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H01L25/0655
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L25/00
Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
Current Industry
H01L25/0655
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Patents Grants
last 30 patents
Information
Patent Grant
Film covers for sensor packages
Patent number
11,972,994
Issue date
Apr 30, 2024
Texas Instruments Incorporated
Sreenivasan Kalyani Koduri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Coplanar control for film-type thermal interface
Patent number
11,973,005
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Yu-Hsun Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit product and chip floorplan arrangement thereof
Patent number
11,973,059
Issue date
Apr 30, 2024
Alchip Technologies, Ltd.
Wen-Hsi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
11,973,001
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple die assembly
Patent number
11,973,058
Issue date
Apr 30, 2024
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Soft motherboard-rigid plugin module architecture
Patent number
11,974,502
Issue date
Apr 30, 2024
The Regents of the University of Colorado
Jianliang Xiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
Patent number
11,972,995
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Dahee Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package
Patent number
11,967,559
Issue date
Apr 23, 2024
Advanced Semiconductor Engineering, Inc.
Chang Chi Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip device and method of formation
Patent number
11,967,582
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company Limited
Chin-Hua Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,961,742
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Size and efficiency of dies
Patent number
11,961,804
Issue date
Apr 16, 2024
Intel Corporation
Mathew J. Manusharow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device, and tiled display device including the display device
Patent number
11,961,822
Issue date
Apr 16, 2024
Samsung Display Co., Ltd.
Hyun Joon Kim
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Memories and memory components with interconnected and redundant da...
Patent number
11,955,165
Issue date
Apr 9, 2024
RAMBUS INC.
Frederick A. Ware
G11 - INFORMATION STORAGE
Information
Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
Patent number
11,955,434
Issue date
Apr 9, 2024
Intel Corporation
Yoshihiro Tomita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
11,955,459
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shu-Hang Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
11,955,401
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Hui Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip packaged devices with thermal pad
Patent number
11,955,456
Issue date
Apr 9, 2024
Texas Instruments Incorporated
Anindya Poddar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module including semiconductor package and semiconduc...
Patent number
11,953,545
Issue date
Apr 9, 2024
Samsung Electronics Co., Ltd.
Seyoung Won
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device having multiple sub-pixels
Patent number
11,948,923
Issue date
Apr 2, 2024
INNOLUX CORPORATION
Jui-Jen Yueh
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Integrated circuit (IC) package with cantilever multi-chip module (...
Patent number
11,948,855
Issue date
Apr 2, 2024
Rockwell Collins, Inc.
Bret W. Simon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip package and method of assembly
Patent number
11,948,878
Issue date
Apr 2, 2024
Littelfuse, Inc.
Stefan Steinhoff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure
Patent number
11,948,895
Issue date
Apr 2, 2024
Mediatek Inc.
Tzu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a plurality of terminals arranged thereon
Patent number
11,948,916
Issue date
Apr 2, 2024
Renesas Electronics Corporation
Shuuichi Kariyazaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density low power interconnect using 3D die stacking
Patent number
11,942,409
Issue date
Mar 26, 2024
MARVELL ASIA PTE. LTD.
Ferran Martorell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure
Patent number
11,942,439
Issue date
Mar 26, 2024
Mediatek Inc.
Tzu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laminate stacked on die for high voltage isolation capacitor
Patent number
11,942,402
Issue date
Mar 26, 2024
Texas Instruments Incorporated
Thomas Dyer Bonifield
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module arrangement
Patent number
11,942,452
Issue date
Mar 26, 2024
Infineon Technologies AG
Christian Robert Mueller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded structure, manufacturing method thereof and substrate
Patent number
11,942,465
Issue date
Mar 26, 2024
Zhuhai ACCESS Semiconductor Co., Ltd.
Xianming Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous integration semiconductor package structure
Patent number
11,942,396
Issue date
Mar 26, 2024
Industrial Technology Research Institute
Heng-Chieh Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plurality of dies electrically connected to a printed circuit board...
Patent number
11,935,807
Issue date
Mar 19, 2024
Hamilton Sundstrand Corporation
Karthik Debbadi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC ASSEMBLY WITH POWER MODULE INTERPOSER AND METHODS OF FOR...
Publication number
20240145368
Publication date
May 2, 2024
Intel Corporation
Jackson Chung Peng KONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
Publication number
20240145433
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturiing Co., Ltd.
Po-Yao Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI PROGRAMABLE-DIE MODULE
Publication number
20240145434
Publication date
May 2, 2024
Intel Corporation
Mahesh Kumashikar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING A HIGH RELIABILITY
Publication number
20240145437
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
JI-HWAN HWANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240136246
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE
Publication number
20240136269
Publication date
Apr 25, 2024
Intel Corporation
Bok Eng CHEAH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20240136275
Publication date
Apr 25, 2024
MEDIATEK INC.
Shi-Bai Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240136331
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Hyun Soo CHUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
Publication number
20240132340
Publication date
Apr 25, 2024
STMicroelectronics (Malta) Ltd.
Roseanne DUCA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
EMBEDDED DIE ARCHITECTURE AND METHOD OF MAKING
Publication number
20240128138
Publication date
Apr 18, 2024
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSOR PACKAGE STRUCTURE
Publication number
20240128139
Publication date
Apr 18, 2024
TONG HSING ELECTRONIC INDUSTRIES, LTD.
WEI-LI WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHARING PACKAGE PINS IN A MULTI-CHIP MODULE (MCM)
Publication number
20240126712
Publication date
Apr 18, 2024
ADVANCED MICRO DEVICES, INC.
YULEI SHEN
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING
Publication number
20240128150
Publication date
Apr 18, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THREROF
Publication number
20240128233
Publication date
Apr 18, 2024
TONG HSING ELECTRONIC INDUSTRIES, LTD.
CHIA-SHUAI CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
Publication number
20240128145
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
HYEONSEOK LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS
Publication number
20240128181
Publication date
Apr 18, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20240128194
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240128155
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Minjun Bae
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHIFTED MULTI-VIA CONNECTION FOR HYBRID BONDING
Publication number
20240120312
Publication date
Apr 11, 2024
TOKYO ELECTRON LIMITED
Kevin Ryan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME
Publication number
20240120289
Publication date
Apr 11, 2024
JCET STATS ChipPAC Korea Limited
SeungHyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Techniques For Arranging Conductive Pads In Electronic Devices
Publication number
20240120302
Publication date
Apr 11, 2024
Intel Corporation
Krishna Bharath Kolluru
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240120263
Publication date
Apr 11, 2024
Samsung Electronics Co., Ltd.
CHEOL KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE A...
Publication number
20240114622
Publication date
Apr 4, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Display Apparatus and Methods
Publication number
20240110276
Publication date
Apr 4, 2024
Nanolumens Acquisition, Inc
Richard C. Cope
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
INTRA-BONDING SEMICONDUCTOR INTEGRATED CIRCUIT CHIPS
Publication number
20240113076
Publication date
Apr 4, 2024
International Business Machines Corporation
Frank Robert Libsch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240113003
Publication date
Apr 4, 2024
Samsung Electronics Co., Ltd.
Yun Seok CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE INCLUDING MEMORY BRIDGE DIE AND METHODS FOR FORMI...
Publication number
20240113030
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Company Limited
Hiroki Noguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDIS...
Publication number
20240113075
Publication date
Apr 4, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER
Publication number
20240113006
Publication date
Apr 4, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW CAPACITANCE ESD PROTECTION DEVICES
Publication number
20240113098
Publication date
Apr 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Sreeram Nasum Subramanyam
H01 - BASIC ELECTRIC ELEMENTS