the connector being orthogonal to a side surface of the semiconductor or solid-state body

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/40106the connector being orthogonal to a side surface of the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,990,455
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Hiroyuki Sakairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of electrical components and method of producing the same
- Patent number 11,855,035
- Issue date Dec 26, 2023
- TDK Corporation
- Yohei Hirota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,557,564
- Issue date Jan 17, 2023
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,309,274
- Issue date Apr 19, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Yoshihiro Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of electrical components and method of producing the same
- Patent number 11,088,106
- Issue date Aug 10, 2021
- TDK Corporation
- Yohei Hirota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with space efficient lead and die pad design
- Patent number 11,069,600
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered conductive matrix material on wire bond
- Patent number 9,905,502
- Issue date Feb 27, 2018
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die power converter
- Patent number 9,842,797
- Issue date Dec 12, 2017
- Texas Instruments Incorporated
- Brian A. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack structure using conductive film bridge adhesive technology
- Patent number 9,553,073
- Issue date Jan 24, 2017
- Lingsen Precision Industries, Ltd.
- Chien-Ko Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly and process with sintering material on metal bumps
- Patent number 9,443,822
- Issue date Sep 13, 2016
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor strip with contact areas having cutouts
- Patent number 9,406,592
- Issue date Aug 2, 2016
- Continental Automotive GmbH
- Nico Kohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,397,030
- Issue date Jul 19, 2016
- NSK Ltd.
- Takashi Sunaga
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,337,129
- Issue date May 10, 2016
- Rohm Co., Ltd.
- Koji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling assembly of power semiconductor device and PCB and method...
- Patent number 9,165,856
- Issue date Oct 20, 2015
- LSIS Co., Ltd.
- Bohyun Youn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip assembly and process with sintering material on metal bumps
- Patent number 9,117,811
- Issue date Aug 25, 2015
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic Power Converter Package with Through Substrate vias
- Patent number 8,901,742
- Issue date Dec 2, 2014
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally efficient integrated circuit package
- Patent number 8,716,830
- Issue date May 6, 2014
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip semiconductor device
- Patent number 8,669,650
- Issue date Mar 11, 2014
- Alpha & Omega Semiconductor, Inc.
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-spring chip attachment using ribbon bonds
- Patent number 8,614,514
- Issue date Dec 24, 2013
- Palo Alto Research Center Incorporated
- Vernon Powers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor component and structure th...
- Patent number 8,582,317
- Issue date Nov 12, 2013
- Semiconductor Components Industries, LLC
- Yenting Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 8,451,621
- Issue date May 28, 2013
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector assembly and method of manufacture
- Patent number 8,449,339
- Issue date May 28, 2013
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME
- Publication number 20240105703
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jaehyun Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220320054
- Publication date Oct 6, 2022
- Rohm Co., Ltd.
- Hiroyuki SAKAIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK OF ELECTRICAL COMPONENTS AND METHOD OF PRODUCING THE SAME
- Publication number 20210327846
- Publication date Oct 21, 2021
- TDK Corporation
- Yohei HIROTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210217721
- Publication date Jul 15, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20210202429
- Publication date Jul 1, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yoshihiro KAMIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK OF ELECTRICAL COMPONENTS AND METHOD OF PRODUCING THE SAME
- Publication number 20200118963
- Publication date Apr 16, 2020
- TDK Corporation
- Yohei HIROTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT AND METHOD FOR PRODUCING THE SEMICONDUCTOR CI...
- Publication number 20150357303
- Publication date Dec 10, 2015
- CONTINENTAL AUTOMOTIVE GMBH
- Nico Kohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140291828
- Publication date Oct 2, 2014
- Rohm Co., Ltd.
- Koji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
- Publication number 20140264611
- Publication date Sep 18, 2014
- Semiconductor Components Industries, LLC
- Kisun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Manufacturing Method Thereof
- Publication number 20140252576
- Publication date Sep 11, 2014
- Hitachi, Ltd
- Hisashi Tanie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLING ASSEMBLY OF POWER SEMICONDUCTOR DEVICE AND PCB AND METHOD...
- Publication number 20140070387
- Publication date Mar 13, 2014
- LSIS CO., LTD
- Bohyun YOUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE POWER CONVERTER
- Publication number 20140061884
- Publication date Mar 6, 2014
- Brian A. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Monolithic Power Converter Package with Through Substrate Vias
- Publication number 20130256905
- Publication date Oct 3, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY EFFICIENT INTEGRATED CIRCUIT PACKAGE
- Publication number 20130127008
- Publication date May 23, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS
- Publication number 20120313239
- Publication date Dec 13, 2012
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SEMICONDUCTOR DEVICE
- Publication number 20120248539
- Publication date Oct 4, 2012
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE POWER CONVERTER
- Publication number 20120228696
- Publication date Sep 13, 2012
- TEXAS INSTRUMENTS INCORPORATED
- BRIAN ASHLEY CARPENTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURE
- Publication number 20120064781
- Publication date Mar 15, 2012
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
- Publication number 20120063107
- Publication date Mar 15, 2012
- Shutesh Krishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE TH...
- Publication number 20110292632
- Publication date Dec 1, 2011
- Yenting Wen
- H01 - BASIC ELECTRIC ELEMENTS

the connector being orthogonal to a side surface of the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Stack of electrical components and method of producing the same

Semiconductor device

Electronic module

Stack of electrical components and method of producing the same

Semiconductor package with space efficient lead and die pad design

Sintered conductive matrix material on wire bond

Stacked die power converter

Chip stack structure using conductive film bridge adhesive technology

Flip chip assembly and process with sintering material on metal bumps

Conductor strip with contact areas having cutouts

Semiconductor module

Semiconductor device and method of manufacturing the same

Coupling assembly of power semiconductor device and PCB and method...

Flip chip assembly and process with sintering material on metal bumps

Monolithic Power Converter Package with Through Substrate vias

Thermally efficient integrated circuit package

Flip chip semiconductor device

Micro-spring chip attachment using ribbon bonds

Method for manufacturing a semiconductor component and structure th...

Semiconductor component and method of manufacture

Connector assembly and method of manufacture

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME

SEMICONDUCTOR DEVICE

STACK OF ELECTRICAL COMPONENTS AND METHOD OF PRODUCING THE SAME

SEMICONDUCTOR DEVICE

ELECTRONIC MODULE

STACK OF ELECTRICAL COMPONENTS AND METHOD OF PRODUCING THE SAME

SEMICONDUCTOR CIRCUIT AND METHOD FOR PRODUCING THE SEMICONDUCTOR CI...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Semiconductor Device and Manufacturing Method Thereof

COUPLING ASSEMBLY OF POWER SEMICONDUCTOR DEVICE AND PCB AND METHOD...

STACKED DIE POWER CONVERTER

Monolithic Power Converter Package with Through Substrate Vias

THERMALLY EFFICIENT INTEGRATED CIRCUIT PACKAGE

FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS

FLIP CHIP SEMICONDUCTOR DEVICE

STACKED DIE POWER CONVERTER

CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE TH...