the devices being arranged next and on each other

Industry

CPC
H01L25/0652

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/0652the devices being arranged next and on each other

Industries

Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 12,222,880
- Issue date Feb 11, 2025
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fan-out packages providing enhanced mechanical strength and methods...
- Patent number 12,224,268
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacking structure and manufacturing method thereof
- Patent number 12,224,265
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect substrates, a semiconductor device and a method fo...
- Patent number 12,224,264
- Issue date Feb 11, 2025
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including passive devices and methods of for...
- Patent number 12,224,266
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,218,100
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Inhyo Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with high density interconnects
- Patent number 12,218,069
- Issue date Feb 4, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,218,070
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Hae-Jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure having molding layer
- Patent number 12,218,095
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,218,082
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method of forming the same
- Patent number 12,217,817
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Piao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 12,218,022
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure with molding layer
- Patent number 12,218,104
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for heat dissipation
- Patent number 12,218,026
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested interposer with through-silicon via bridge die
- Patent number 12,218,040
- Issue date Feb 4, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,210,188
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,211,829
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,211,776
- Issue date Jan 28, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method of manufacturing the same
- Patent number 12,213,318
- Issue date Jan 28, 2025
- SK hynix Inc.
- Sun Mi Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with substrate heat sinks and...
- Patent number 12,211,822
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package including forming cav...
- Patent number 12,205,861
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including monolithic silicon struct...
- Patent number 12,205,865
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having package substrate
- Patent number 12,205,925
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,205,939
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Honeycomb pattern for conductive features
- Patent number 12,205,916
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and packaging method thereof
- Patent number 12,205,940
- Issue date Jan 21, 2025
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die to die high-speed communication without discrete amplifiers bet...
- Patent number 12,205,908
- Issue date Jan 21, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper connected glass modules on a glass board
- Patent number 12,199,007
- Issue date Jan 14, 2025
- BROADCOM INTERNATIONAL PTE. LTD.
- Thomas Edward Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded liquid cooling
- Patent number 12,199,011
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY
- Publication number 20250054819
- Publication date Feb 13, 2025
- Intel Corporation
- Seok Ling LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING LARGE CHIPS THROUGH STITCHING
- Publication number 20250054879
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Metallization by a Nickel or Cobalt Alloy for the Manufac...
- Publication number 20250051927
- Publication date Feb 13, 2025
- MacDermid Enthone Inc.
- Mikailou THIAM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250054891
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Ju Bin SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME
- Publication number 20250056806
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Junhyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250054846
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Jaesun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINATION-TYPE SEMICONDUCTOR PACKAGE FOR IMPROVING PACKAGE RELIAB...
- Publication number 20250054852
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Chulho Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20250054893
- Publication date Feb 13, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Artan BAFTIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250048627
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Jaehyeok Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density 3D Interconnect Configuration
- Publication number 20250046715
- Publication date Feb 6, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...
- Publication number 20250046757
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046769
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Jooyoung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046754
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Hyun-Mook Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...
- Publication number 20250048628
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Joonyoung Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20250046671
- Publication date Feb 6, 2025
- Fuji Electric Co., Ltd.
- Koji OSAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250046753
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20250048632
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Juhyung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250046692
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038149
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- HYUNGJUN JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING DYNAMIC SECURITY FABRIC INTERPOSE...
- Publication number 20250038132
- Publication date Jan 30, 2025
- The Charles Stark Draper Laboratory, Inc.
- Douglas La Tulipe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20250038148
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING AN INTERCONNECTION AREA AND SEMICONDUCTOR...
- Publication number 20250038118
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- YOUNG-DEUK KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
- Publication number 20250038112
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Taejoo HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250040140
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Ju Seong MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BACKSIDE POWER DELIVERY NETWORK LAYER
- Publication number 20250029914
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250029951
- Publication date Jan 23, 2025
- Advanced Semiconductor Engineering, Inc.
- Kay Stefan ESSIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN INORGANIC LAYER ON A MOLD LAYER AND...
- Publication number 20250029955
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Jihoon JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250029927
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- YOUNGBAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND VEHICLE
- Publication number 20250029928
- Publication date Jan 23, 2025
- Fuji Electric Co., Ltd.
- Tomohiro ISONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR CONNECTING INTEGRATED CIRCUITS
- Publication number 20250029952
- Publication date Jan 23, 2025
- Avago Technologies International Sales Pte. Limited
- Ting Zhou
- H01 - BASIC ELECTRIC ELEMENTS

the devices being arranged next and on each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked semiconductor device assembly in computer system

Fan-out packages providing enhanced mechanical strength and methods...

Three-dimensional stacking structure and manufacturing method thereof

Die interconnect substrates, a semiconductor device and a method fo...

Semiconductor packages including passive devices and methods of for...

Semiconductor package

Multi-chip package with high density interconnects

Semiconductor package and method of fabricating the same

Chip package structure having molding layer

Package structure

Memory device and method of forming the same

Passivation structure with planar top surfaces

Method for forming chip package structure with molding layer

Package structure for heat dissipation

Nested interposer with through-silicon via bridge die

Semiconductor package and manufacturing method thereof

Semiconductor package

Electronic package and manufacturing method thereof

Semiconductor memory device and method of manufacturing the same

Stacked semiconductor die assemblies with substrate heat sinks and...

Manufacturing method of semiconductor package including forming cav...

Semiconductor device assemblies including monolithic silicon struct...

Semiconductor package having package substrate

Semiconductor package

Honeycomb pattern for conductive features

Semiconductor package structure and packaging method thereof

Die to die high-speed communication without discrete amplifiers bet...

Multi-die package structures including redistribution layers

Copper connected glass modules on a glass board

Embedded liquid cooling

Patents Applicationslast 30 patents

STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY

FORMING LARGE CHIPS THROUGH STITCHING

Method of Metallization by a Nickel or Cobalt Alloy for the Manufac...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

COMBINATION-TYPE SEMICONDUCTOR PACKAGE FOR IMPROVING PACKAGE RELIAB...

Component Carrier and Method of Manufacturing the Same

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

High Density 3D Interconnect Configuration

SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SYSTEMS AND METHODS FOR PROVIDING DYNAMIC SECURITY FABRIC INTERPOSE...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING SAME

SEMICONDUCTOR CHIP HAVING AN INTERCONNECTION AREA AND SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR PACKAGE WITH BACKSIDE POWER DELIVERY NETWORK LAYER

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE HAVING AN INORGANIC LAYER ON A MOLD LAYER AND...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND VEHICLE

SYSTEMS AND METHODS FOR CONNECTING INTEGRATED CIRCUITS