-
-
-
SEMICONDUCTOR PACKAGING STRUCTURE
-
Publication number 20250210477
-
Publication date Jun 26, 2025
-
QUANZHOU SANAN INTEGRATED CIRCUIT CO., LTD.
-
Kai CHEN
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
HEAT DISSIPATION THROUGH SEAL RINGS
-
Publication number 20250191988
-
Publication date Jun 12, 2025
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Yung-Shih Cheng
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
-
-
-
PACKAGE STRUCTURE
-
Publication number 20250167145
-
Publication date May 22, 2025
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Chen-Hua Yu
-
H01 - BASIC ELECTRIC ELEMENTS
-
MINIATURE SENSOR CAVITIES
-
Publication number 20250164296
-
Publication date May 22, 2025
-
TEXAS INSTRUMENTS INCORPORATED
-
Sreenivasan Kalyani KODURI
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
ELECTRONIC DEVICE
-
Publication number 20250157888
-
Publication date May 15, 2025
-
Advanced Semiconductor Engineering, Inc.
-
Pao-Nan LEE
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
PACKAGE STRUCTURES
-
Publication number 20250157870
-
Publication date May 15, 2025
-
Taiwan Semiconductor Manufacturing Company, Ltd.
-
Jing-Cheng Lin
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
-
-
SEMICONDUCTOR PACKAGE FOR A PCB
-
Publication number 20250105076
-
Publication date Mar 27, 2025
-
NEXPERIA B.V.
-
Maria Cristina Estacio
-
H01 - BASIC ELECTRIC ELEMENTS
-
-