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SEMICONDUCTOR PACKAGE
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Publication number 20240153898
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Publication date May 9, 2024
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Samsung Electronics Co., Ltd.
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Minseung JI
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR STORAGE DEVICE
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Publication number 20240096821
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Publication date Mar 21, 2024
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KIOXIA Corporation
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Kenta SASAKI
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240079362
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Publication date Mar 7, 2024
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SK HYNIX INC.
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Jin Won PARK
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H01 - BASIC ELECTRIC ELEMENTS
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-
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LOW TEMPERATURE DIRECT BONDING
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Publication number 20230361074
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Publication date Nov 9, 2023
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Cyprian Emeka Uzoh
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H01 - BASIC ELECTRIC ELEMENTS
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BONDED STRUCTURES
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Publication number 20230361072
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Publication date Nov 9, 2023
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Liang Wang
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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BONDED STRUCTURES
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Publication number 20230268300
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Publication date Aug 24, 2023
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Cyprian Emeka Uzoh
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGES
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Publication number 20230163089
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Publication date May 25, 2023
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Samsung Electronics Co., Ltd.
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Minki Kim
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H01 - BASIC ELECTRIC ELEMENTS
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STACKED ELECTRONIC DEVICES
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Publication number 20230142680
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Publication date May 11, 2023
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Gabriel Z. Guevara
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package
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Publication number 20230056755
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Publication date Feb 23, 2023
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Tienchien Cheng
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H01 - BASIC ELECTRIC ELEMENTS
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