the devices being arranged next and on each other

Industry

CPC
H01L25/0652

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/0652the devices being arranged next and on each other

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,300,649
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with communication networks
- Patent number 12,300,666
- Issue date May 13, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Densely packed electronic systems
- Patent number 12,302,497
- Issue date May 13, 2025
- Peter C. Salmon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit device and electronic system including the same
- Patent number 12,302,576
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Jeeyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including differential height PCB
- Patent number 12,300,557
- Issue date May 13, 2025
- SanDisk Technologies, Inc.
- Nandha Kumar Mohanraj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector and method for forming the same
- Patent number 12,300,645
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,667
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- YeongBeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,665
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Jang-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inorganic-based embedded-die layers for modular semiconductive devices
- Patent number 12,300,620
- Issue date May 13, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,294,002
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,293,985
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PSPI-based patterning method for RDL
- Patent number 12,288,781
- Issue date Apr 29, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with hybrid mold layers
- Patent number 12,288,740
- Issue date Apr 29, 2025
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and semiconductor apparatus comprising same
- Patent number 12,288,742
- Issue date Apr 29, 2025
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,288,752
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with signal bump and dummy bump, semiconductor p...
- Patent number 12,288,762
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Keum Hee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,288,751
- Issue date Apr 29, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking devices using support f...
- Patent number 12,288,754
- Issue date Apr 29, 2025
- STATS ChipPAC Pte. Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for semiconductor, production method therefor, and semicon...
- Patent number 12,283,565
- Issue date Apr 22, 2025
- Toshiyasu Akiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,283,569
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Yung-Hsing Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of forming the same
- Patent number 12,283,537
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device interface and method
- Patent number 12,277,056
- Issue date Apr 15, 2025
- Micron Technology, Inc.
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Coplanar control for film-type thermal interface
- Patent number 12,278,162
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular construction of hybrid-bonded semiconductor die assemblies...
- Patent number 12,278,202
- Issue date Apr 15, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package structure having inte...
- Patent number 12,278,190
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package module and manufacturing methods thereof
- Patent number 12,272,612
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package network processors
- Patent number 12,273,282
- Issue date Apr 8, 2025
- Altera Corporation
- Kevin Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming the same
- Patent number 12,272,623
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having interconnections between die...
- Patent number 12,272,651
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through-package debug features
- Patent number 12,272,609
- Issue date Apr 8, 2025
- SanDisk Technologies, Inc.
- Nir Amir
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250157949
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory System Having Combined High Density, Low Bandwidth and Low D...
- Publication number 20250157520
- Publication date May 15, 2025
- Apple Inc.
- Sukalpa Biswas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157983
- Publication date May 15, 2025
- SAMSUNG ELECTRONICS CO., LTD.
- HYUNGJUN JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157874
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR HEAT DISSIPATION
- Publication number 20250157876
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY PROTECTION PACKAGE HAVING CO-PACKED TRANSISTORS AND INTEGRA...
- Publication number 20250157894
- Publication date May 15, 2025
- Alpha and Omega Semiconductor International LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250159885
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- JUNGYEOM KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS
- Publication number 20250157969
- Publication date May 15, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20250157941
- Publication date May 15, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY MODULE WITH EXTENDED CONDUCTIVE PLANE FOR HEAT DISSIPATION
- Publication number 20250157885
- Publication date May 15, 2025
- Micron Technology, Inc.
- Kaleb A. WILSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory System Having Combined High Density, Low Bandwidth and Low D...
- Publication number 20250157521
- Publication date May 15, 2025
- Apple Inc.
- Sukalpa Biswas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF THREE-DIMENSIONAL STACKING STRUCTURE
- Publication number 20250157984
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250149443
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- SUJIN PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE INTERCONNECT SUBSTRATES, A SEMICONDUCTOR DEVICE AND A METHOD FO...
- Publication number 20250149501
- Publication date May 8, 2025
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COM...
- Publication number 20250149505
- Publication date May 8, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES HAVING ENCAPSULATION STRESS AND STRAIN MITIGATING CON...
- Publication number 20250149395
- Publication date May 8, 2025
- Utkarsh Mehrotra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COM...
- Publication number 20250149504
- Publication date May 8, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME, AND ELEC...
- Publication number 20250151271
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Sehoon LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH WIRE-BONDED TRACES, AND METHODS FOR M...
- Publication number 20250149416
- Publication date May 8, 2025
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250149494
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250149503
- Publication date May 8, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH THERMAL ENHANCEMENTS FOR VERTICALLY ORIEN...
- Publication number 20250140741
- Publication date May 1, 2025
- Intel Corporation
- Rajiv Mongia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACKING STRUCTURE
- Publication number 20250140743
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELE...
- Publication number 20250142822
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Daehwan CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE-ILLUMINATION SOLID-STATE IMAGE PICKUP APPARATUS, IMAGE PIC...
- Publication number 20250142988
- Publication date May 1, 2025
- Sony Semiconductor Solutions Corporation
- Naoki KOMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LAYOUTS UTILIZING NON-RECTANGULAR PERIPHERAL CHIPS
- Publication number 20250140742
- Publication date May 1, 2025
- NVIDIA Corp.
- Benjamin Giles Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGES PROVIDING ENHANCED MECHANICAL STRENGTH AND METHODS...
- Publication number 20250140754
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES
- Publication number 20250140757
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES
- Publication number 20250140627
- Publication date May 1, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING PASSIVE DEVICES AND METHODS OF FOR...
- Publication number 20250140744
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS

the devices being arranged next and on each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Microelectronic assemblies with communication networks

Densely packed electronic systems

Integrated circuit device and electronic system including the same

Semiconductor device including differential height PCB

Connector and method for forming the same

Semiconductor package and method of fabricating the same

Semiconductor package

Inorganic-based embedded-die layers for modular semiconductive devices

Integrated circuit package and method of forming same

Integrated circuit packages and methods of forming the same

PSPI-based patterning method for RDL

Semiconductor package with hybrid mold layers

Packaging substrate and semiconductor apparatus comprising same

Semiconductor packages

Semiconductor chip with signal bump and dummy bump, semiconductor p...

Microelectronic assemblies

Semiconductor device and method of stacking devices using support f...

Adhesive for semiconductor, production method therefor, and semicon...

Semiconductor device package and a method of manufacturing the same

Electronic package and method of forming the same

Memory device interface and method

Coplanar control for film-type thermal interface

Modular construction of hybrid-bonded semiconductor die assemblies...

Manufacturing method of semiconductor package structure having inte...

Semiconductor package module and manufacturing methods thereof

System-in-package network processors

Semiconductor packages and methods for forming the same

Semiconductor package structure having interconnections between die...

Semiconductor device including through-package debug features

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

Memory System Having Combined High Density, Low Bandwidth and Low D...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE FOR HEAT DISSIPATION

BATTERY PROTECTION PACKAGE HAVING CO-PACKED TRANSISTORS AND INTEGRA...

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

ELECTRONIC ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

MEMORY MODULE WITH EXTENDED CONDUCTIVE PLANE FOR HEAT DISSIPATION

Memory System Having Combined High Density, Low Bandwidth and Low D...

MANUFACTURING METHOD OF THREE-DIMENSIONAL STACKING STRUCTURE

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

DIE INTERCONNECT SUBSTRATES, A SEMICONDUCTOR DEVICE AND A METHOD FO...

LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COM...

POWER MODULES HAVING ENCAPSULATION STRESS AND STRAIN MITIGATING CON...

LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COM...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME, AND ELEC...

SEMICONDUCTOR ASSEMBLIES WITH WIRE-BONDED TRACES, AND METHODS FOR M...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE

PACKAGE ARCHITECTURE WITH THERMAL ENHANCEMENTS FOR VERTICALLY ORIEN...

CHIP STACKING STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELE...

BACKSIDE-ILLUMINATION SOLID-STATE IMAGE PICKUP APPARATUS, IMAGE PIC...

PACKAGE LAYOUTS UTILIZING NON-RECTANGULAR PERIPHERAL CHIPS

FAN-OUT PACKAGES PROVIDING ENHANCED MECHANICAL STRENGTH AND METHODS...

CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES

PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES

SEMICONDUCTOR PACKAGES INCLUDING PASSIVE DEVICES AND METHODS OF FOR...