the devices being arranged next to each other

Industry

CPC
H01L25/0655

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/0655the devices being arranged next to each other

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,237,252
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Yoonyoung Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to radio-frequency filters on silicon-o...
- Patent number 12,237,861
- Issue date Feb 25, 2025
- Skyworks Solutions, Inc.
- James Phillip Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,237,276
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,236,998
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Seongjin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 12,237,253
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jun Hyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable large system based on organic interconnect
- Patent number 12,237,269
- Issue date Feb 25, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method of manufacture
- Patent number 12,237,288
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,237,240
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,250
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate z-disaggregation with liquid metal interconnects
- Patent number 12,230,564
- Issue date Feb 18, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,230,605
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Ching Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal bonding pads for underfill application in semiconductor...
- Patent number 12,232,307
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module package structures
- Patent number 12,230,601
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device
- Patent number 12,230,558
- Issue date Feb 18, 2025
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnecting method, interconnect device and method for for...
- Patent number 12,224,267
- Issue date Feb 11, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory device including selection gate and manufacturi...
- Patent number 12,225,722
- Issue date Feb 11, 2025
- SK keyfoundry Inc.
- Jin Shik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 12,224,220
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method and package structure
- Patent number 12,224,221
- Issue date Feb 11, 2025
- Harvatek Corporation
- Chin-Jui Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,224,226
- Issue date Feb 11, 2025
- Innolux Corporation
- Chin-Lung Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with high density interconnects
- Patent number 12,218,069
- Issue date Feb 4, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure having molding layer
- Patent number 12,218,095
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,218,044
- Issue date Feb 4, 2025
- Renesas Electronics Corporation
- Nobuhiro Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,218,075
- Issue date Feb 4, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arched membrane structure for MEMS device
- Patent number 12,209,013
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhao-Yi Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for improving power integrity characteristics
- Patent number 12,213,256
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Junghwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,205,935
- Issue date Jan 21, 2025
- AISIN CORPORATION
- Takanobu Naruse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,205,914
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Inhyung Song
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Int...
- Publication number 20250062236
- Publication date Feb 20, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20250062259
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Chien Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE FOR A MULTI-CHIP SEMICONDUCTOR PACKAGE
- Publication number 20250062280
- Publication date Feb 20, 2025
- GENERAL ELECTRIC COMPANY
- Ljubisa D. Stevanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062282
- Publication date Feb 20, 2025
- DENSO CORPORATION
- SHINGO TSUCHIMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062299
- Publication date Feb 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Meng-Jie LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR MANUFACTURING A POWER MODULE
- Publication number 20250062242
- Publication date Feb 20, 2025
- Hitachi Energy Ltd
- Fabian FISCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENT IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250062201
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062265
- Publication date Feb 20, 2025
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- YUEH-MING TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...
- Publication number 20250062267
- Publication date Feb 20, 2025
- SILICON BOX PTE. LTD.
- Sehat SUTARDJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250062188
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH BRIDGE DIES HAVING AIR GAPS AROUND VIAS
- Publication number 20250062206
- Publication date Feb 20, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20250062215
- Publication date Feb 20, 2025
- JCET GROUP CO., LTD.
- Danfeng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND INTEGRATED CIRCUIT DEVICE
- Publication number 20250062238
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Bong Wee YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250062245
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING DUMMY STRUCTURE AT CORNER REGION T...
- Publication number 20250062210
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Seongyo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062281
- Publication date Feb 20, 2025
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- Yueh-Ming Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250054853
- Publication date Feb 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250054906
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR PRODUCING SAME
- Publication number 20250054907
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACAKGE AND METHOD FOR FORMING THE SAME
- Publication number 20250054925
- Publication date Feb 13, 2025
- STATS ChipPAC Pte Ltd.
- YongHyuk JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOW INVERTER AND POWER SEMICONDUCTOR COMPONENT
- Publication number 20250054836
- Publication date Feb 13, 2025
- Hitachi Energy Ltd
- Lluis SANTOLARIA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COMBINATION-TYPE SEMICONDUCTOR PACKAGE FOR IMPROVING PACKAGE RELIAB...
- Publication number 20250054852
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Chulho Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE BRIDGE AND METHOD FOR MANUFACTURING IT
- Publication number 20250054868
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250054900
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHO...
- Publication number 20250054826
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Che Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING PACKAGE STRUCTURE
- Publication number 20250046686
- Publication date Feb 6, 2025
- LITE-ON SINGAPORE PTE. LTD.
- YOU-FA WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
- Publication number 20250046745
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Young Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250046676
- Publication date Feb 6, 2025
- Fuji Electric Co., Ltd.
- Daiki SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250046687
- Publication date Feb 6, 2025
- Rohm Co., Ltd.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CONNECTORS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING
- Publication number 20250046734
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS

the devices being arranged next to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Devices and methods related to radio-frequency filters on silicon-o...

Package structure

Circuit board with bridge chiplets

Semiconductor device

Semiconductor package and method for fabricating the same

Scalable large system based on organic interconnect

Semiconductor die package and method of manufacture

Semiconductor package and method of manufacturing semiconductor pac...

Semiconductor package

Package substrate z-disaggregation with liquid metal interconnects

Semiconductor package and manufacturing method thereof

Dummy metal bonding pads for underfill application in semiconductor...

High power module package structures

Semiconductor device and method of forming micro interconnect struc...

Package device

Chip interconnecting method, interconnect device and method for for...

Non-volatile memory device including selection gate and manufacturi...

Semiconductor module and power conversion apparatus

Packaging method and package structure

Electronic device

Multi-chip package with high density interconnects

Chip package structure having molding layer

Semiconductor device

Package structure

Arched membrane structure for MEMS device

Package-on-package assembly with wire bond vias

Semiconductor package for improving power integrity characteristics

Semiconductor device

Semiconductor package

Patents Applicationslast 30 patents

Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Int...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

POWER OVERLAY STRUCTURE FOR A MULTI-CHIP SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

POWER MODULE AND METHOD FOR MANUFACTURING A POWER MODULE

SURFACE TREATMENT IN INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME

PACKAGE ARCHITECTURE WITH BRIDGE DIES HAVING AIR GAPS AROUND VIAS

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR PACKAGE AND INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE COMPRISING DUMMY STRUCTURE AT CORNER REGION T...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

POWER MODULE AND METHOD FOR PRODUCING SAME

SEMICONDUCTOR PACAKGE AND METHOD FOR FORMING THE SAME

FLOW INVERTER AND POWER SEMICONDUCTOR COMPONENT

COMBINATION-TYPE SEMICONDUCTOR PACKAGE FOR IMPROVING PACKAGE RELIAB...

POWER MODULE BRIDGE AND METHOD FOR MANUFACTURING IT

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHO...

CAPACITIVE COUPLING PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PACKAGE CONNECTORS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING