the container being a hollow construction having no base used as a mounting for the semiconductor body

Industry

CPC
H01L23/041

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/041the container being a hollow construction having no base used as a mounting for the semiconductor body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor power module and power conversion device
- Patent number 11,916,001
- Issue date Feb 27, 2024
- Mitsubishi Electric Corporation
- Kozo Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including conductive crack preventing layer
- Patent number 11,862,581
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Ji Eun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded chip package and manufacturing method thereof
- Patent number 11,854,920
- Issue date Dec 26, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,776,892
- Issue date Oct 3, 2023
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protector cap for package with thermal interface material
- Patent number 11,769,701
- Issue date Sep 26, 2023
- Infineon Technologies Austria AG
- Christian Kasztelan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed optically transparent wafer-level packages and...
- Patent number 11,764,117
- Issue date Sep 19, 2023
- Corning Incorporated
- Robert Alan Bellman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure and methods of manufacturing the same
- Patent number 11,658,170
- Issue date May 23, 2023
- Advanced Semiconductor Engineering, Inc.
- Wei Tsung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,587,841
- Issue date Feb 21, 2023
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with elastic coupler and related methods
- Patent number 11,569,140
- Issue date Jan 31, 2023
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising sealing frame configured as a condu...
- Patent number 11,569,142
- Issue date Jan 31, 2023
- Mitsubishi Electric Corporation
- Shinichi Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,538,727
- Issue date Dec 27, 2022
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,417,612
- Issue date Aug 16, 2022
- Samsung Electronics Co., Ltd.
- Ji Eun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens cap for a transistor outline package
- Patent number 11,367,692
- Issue date Jun 21, 2022
- Schott AG
- Robert Hettler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and method for manufacturing same
- Patent number 11,348,849
- Issue date May 31, 2022
- Mitsubishi Electric Corporation
- Takeshi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and amplifier having bonding wire and conducti...
- Patent number 11,342,279
- Issue date May 24, 2022
- Sumitomo Electric Industries, Ltd.
- Ayumu Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,289,456
- Issue date Mar 29, 2022
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding structure and substrate bonding method
- Patent number 11,244,874
- Issue date Feb 8, 2022
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state storage device
- Patent number 11,201,100
- Issue date Dec 14, 2021
- Global Unichip Corporation
- Yu-Ting Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Serially connected computing nodes in a distributed computing system
- Patent number 11,042,211
- Issue date Jun 22, 2021
- Louis Edmund Chall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,037,845
- Issue date Jun 15, 2021
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method of manufacturing the same, an...
- Patent number 11,037,844
- Issue date Jun 15, 2021
- Mitsubishi Electric Corporation
- Satoshi Kondo
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,978,371
- Issue date Apr 13, 2021
- Fuji Electric Co., Ltd.
- Kenshi Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,916,491
- Issue date Feb 9, 2021
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,854,523
- Issue date Dec 1, 2020
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with heat dissipation plate
- Patent number 10,818,573
- Issue date Oct 27, 2020
- Hitachi Automotive Systems, Ltd.
- Nobutake Tsuyuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,811,379
- Issue date Oct 20, 2020
- Samsung Electronics Co., Ltd.
- Doo Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress integrated device packages
- Patent number 10,800,651
- Issue date Oct 13, 2020
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
TIM strain mitigation in electronic modules
- Patent number 10,796,978
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Gerard McVicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,756,030
- Issue date Aug 25, 2020
- Samsung Electronics Co., Ltd.
- Ji Eun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged power device having improved heat dissipation capacity and...
- Patent number 10,756,002
- Issue date Aug 25, 2020
- STMicroelectronics S.r.l.
- Cristiano Gianluca Stella
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CURRENT SENSOR WITH INVERTED SHIELDING ELEMENT
- Publication number 20240145348
- Publication date May 2, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lucas Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240136202
- Publication date Apr 25, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR
- Publication number 20240136238
- Publication date Apr 25, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240087972
- Publication date Mar 14, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063066
- Publication date Feb 22, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230395485
- Publication date Dec 7, 2023
- Kabushiki Kaisha Toshiba
- Tomohiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protector Cap for Package with Thermal Interface Material
- Publication number 20230395442
- Publication date Dec 7, 2023
- Infineon Technologies Austria AG
- Christian Kasztelan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20230253347
- Publication date Aug 10, 2023
- Mitsubishi Electric Corporation
- Ko KANAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230238297
- Publication date Jul 27, 2023
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND VEHICLE
- Publication number 20230223314
- Publication date Jul 13, 2023
- Fuji Electric Co., Ltd.
- Daiki YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP DEVICE
- Publication number 20230197562
- Publication date Jun 22, 2023
- Sunonwealth Electric Machine Industry Co., Ltd.
- Chi-Ting YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230145610
- Publication date May 11, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH SEMICONDUCTIVE THERMAL PEDESTAL
- Publication number 20230051507
- Publication date Feb 16, 2023
- Marvell Asia Pte, Ltd.
- Han Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220392853
- Publication date Dec 8, 2022
- Samsung Electronics Co., Ltd.
- Ji Eun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20220359229
- Publication date Nov 10, 2022
- DENSO CORPORATION
- Tomohito IWASHIGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20220310576
- Publication date Sep 29, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei Tsung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220181303
- Publication date Jun 9, 2022
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210305147
- Publication date Sep 30, 2021
- Kabushiki Kaisha Toshiba
- Tomohiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE HOUSING WITH IMPROVED PROTRUSION DESIGN
- Publication number 20210272874
- Publication date Sep 2, 2021
- LITTELFUSE, INC.
- Thomas Spann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protector Cap for Package with Thermal Interface Material
- Publication number 20210272861
- Publication date Sep 2, 2021
- Christian Kasztelan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND AMPLIFIER
- Publication number 20210249360
- Publication date Aug 12, 2021
- Sumitomo Electric Industries, Ltd.
- Ayumu HONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210183817
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210057295
- Publication date Feb 25, 2021
- Mitsubishi Electric Corporation
- Shinichi Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETICALLY SEALED OPTICALLY TRANSPARENT WAFER-LEVEL PACKAGES AND...
- Publication number 20210028077
- Publication date Jan 28, 2021
- Corning Incorporated
- Robert Alan Bellman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR POWER MODULE AND POWER CONVERSION DEVICE
- Publication number 20200395278
- Publication date Dec 17, 2020
- Mitsubishi Electric Corporation
- Kozo HARADA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200365527
- Publication date Nov 19, 2020
- Samsung Electronics Co., Ltd.
- Ji Eun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING STRUCTURE AND SUBSTRATE BONDING METHOD
- Publication number 20200365473
- Publication date Nov 19, 2020
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200286799
- Publication date Sep 10, 2020
- Mitsubishi Electric Corporation
- Hiroyuki MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ELASTIC COUPLER AND RELATED METHODS
- Publication number 20200194322
- Publication date Jun 18, 2020
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200185285
- Publication date Jun 11, 2020
- Mitsubishi Electric Corporation
- Koichiro NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS

the container being a hollow construction having no base used as a mounting for the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor power module and power conversion device

Semiconductor package including conductive crack preventing layer

Embedded chip package and manufacturing method thereof

Semiconductor device

Protector cap for package with thermal interface material

Hermetically sealed optically transparent wafer-level packages and...

Semiconductor package structure and methods of manufacturing the same

Semiconductor module

Semiconductor package with elastic coupler and related methods

Semiconductor device comprising sealing frame configured as a condu...

Semiconductor module

Semiconductor package

Lens cap for a transistor outline package

Semiconductor apparatus and method for manufacturing same

Semiconductor device and amplifier having bonding wire and conducti...

Semiconductor package

Substrate bonding structure and substrate bonding method

Solid-state storage device

Serially connected computing nodes in a distributed computing system

Semiconductor device and manufacturing method thereof

Power semiconductor device and method of manufacturing the same, an...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor module

Semiconductor device

Power semiconductor module with heat dissipation plate

Semiconductor package

Low stress integrated device packages

TIM strain mitigation in electronic modules

Semiconductor package

Packaged power device having improved heat dissipation capacity and...

Patents Applicationslast 30 patents

CURRENT SENSOR WITH INVERTED SHIELDING ELEMENT

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR

EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES

SEMICONDUCTOR DEVICE

Protector Cap for Package with Thermal Interface Material

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR APPARATUS AND VEHICLE

CHIP DEVICE

EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGE WITH SEMICONDUCTIVE THERMAL PEDESTAL

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

POWER MODULE HOUSING WITH IMPROVED PROTRUSION DESIGN

Protector Cap for Package with Thermal Interface Material

SEMICONDUCTOR DEVICE AND AMPLIFIER

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

HERMETICALLY SEALED OPTICALLY TRANSPARENT WAFER-LEVEL PACKAGES AND...

SEMICONDUCTOR POWER MODULE AND POWER CONVERSION DEVICE

SEMICONDUCTOR PACKAGE

SUBSTRATE BONDING STRUCTURE AND SUBSTRATE BONDING METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH ELASTIC COUPLER AND RELATED METHODS

SEMICONDUCTOR DEVICE