before the bonding of a mixed Cu-oxide surface, by a pla...
- Patent number 10,910,782
- Issue date Feb 2, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Laurent Vandroux
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bonded structures
- Patent number 10,879,207
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure of three-dimensional chip stacking
- Patent number 10,867,985
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat metal features for microelectronics applications
- Patent number 10,840,135
- Issue date Nov 17, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL
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- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Pawel Mrozek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20240379600
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-FA CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD DISPOSED BETWEEN C...
- Publication number 20240355858
- Publication date Oct 24, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Takayuki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD
- Publication number 20240355765
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- OMNIVISION TECHNOLOGIES, INC.
- Takayuki Goto
- H01 - BASIC ELECTRIC ELEMENTS
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CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
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- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
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ELECTRICAL CONNECTION AND FORMING METHOD THEREOF
- Publication number 20240234351
- Publication date Jul 11, 2024
- National Yang Ming Chiao Tung University
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES
- Publication number 20240194657
- Publication date Jun 13, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
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PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLAS...
- Publication number 20240178207
- Publication date May 30, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
- Publication number 20240153898
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Minseung JI
- H01 - BASIC ELECTRIC ELEMENTS
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ELECTRICAL CONNECTION AND FORMING METHOD THEREOF
- Publication number 20240136313
- Publication date Apr 25, 2024
- National Yang Ming Chiao Tung University
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
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SHIFTED MULTI-VIA CONNECTION FOR HYBRID BONDING
- Publication number 20240120312
- Publication date Apr 11, 2024
- TOKYO ELECTRON LIMITED
- Kevin Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20240096821
- Publication date Mar 21, 2024
- KIOXIA Corporation
- Kenta SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240079362
- Publication date Mar 7, 2024
- SK HYNIX INC.
- Jin Won PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH VOLUMETRICALLY-EXPANDED SIDE-CONNECTED IN...
- Publication number 20240071970
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE ARCHITECTURE FOR QUASI-MONOLITHIC CHIP WITH BACKSIDE POWER
- Publication number 20240063120
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE OF LARGE DIES USING QUASI-MONOLITHIC CHIP LAYERS
- Publication number 20240063132
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240063152
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Jyun Yang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...
- Publication number 20240063091
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240055406
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Yeongseon Kim
- H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE ARCHITECTURE WITH COMPUTE BRICKS HAVING VERTICALLY STACKED...
- Publication number 20240006375
- Publication date Jan 4, 2024
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20230402411
- Publication date Dec 14, 2023
- SONY GROUP CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230378110
- Publication date Nov 23, 2023
- Samsung Electronics Co., Ltd.
- MINKI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE DIRECT BONDING
- Publication number 20230361074
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
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- Sony Semiconductor Solutions Corporation
- YOSHIYA HAGIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20230361072
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INDUCTORS FOR HYBRID BONDING INTERCONNECT ARCHITECTURES
- Publication number 20230299123
- Publication date Sep 21, 2023
- Intel Corporation
- Qiang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20230268300
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ROUTING STRUCTURE FOR STACKED WAFERS
- Publication number 20230260942
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...
- Publication number 20230163088
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
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SEMICONDUCTOR PACKAGES
- Publication number 20230163089
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS

the connected bonding areas being not aligned with respect to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Packaged multi-chip semiconductor devices and methods of fabricatin...

Bonded structures

Metal-dielectric bonding method and structure

Semiconductor device and method of manufacturing

Flat metal features for microelectronics applications

Bonding alignment marks at bonding interface

Conductive barrier direct hybrid bonding

Metal-dielectric bonding method and structure

Semiconductor device, manufacturing method, solid state image senso...

Semiconductor device, method of manufacturing semiconductor device,...

Bonded structures

System on integrated chips and methods of forming same

Semiconductor device, fabrication method for a semiconductor device...

Packaged multi-chip semiconductor devices and methods of fabricatin...

Metal-dielectric bonding method and structure

Capacitive coupling in a direct-bonded interface for microelectroni...

Semiconductor device and method of manufacturing

Bonding alignment marks at bonding in interface

Semiconductor device structure and method for forming the same

Conductive barrier direct hybrid bonding

Selective recess of interconnects for probing hybrid bond devices

Semiconductor device and imaging device

System on integrated chips and methods of forming same

Semiconductor structure and method for manufacturing the same

Semiconductor device, fabrication method for a semiconductor device...

Semiconductor device, manufacturing method, solid state image senso...

Treatment, before the bonding of a mixed Cu-oxide surface, by a pla...

Bonded structures

Method and structure of three-dimensional chip stacking

Flat metal features for microelectronics applications

Patents Applicationslast 30 patents

DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD DISPOSED BETWEEN C...

STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

ELECTRICAL CONNECTION AND FORMING METHOD THEREOF

INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES

PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLAS...

SEMICONDUCTOR PACKAGE

ELECTRICAL CONNECTION AND FORMING METHOD THEREOF

SHIFTED MULTI-VIA CONNECTION FOR HYBRID BONDING

SEMICONDUCTOR STORAGE DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH VOLUMETRICALLY-EXPANDED SIDE-CONNECTED IN...

PACKAGE ARCHITECTURE FOR QUASI-MONOLITHIC CHIP WITH BACKSIDE POWER

PACKAGE ARCHITECTURE OF LARGE DIES USING QUASI-MONOLITHIC CHIP LAYERS

HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES

THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE ARCHITECTURE WITH COMPUTE BRICKS HAVING VERTICALLY STACKED...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

LOW TEMPERATURE DIRECT BONDING

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

BONDED STRUCTURES

INDUCTORS FOR HYBRID BONDING INTERCONNECT ARCHITECTURES

BONDED STRUCTURES

BOND ROUTING STRUCTURE FOR STACKED WAFERS

PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...

SEMICONDUCTOR PACKAGES