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SENSOR PACKAGE STRUCTURE
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Publication number 20240128139
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Publication date Apr 18, 2024
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TONG HSING ELECTRONIC INDUSTRIES, LTD.
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WEI-LI WANG
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H01 - BASIC ELECTRIC ELEMENTS
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POWER MODULE
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Publication number 20240128180
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Publication date Apr 18, 2024
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Hyundai Motor Company
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Myung Ill You
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H01 - BASIC ELECTRIC ELEMENTS
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Fan-Out Package with Cavity Substrate
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Publication number 20240105705
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Publication date Mar 28, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Po-Hao Tsai
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240087996
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Publication date Mar 14, 2024
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ROHM CO., LTD.
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Kazuki OKUYAMA
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE
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Publication number 20240087903
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Publication date Mar 14, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Feng-Cheng Hsu
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H01 - BASIC ELECTRIC ELEMENTS
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HIGH POWER MODULE PACKAGE STRUCTURES
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Publication number 20240071860
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Publication date Feb 29, 2024
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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Yusheng LIN
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240071879
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Publication date Feb 29, 2024
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ROHM CO., LTD.
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Tianyu WANG
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H01 - BASIC ELECTRIC ELEMENTS
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