the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body

Industry

CPC
H01L2224/49113

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/49113the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 12,046,541
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, manufacturing method of solid-state ima...
- Patent number 12,046,619
- Issue date Jul 23, 2024
- Sony Corporation
- Kunihiko Izuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,973,007
- Issue date Apr 30, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,967,543
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including sense insulated-gate bipolar transistor
- Patent number 11,942,531
- Issue date Mar 26, 2024
- Rohm Co., Ltd.
- Akihiro Hikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing electronic components, corresponding electronic...
- Patent number 11,935,818
- Issue date Mar 19, 2024
- STMicroelectronics S.r.l.
- Fabio Marchisi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged LEDs with phosphor films, and associated systems and methods
- Patent number 11,901,494
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- Jonathon G. Greenwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module apparatus, cooling structure, and electric vehicle or...
- Patent number 11,854,937
- Issue date Dec 26, 2023
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method of forming package structure
- Patent number 11,817,437
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,804,478
- Issue date Oct 31, 2023
- Rohm Co., Ltd.
- Yuji Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,728,298
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for measure of quantity and associated method of manufact...
- Patent number 11,719,725
- Issue date Aug 8, 2023
- HALL ELEMENT DEVICES (IP HOLDINGS) LIMITED
- Tomaz Slivnik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,699,641
- Issue date Jul 11, 2023
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 11,658,154
- Issue date May 23, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 11,657,953
- Issue date May 23, 2023
- Rohm Co., Ltd.
- Kosei Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 11,658,100
- Issue date May 23, 2023
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED module
- Patent number 11,605,765
- Issue date Mar 14, 2023
- Rohm Co., Ltd.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip package manufacturing process
- Patent number 11,587,923
- Issue date Feb 21, 2023
- EGALAX_EMPIA TECHNOLOGY INC.
- Po-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,532,537
- Issue date Dec 20, 2022
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,469,204
- Issue date Oct 11, 2022
- Sumitomo Electric Device Innovations, Inc.
- Akitada Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,437,354
- Issue date Sep 6, 2022
- ROHM Co, Ltd.
- Yuji Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED package with multiple element light source and encapsulant havi...
- Patent number 11,424,394
- Issue date Aug 23, 2022
- CreeLED, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,410,941
- Issue date Aug 9, 2022
- Fuji Electric Co., Ltd.
- Satoshi Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for measure of quantity and associated method of manufact...
- Patent number 11,353,482
- Issue date Jun 7, 2022
- HALL ELEMENT DEVICES (IP HOLDINGS) LIMITED
- Tomaz Slivnik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for testing a high voltage transistor with a field plate
- Patent number 11,302,785
- Issue date Apr 12, 2022
- Texas Instruments Incorporated
- Ramana Tadepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wide-bandgap semiconductor device including gate fingers between bo...
- Patent number 11,245,007
- Issue date Feb 8, 2022
- Infineon Technologies AG
- Dethard Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 11,183,444
- Issue date Nov 23, 2021
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of lead frames electrically connected to inductor chip
- Patent number 11,177,198
- Issue date Nov 16, 2021
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming package structure
- Patent number 11,164,852
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347426
- Publication date Oct 17, 2024
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347499
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240332259
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD OF SOLID-STATE IMA...
- Publication number 20240332336
- Publication date Oct 3, 2024
- SONY GROUP CORPORATION
- Kunihiko IZUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY (RF) INTERCONNECT CONFIGURATION FOR SUBSTRATE AND S...
- Publication number 20240297105
- Publication date Sep 5, 2024
- CIENA CORPORATION
- Michael Vitic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES
- Publication number 20240290676
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...
- Publication number 20240282675
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Toshio HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING ELECTRONIC COMPONENTS, CORRESPONDING ELECTRONIC...
- Publication number 20240203834
- Publication date Jun 20, 2024
- STMicroelectronics S.r.l.
- Fabio MARCHISI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED LEDS WITH PHOSPHOR FILMS, AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20240186465
- Publication date Jun 6, 2024
- Micron Technology, Inc.
- Jonathon G. Greenwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRIPS
- Publication number 20240128094
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- CHIH-CHIEN HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240088796
- Publication date Mar 14, 2024
- Fuji Electric Co., Ltd.
- Yuhei NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240014192
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON BONDING GROUND PLANE FOR RADIO FREQUENCY PERFORMANCE IMPROVE...
- Publication number 20230420405
- Publication date Dec 28, 2023
- Lumentum Operations LLC
- Flavio DELL'ORTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230420428
- Publication date Dec 28, 2023
- ROHM CO., LTD.
- Yuji ISHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230343735
- Publication date Oct 26, 2023
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MEASURE OF QUANTITY AND ASSOCIATED METHOD OF MANUFACT...
- Publication number 20230333145
- Publication date Oct 19, 2023
- HALL ELEMENT DEVICES (IP HOLDINGS) LIMITED
- Tomaz SLIVNIK
- G01 - MEASURING TESTING
Information Patent Application
LEADFRAME
- Publication number 20230317567
- Publication date Oct 5, 2023
- Li-Ju Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADED SEMICONDUCTOR PACKAGE WITH LEAD MOLD FLASH REDUCTION
- Publication number 20230275060
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Xiaoling Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230253298
- Publication date Aug 10, 2023
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230163085
- Publication date May 25, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ayuhiko SAITOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE DRIVER PACKAGE FOR UNIFORM COUPLING TO DIFFERENTIAL SIGNAL BON...
- Publication number 20230138570
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Thomas Dyer BONIFIELD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20230052235
- Publication date Feb 16, 2023
- Mitsubishi Electric Corporation
- Yukihiko WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220328464
- Publication date Oct 13, 2022
- ROHM CO., LTD.
- Yuji ISHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MEASURE OF QUANTITY AND ASSOCIATED METHOD OF MANUFACT...
- Publication number 20220252643
- Publication date Aug 11, 2022
- HALL ELEMENT DEVICES (IP HOLDINGS) LIMITED
- Tomaz SLIVNIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT, APPARATUS, AND CHIP
- Publication number 20220238470
- Publication date Jul 28, 2022
- Canon Kabushiki Kaisha
- Junji Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20220059515
- Publication date Feb 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220028763
- Publication date Jan 27, 2022
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210407893
- Publication date Dec 30, 2021
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SENSE INSULATED-GATE BIPOLAR TRANSISTOR
- Publication number 20210391445
- Publication date Dec 16, 2021
- Rohm Co., Ltd.
- Akihiro HIKASA
- H01 - BASIC ELECTRIC ELEMENTS

the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Packaging of a semiconductor device with a plurality of leads

Solid-state imaging device, manufacturing method of solid-state ima...

Power module semiconductor device and inverter equipment, and fabri...

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor device including sense insulated-gate bipolar transistor

Method of producing electronic components, corresponding electronic...

Packaged LEDs with phosphor films, and associated systems and methods

Power module apparatus, cooling structure, and electric vehicle or...

Method of forming package structure

Semiconductor device

Semiconductor device and method for manufacturing the same

Apparatus for measure of quantity and associated method of manufact...

Semiconductor device

Memory devices with controllers under memory packages and associate...

Semiconductor device and semiconductor module

Packaging of a semiconductor device with a plurality of leads

LED module

Multichip package manufacturing process

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor device

Semiconductor device

LED package with multiple element light source and encapsulant havi...

Semiconductor module

Apparatus for measure of quantity and associated method of manufact...

Method for testing a high voltage transistor with a field plate

Wide-bandgap semiconductor device including gate fingers between bo...

Packaging of a semiconductor device with a plurality of leads

Plurality of lead frames electrically connected to inductor chip

Method of forming package structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD OF SOLID-STATE IMA...

RADIO FREQUENCY (RF) INTERCONNECT CONFIGURATION FOR SUBSTRATE AND S...

SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES

POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...

METHOD OF PRODUCING ELECTRONIC COMPONENTS, CORRESPONDING ELECTRONIC...

PACKAGED LEDS WITH PHOSPHOR FILMS, AND ASSOCIATED SYSTEMS AND METHODS

SEMICONDUCTOR DEVICE

INTERCONNECT STRIPS

SEMICONDUCTOR MODULE

PACKAGE STRUCTURE

RIBBON BONDING GROUND PLANE FOR RADIO FREQUENCY PERFORMANCE IMPROVE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

APPARATUS FOR MEASURE OF QUANTITY AND ASSOCIATED METHOD OF MANUFACT...

LEADFRAME

LEADED SEMICONDUCTOR PACKAGE WITH LEAD MOLD FLASH REDUCTION

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

GATE DRIVER PACKAGE FOR UNIFORM COUPLING TO DIFFERENTIAL SIGNAL BON...

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

SEMICONDUCTOR DEVICE

APPARATUS FOR MEASURE OF QUANTITY AND ASSOCIATED METHOD OF MANUFACT...

SEMICONDUCTOR ELEMENT, APPARATUS, AND CHIP

METHOD OF FORMING PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING SENSE INSULATED-GATE BIPOLAR TRANSISTOR