the devices being arranged next and on each other

Industry

CPC
H01L25/0652

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/0652the devices being arranged next and on each other

Industries

Patents Grantslast 30 patents

Information Patent Grant
Coplanar control for film-type thermal interface
- Patent number 11,973,005
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon transmission lines and other structures enabled by...
- Patent number 11,973,057
- Issue date Apr 30, 2024
- Analog Devices, Inc.
- Ed Balboni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical architecture for a multi-chip module
- Patent number 11,973,004
- Issue date Apr 30, 2024
- Tesla, Inc.
- Robert Yinan Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with warpage-relief trenches
- Patent number 11,973,040
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Yang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures having underfills
- Patent number 11,967,581
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder resist structure to mitigate solder bridge risk
- Patent number 11,967,547
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with communication networks
- Patent number 11,967,580
- Issue date Apr 23, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and electronic systems including the same
- Patent number 11,967,623
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Sunggil Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous packaging integration of photonic and electronic elem...
- Patent number 11,966,090
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure with cavity substrate
- Patent number 11,967,579
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with EMI shield and fabricating method thereof
- Patent number 11,967,567
- Issue date Apr 23, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Doo Soub Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skew matching in a die-to-die interface
- Patent number 11,960,435
- Issue date Apr 16, 2024
- Advanced Micro Devices, Inc.
- Pradeep Jayaraman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic device assemblies and packages including multiple d...
- Patent number 11,961,825
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Aparna U. Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structurally embedded and inhospitable environment systems having a...
- Patent number 11,957,922
- Issue date Apr 16, 2024
- Face International Corporation
- Clark D Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure comprising buffer layer for reducing thermal stre...
- Patent number 11,961,777
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a redistribution substrate and a me...
- Patent number 11,961,793
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Sang-uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including multiple stacks of differ...
- Patent number 11,961,821
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Blaine J. Thurgood
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package including stacked chip structure
- Patent number 11,961,824
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Hyunggyun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity printed circuit board for three-dimensional IC package
- Patent number 11,963,296
- Issue date Apr 16, 2024
- Google LLC
- Yuan Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 11,955,434
- Issue date Apr 9, 2024
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies using edge stacking and methods of manufac...
- Patent number 11,955,457
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memories and memory components with interconnected and redundant da...
- Patent number 11,955,165
- Issue date Apr 9, 2024
- RAMBUS INC.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Grant
Multi-element gain memory bit-cell having stacked and folded planar...
- Patent number 11,955,153
- Issue date Apr 9, 2024
- Kepler Computing Inc.
- Rajeev Kumar Dokania
- G11 - INFORMATION STORAGE
Information Patent Grant
Package stacking using chip to wafer bonding
- Patent number 11,955,462
- Issue date Apr 9, 2024
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,955,458
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Sangkil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,955,442
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising spacers between integrated devices
- Patent number 11,948,909
- Issue date Apr 2, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a bonded substrate stack by surface activation
- Patent number 11,948,912
- Issue date Apr 2, 2024
- Infineon Technologies AG
- Alfred Sigl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a dummy pad
- Patent number 11,948,913
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME
- Publication number 20240147722
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Byongju Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Assembly
- Publication number 20240145529
- Publication date May 2, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Heat Dissipation Structure and Method for Forming the...
- Publication number 20240145342
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLED SYSTEM-ON-WAFER WITH MEANS FOR REDUCING THE EFFECTS OF ELECT...
- Publication number 20240145432
- Publication date May 2, 2024
- Tesla, Inc.
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-On-Interposer Assembly Containing A Decoupling Capacitor
- Publication number 20240145528
- Publication date May 2, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20240145332
- Publication date May 2, 2024
- Hitachi Energy Ltd
- Niko PAVLICEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...
- Publication number 20240145393
- Publication date May 2, 2024
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145403
- Publication date May 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices and Methods of Forming the Same
- Publication number 20240145431
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...
- Publication number 20240136297
- Publication date Apr 25, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE
- Publication number 20240136250
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Yeonho Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136331
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Hyun Soo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240138071
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Shogo FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
- Publication number 20240136326
- Publication date Apr 25, 2024
- Intel Corporation
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136329
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20240128157
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
- Publication number 20240128208
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...
- Publication number 20240130122
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Seungmin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC SYSTEM INCLUDING THE SAME, AND MET...
- Publication number 20240130123
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Yejin PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128232
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20240128255
- Publication date Apr 18, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN
- Publication number 20240128182
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR ENHANCED COOLING
- Publication number 20240128146
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240120315
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND EL...
- Publication number 20240120007
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Chul Min CHOI
- G11 - INFORMATION STORAGE
Information Patent Application
SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING
- Publication number 20240113073
- Publication date Apr 4, 2024
- Intel Corporation
- Xavier F. BRUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240113074
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Heewoo AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240112988
- Publication date Apr 4, 2024
- ROHM CO., LTD.
- Kaori UEBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INTERFACE AND METHOD
- Publication number 20240111673
- Publication date Apr 4, 2024
- Lodestar Licensing Group, LLC
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING

the devices being arranged next and on each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Coplanar control for film-type thermal interface

Through-silicon transmission lines and other structures enabled by...

Mechanical architecture for a multi-chip module

Interposer with warpage-relief trenches

Package structures having underfills

Solder resist structure to mitigate solder bridge risk

Microelectronic assemblies with communication networks

Semiconductor devices and electronic systems including the same

Heterogeneous packaging integration of photonic and electronic elem...

Method for forming package structure with cavity substrate

Semiconductor package with EMI shield and fabricating method thereof

3DIC packaging with hot spot thermal management features

Skew matching in a die-to-die interface

Microelectronic device assemblies and packages including multiple d...

Structurally embedded and inhospitable environment systems having a...

Package structure comprising buffer layer for reducing thermal stre...

Semiconductor package including a redistribution substrate and a me...

Semiconductor device assemblies including multiple stacks of differ...

Semiconductor package including stacked chip structure

Cavity printed circuit board for three-dimensional IC package

Ultra small molded module integrated with die by module-on-wafer as...

Semiconductor assemblies using edge stacking and methods of manufac...

Memories and memory components with interconnected and redundant da...

Multi-element gain memory bit-cell having stacked and folded planar...

Package stacking using chip to wafer bonding

Semiconductor package

Semiconductor package and method

Package comprising spacers between integrated devices

Method of manufacturing a bonded substrate stack by surface activation

Semiconductor package including a dummy pad

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME

Semiconductor Package Assembly

Package with Heat Dissipation Structure and Method for Forming the...

COOLED SYSTEM-ON-WAFER WITH MEANS FOR REDUCING THE EFFECTS OF ELECT...

Chip-On-Interposer Assembly Containing A Decoupling Capacitor

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Packaged Semiconductor Devices and Methods of Forming the Same

MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE

SEMICONDUCTOR PACKAGE

METHOD FOR MANUFACTURING WIRING SUBSTRATE

NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...

SEMICONDUCTOR PACKAGE

Semiconductor Package and Method of Manufacturing the Same

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...

SEMICONDUCTOR DEVICE, ELECTRONIC SYSTEM INCLUDING THE SAME, AND MET...

SEMICONDUCTOR PACKAGE

MICROELECTRONIC ASSEMBLIES

DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN

SEMICONDUCTOR PACKAGE FOR ENHANCED COOLING

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND EL...

SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

MEMORY DEVICE INTERFACE AND METHOD