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H01L25/0652

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/0652the devices being arranged next and on each other

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with increased thermal dissipation
- Patent number 12,341,074
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Younglyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare-die smart bridge connected with copper pillars for system-in-p...
- Patent number 12,341,096
- Issue date Jun 24, 2025
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure, preparation method, and electronic device
- Patent number 12,341,116
- Issue date Jun 24, 2025
- Huawei Technologies Co., Ltd.
- Chaojun Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor dies for semiconductor device assemblies
- Patent number 12,341,128
- Issue date Jun 24, 2025
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,334,446
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking power delivery device dies
- Patent number 12,334,488
- Issue date Jun 17, 2025
- Advanced Micro Devices, Inc.
- Arsalan Alam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on chip scale package comprising standardized com...
- Patent number 12,327,816
- Issue date Jun 10, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on multichip package using interconnection bridge
- Patent number 12,327,813
- Issue date Jun 10, 2025
- iCometrue Company
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device
- Patent number 12,327,823
- Issue date Jun 10, 2025
- FUZHOU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zecun Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D system integration
- Patent number 12,327,783
- Issue date Jun 10, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming the same
- Patent number 12,327,815
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ASIC package with photonics and vertical power delivery
- Patent number 12,327,817
- Issue date Jun 10, 2025
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices employing thermal and mechanical enhanced layers and method...
- Patent number 12,327,819
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,327,827
- Issue date Jun 10, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate core having an embedded laser stop to control...
- Patent number 12,327,814
- Issue date Jun 10, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,322,705
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC with heat dissipation structure and warpage control
- Patent number 12,322,673
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device including staggered semiconductor memo...
- Patent number 12,324,102
- Issue date Jun 3, 2025
- SanDisk Technologies, Inc.
- Fu Xing Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit package having a padding la...
- Patent number 12,322,726
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for high bandwidth memory
- Patent number 12,315,860
- Issue date May 27, 2025
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution plugs
- Patent number 12,315,793
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,315,831
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,315,840
- Issue date May 27, 2025
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,345
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Seokgeun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging architecture for disaggregated integrated voltage regulators
- Patent number 12,308,362
- Issue date May 20, 2025
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, manufacturing method thereof, and semiconductor...
- Patent number 12,308,298
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package having stress relief structure
- Patent number 12,308,344
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,649
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with communication networks
- Patent number 12,300,666
- Issue date May 13, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Densely packed electronic systems
- Patent number 12,302,497
- Issue date May 13, 2025
- Peter C. Salmon
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
DIRECT APPLIED INTERPOSER FOR CO-PACKAGED OPTICS
- Publication number 20250210613
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Guan-Shian CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH STRESS RELIEF LAYER AND THE METHODS FO...
- Publication number 20250210540
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPLANAR CONTROL FOR FILM-TYPE THERMAL INTERFACE
- Publication number 20250210455
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGING DEFECT FREE DIMPLE PROCESS AND DEVICE
- Publication number 20250210471
- Publication date Jun 26, 2025
- NXP B.V.
- Chanon SUWANKASAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH MOLDING LAYER AND METHOD FOR MANUFACTURING T...
- Publication number 20250210451
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250210457
- Publication date Jun 26, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR IMPROVED PLACEMENT OF REDISTRIBUTION LAYERS IN MULTI-DI...
- Publication number 20250210486
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SYSTEM AND SEMICONDUCTOR STORAGE DEVICE
- Publication number 20250210588
- Publication date Jun 26, 2025
- KIOXIA Corporation
- Yuichi SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESILIENT I/O INTERCONNECT
- Publication number 20250209027
- Publication date Jun 26, 2025
- Intel Corporation
- Gregory K. CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MIXED DEPTH CAVITY FOR EMBEDDED BRIDGE STRUCTURES
- Publication number 20250210469
- Publication date Jun 26, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONITORING OF ELECTRONIC PACKAGES
- Publication number 20250210444
- Publication date Jun 26, 2025
- SK Hynix NAND Product Solutions Corp. (dba Solidigm)
- Jorge MARTINEZ ARAIZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR POWER CONTROL IN 3D STACKED DIE
- Publication number 20250210497
- Publication date Jun 26, 2025
- ADVANCED MICRO DEVICES, INC.
- Stephen Dussinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AND VOLTAGE DO...
- Publication number 20250210587
- Publication date Jun 26, 2025
- Intel Corporation
- Nicolas Butzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH HIGH CAPA...
- Publication number 20250201768
- Publication date Jun 19, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250201658
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR MONITORING HYBRID BONDS IN A SEMICONDUCTOR CHIP PACKAGE
- Publication number 20250201638
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE WITH GRAPHITE SHEETS
- Publication number 20250201656
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AND VOLTAGE CO...
- Publication number 20250201766
- Publication date Jun 19, 2025
- Intel Corporation
- Nicolas Butzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH BOUNDARY...
- Publication number 20250201767
- Publication date Jun 19, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING SYSTEM ARCHITECTURE HAVING EFFICIENT BUS CONNECTIONS
- Publication number 20250201769
- Publication date Jun 19, 2025
- SK HYNIX INC.
- Seong Ju LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250201770
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT PACKAGE HAVING AN INTERNAL REDUNDANT ELECTRICAL CONNE...
- Publication number 20250201682
- Publication date Jun 19, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20250201648
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH DOUBLE-SIDED THERMAL SOLUTION AND METHOD...
- Publication number 20250201651
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250201726
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuen-Shian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR BRIDGE-BASED PACKAGING WITH DIRECT POWE...
- Publication number 20250201722
- Publication date Jun 19, 2025
- ADVANCED MICRO DEVICES, INC.
- Gabriel H. Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
- Publication number 20250192101
- Publication date Jun 12, 2025
- Intel Corporation
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
- Publication number 20250192102
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20250194011
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Eunhye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192074
- Publication date Jun 12, 2025
- Siliconware Precision Industries Co., Ltd.
- Chung-Chih YEN
- H01 - BASIC ELECTRIC ELEMENTS

the devices being arranged next and on each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package with increased thermal dissipation

Bare-die smart bridge connected with copper pillars for system-in-p...

Chip package structure, preparation method, and electronic device

Stacked semiconductor dies for semiconductor device assemblies

Semiconductor package and method

Stacking power delivery device dies

Logic drive based on chip scale package comprising standardized com...

Logic drive based on multichip package using interconnection bridge

Display panel and display device

3D system integration

Integrated circuit package and method of forming the same

ASIC package with photonics and vertical power delivery

Devices employing thermal and mechanical enhanced layers and method...

Microelectronic assemblies

Electronic substrate core having an embedded laser stop to control...

Chip package and manufacturing method thereof

3DIC with heat dissipation structure and warpage control

Semiconductor storage device including staggered semiconductor memo...

Method of forming an integrated circuit package having a padding la...

Integrated circuit package for high bandwidth memory

Semiconductor device with redistribution plugs

Package structure and manufacturing method thereof

Microelectronic assemblies

Semiconductor package

Packaging architecture for disaggregated integrated voltage regulators

Semiconductor die, manufacturing method thereof, and semiconductor...

Multi-chip package having stress relief structure

Semiconductor package

Microelectronic assemblies with communication networks

Densely packed electronic systems

Patents Applicationslast 30 patents

DIRECT APPLIED INTERPOSER FOR CO-PACKAGED OPTICS

SEMICONDUCTOR STRUCTURE WITH STRESS RELIEF LAYER AND THE METHODS FO...

COPLANAR CONTROL FOR FILM-TYPE THERMAL INTERFACE

SEMICONDUCTOR CHIP PACKAGING DEFECT FREE DIMPLE PROCESS AND DEVICE

PACKAGE STRUCTURE WITH MOLDING LAYER AND METHOD FOR MANUFACTURING T...

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

SYSTEMS FOR IMPROVED PLACEMENT OF REDISTRIBUTION LAYERS IN MULTI-DI...

MEMORY SYSTEM AND SEMICONDUCTOR STORAGE DEVICE

RESILIENT I/O INTERCONNECT

MIXED DEPTH CAVITY FOR EMBEDDED BRIDGE STRUCTURES

MONITORING OF ELECTRONIC PACKAGES

SYSTEMS AND METHODS FOR POWER CONTROL IN 3D STACKED DIE

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AND VOLTAGE DO...

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH HIGH CAPA...

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

STRUCTURE FOR MONITORING HYBRID BONDS IN A SEMICONDUCTOR CHIP PACKAGE

SEMICONDUCTOR PACKAGING STRUCTURE WITH GRAPHITE SHEETS

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AND VOLTAGE CO...

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH BOUNDARY...

COMPUTING SYSTEM ARCHITECTURE HAVING EFFICIENT BUS CONNECTIONS

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SURFACE MOUNT PACKAGE HAVING AN INTERNAL REDUNDANT ELECTRICAL CONNE...

INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR PACKAGE WITH DOUBLE-SIDED THERMAL SOLUTION AND METHOD...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

APPARATUSES AND METHODS FOR BRIDGE-BASED PACKAGING WITH DIRECT POWE...

NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...

THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME