TREA

the connection portion being formed only on the surface of the substrate opposite to the die mounting surface

Follow

Industry

  • CPC
  • H01L2924/1531
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1531the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
Industries