the connector being supplied to the parts to be connected in the bonding apparatus

Industry

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/851the connector being supplied to the parts to be connected in the bonding apparatus

Industries

Patents Grantslast 30 patents

Information Patent Grant
In-process wire bond testing using wire bonding apparatus
- Patent number 12,148,730
- Issue date Nov 19, 2024
- Atieva, Inc.
- Ben Carlson-Sypek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for tool mark free stitch bonding
- Patent number 12,142,595
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Aldrin Quinones Garing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding device, wire cutting method and non-transitory compute...
- Patent number 12,107,067
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packages with electrical fuses
- Patent number 12,009,336
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Mahmud Halim Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, wire bonding structure, semic...
- Patent number 11,876,066
- Issue date Jan 16, 2024
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for electrically connecting contact surfaces of electronic...
- Patent number 11,791,309
- Issue date Oct 17, 2023
- HERAEUS MATERIALS SINGAPORE PTE. LTD.
- Yean Mee Pun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode chip with electrical overstress protection
- Patent number 11,508,715
- Issue date Nov 22, 2022
- CreeLED, Inc.
- Daniel E. Stasiw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for optimizing looping parameters and looping t...
- Patent number 11,495,570
- Issue date Nov 8, 2022
- Kulicke and Soffa Industries, Inc.
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having an electrical connection between semico...
- Patent number 11,417,625
- Issue date Aug 16, 2022
- Murata Manufacturing Co., Ltd.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for linearly moving movable body relative to o...
- Patent number 11,410,866
- Issue date Aug 9, 2022
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and wire bonding device
- Patent number 11,404,393
- Issue date Aug 2, 2022
- Kaijo Corporation
- Eiji Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for generating wire loop profiles for wire loops, and metho...
- Patent number 11,289,448
- Issue date Mar 29, 2022
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for optimizing looping parameters and looping t...
- Patent number 11,276,666
- Issue date Mar 15, 2022
- Kulicke and Soffa Industries, Inc.
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,189,595
- Issue date Nov 30, 2021
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for positioning first object in relation to secon...
- Patent number 11,139,193
- Issue date Oct 5, 2021
- Shinkawa Ltd.
- Tetsuya Utano
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Wire bonding tool including a wedge tool
- Patent number 11,121,114
- Issue date Sep 14, 2021
- Fuji Electric Co., Ltd.
- Takanori Sugiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices with through silicon vias and package-level c...
- Patent number 11,056,467
- Issue date Jul 6, 2021
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having wires connecting connection pads
- Patent number 11,049,845
- Issue date Jun 29, 2021
- LONGITUDE LICENSING LIMITED
- Takashi Ohba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,024,569
- Issue date Jun 1, 2021
- ADVANCED SEMICONDUCOR ENGINEERING, INC.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire clamp apparatus calibration method and wire bonding apparatus
- Patent number 11,004,822
- Issue date May 11, 2021
- Shinkawa Ltd.
- Yohei Uchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method and wire bonding apparatus
- Patent number 11,004,821
- Issue date May 11, 2021
- Shinkawa Ltd.
- Yusuke Maruya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automatic registration between circuit dies and interconnects
- Patent number 10,971,468
- Issue date Apr 6, 2021
- 3M Innovative Properties Company
- Ankit Mahajan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device
- Patent number 10,903,129
- Issue date Jan 26, 2021
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 10,896,892
- Issue date Jan 19, 2021
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bond clamp design and lead frame capable of engaging with same
- Patent number 10,861,777
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact wirebonding in stacked-chip system in package, and methods...
- Patent number 10,847,450
- Issue date Nov 24, 2020
- Intel Corporation
- Saeed Shojaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,825,758
- Issue date Nov 3, 2020
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 10,818,581
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Toshiyuki Hata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGES WITH ELECTRICAL FUSES
- Publication number 20240332243
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mahmud Halim CHOWDHURY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY FOR STITCH BOND
- Publication number 20240250060
- Publication date Jul 25, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ye Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240234331
- Publication date Jul 11, 2024
- RENESAS ELECTRONICS CORPORATION
- Ryusei TAKAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240178125
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240136302
- Publication date Apr 25, 2024
- RENESAS ELECTRONICS CORPORATION
- Ryusei TAKAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20240105672
- Publication date Mar 28, 2024
- SHINKAWA LTD.
- Shigeru HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR P...
- Publication number 20240038720
- Publication date Feb 1, 2024
- SK HYNIX INC.
- Su Ji UM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240030178
- Publication date Jan 25, 2024
- ROHM CO., LTD.
- Yosui FUTAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...
- Publication number 20230420404
- Publication date Dec 28, 2023
- Sony Semiconductor Solutions Corporation
- Yuji HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DETERMINING A HEIGHT, AND A HEIGHT PROFILE, OF A WIRE LO...
- Publication number 20230335532
- Publication date Oct 19, 2023
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECORDING ELEMENT UNIT AND METHOD FOR MANUFACTURING RECORDING ELEME...
- Publication number 20230311498
- Publication date Oct 5, 2023
- Canon Kabushiki Kaisha
- NAOYA TSUKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADED SEMICONDUCTOR PACKAGE WITH LEAD MOLD FLASH REDUCTION
- Publication number 20230275060
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Xiaoling Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PROCESS WIRE BOND TESTING
- Publication number 20230215835
- Publication date Jul 6, 2023
- Atieva, Inc.
- Ben Carlson-Sypek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING DEVICE, WIRE CUTTING METHOD AND NON-TRANSITORY COMPUTE...
- Publication number 20230163097
- Publication date May 25, 2023
- SHINKAWA LTD.
- Hiroaki YOSHINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS MANUFACTURING M...
- Publication number 20230069967
- Publication date Mar 9, 2023
- Fuji Electric Co., Ltd.
- Nobuhiro HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20230049088
- Publication date Feb 16, 2023
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS
- Publication number 20220415821
- Publication date Dec 29, 2022
- SK HYNIX INC.
- Hyun Chul SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STATE DETERMINATION METHOD AND WIRE BONDING STATE DETE...
- Publication number 20220320040
- Publication date Oct 6, 2022
- Yamaha Robotics Holdings Co., Ltd.
- Hiroshi MUNAKATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING
- Publication number 20220199571
- Publication date Jun 23, 2022
- Skyworks Solutions, Inc.
- Aldrin Quinones GARING
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR ELECTRICALLY CONNECTING CONTACT SURFACES OF ELECTRONIC...
- Publication number 20220037284
- Publication date Feb 3, 2022
- Heraeus Materials Singapore Pte. Ltd.
- Yean M. Pun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING METHOD AND WIRE BONDING DEVICE
- Publication number 20210366869
- Publication date Nov 25, 2021
- KAIJO CORPORATION
- Eiji KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN ELECTRICAL CONNECTION BETWEEN SEMICO...
- Publication number 20200411465
- Publication date Dec 31, 2020
- MURATA MANUFACTURING CO., LTD.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR LINEARLY MOVING MOVABLE BODY RELATIVE TO OBJECT
- Publication number 20200411352
- Publication date Dec 31, 2020
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHO...
- Publication number 20200251444
- Publication date Aug 6, 2020
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRAZE BONDED NAIL HEAD LEAD
- Publication number 20200043882
- Publication date Feb 6, 2020
- LUCAS-MILHAUPT, INC.
- Dean W Kick
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190378787
- Publication date Dec 12, 2019
- ROHM CO., LTD.
- Shoji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR OPTIMIZING LOOPING PARAMETERS AND LOOPING T...
- Publication number 20190295983
- Publication date Sep 26, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING METHOD AND WIRE BONDING APPARATUS
- Publication number 20190287941
- Publication date Sep 19, 2019
- SHINKAWA LTD.
- Yusuke MARUYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL ROUTING IN COMPLEX QUANTUM SYSTEMS
- Publication number 20190287946
- Publication date Sep 19, 2019
- International Business Machines Corporation
- Martin O. Sandberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRE CLAMP DEVICE CALIBRATION METHOD AND WIRE BONDING DEVICE
- Publication number 20190279957
- Publication date Sep 12, 2019
- SHINKAWA LTD.
- Yohei UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS

the connector being supplied to the parts to be connected in the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

In-process wire bond testing using wire bonding apparatus

Apparatus and methods for tool mark free stitch bonding

Wire bonding device, wire cutting method and non-transitory compute...

Packages with electrical fuses

Palladium-coated copper bonding wire, wire bonding structure, semic...

Process for electrically connecting contact surfaces of electronic...

Package-on-package assembly with wire bond vias

Light-emitting diode chip with electrical overstress protection

Systems and methods for optimizing looping parameters and looping t...

Semiconductor device having an electrical connection between semico...

Apparatus and method for linearly moving movable body relative to o...

Wire bonding method and wire bonding device

Methods for generating wire loop profiles for wire loops, and metho...

Systems and methods for optimizing looping parameters and looping t...

Package-on-package assembly with wire bond vias

Device and method for positioning first object in relation to secon...

Wire bonding tool including a wedge tool

Semiconductor devices with through silicon vias and package-level c...

Semiconductor device having wires connecting connection pads

Semiconductor package device and method of manufacturing the same

Wire clamp apparatus calibration method and wire bonding apparatus

Wire bonding method and wire bonding apparatus

Automatic registration between circuit dies and interconnects

Electronic device

Wire bonding apparatus

Wire bond clamp design and lead frame capable of engaging with same

Compact wirebonding in stacked-chip system in package, and methods...

Semiconductor device

Semiconductor integrated circuit device

Method of manufacturing semiconductor device and semiconductor device

Patents Applicationslast 30 patents

PACKAGES WITH ELECTRICAL FUSES

CAPILLARY FOR STITCH BOND

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR P...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...

METHODS OF DETERMINING A HEIGHT, AND A HEIGHT PROFILE, OF A WIRE LO...

RECORDING ELEMENT UNIT AND METHOD FOR MANUFACTURING RECORDING ELEME...

LEADED SEMICONDUCTOR PACKAGE WITH LEAD MOLD FLASH REDUCTION

IN-PROCESS WIRE BOND TESTING

WIRE BONDING DEVICE, WIRE CUTTING METHOD AND NON-TRANSITORY COMPUTE...

SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS MANUFACTURING M...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS

WIRE BONDING STATE DETERMINATION METHOD AND WIRE BONDING STATE DETE...

APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING

PROCESS FOR ELECTRICALLY CONNECTING CONTACT SURFACES OF ELECTRONIC...

WIRE BONDING METHOD AND WIRE BONDING DEVICE

SEMICONDUCTOR DEVICE HAVING AN ELECTRICAL CONNECTION BETWEEN SEMICO...

DEVICE AND METHOD FOR LINEARLY MOVING MOVABLE BODY RELATIVE TO OBJECT

METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHO...

BRAZE BONDED NAIL HEAD LEAD

SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR OPTIMIZING LOOPING PARAMETERS AND LOOPING T...

WIRE BONDING METHOD AND WIRE BONDING APPARATUS

SIGNAL ROUTING IN COMPLEX QUANTUM SYSTEMS

WIRE CLAMP DEVICE CALIBRATION METHOD AND WIRE BONDING DEVICE