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SEMICONDUCTOR PACKAGES
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Publication number 20250239536
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Publication date Jul 24, 2025
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Ming-Fa Chen
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE
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Publication number 20250239512
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Publication date Jul 24, 2025
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Advanced Semiconductor Engineering, Inc.
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Che-Neng LIU
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20250239552
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Publication date Jul 24, 2025
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Samsung Electronics Co., Ltd.
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Yong Ho KIM
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE ARCHITECTURE WITH INTERPOSER
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Publication number 20250233109
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Publication date Jul 17, 2025
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Powerchip Semiconductor Manufacturing Corporation
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Chun-Lin Lu
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20250233110
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Publication date Jul 17, 2025
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Samsung Electronics Co., Ltd.
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Juhong SHIN
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20250226360
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Publication date Jul 10, 2025
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Samsung Electronics Co., Ltd.
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Kyungdon Mun
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H01 - BASIC ELECTRIC ELEMENTS
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MICROELECTRONIC ASSEMBLIES
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Publication number 20250226332
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Publication date Jul 10, 2025
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Intel Corporation
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Aleksandar Aleksov
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H01 - BASIC ELECTRIC ELEMENTS
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MULTI-DIE SEMICONDUCTOR PACKAGE
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Publication number 20250226295
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Publication date Jul 10, 2025
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Infineon Technologies Austria AG
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Bhargav Pandya
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H01 - BASIC ELECTRIC ELEMENTS
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