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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

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H01L25/0655the devices being arranged next to each other

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including interposer
- Patent number 12,170,249
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Jong-youn Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,170,260
- Issue date Dec 17, 2024
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system
- Patent number 12,169,644
- Issue date Dec 17, 2024
- Kioxia Corporation
- Manabu Matsumoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,165,978
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer directly bonded to bonding pads on a plurality of dies
- Patent number 12,165,952
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 12,165,999
- Issue date Dec 10, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Kouki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation device and method of transmitting a signal across an isol...
- Patent number 12,166,146
- Issue date Dec 10, 2024
- MPICS INNOVATIONS PTE. LTD
- Kok Keong Richard Lum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency antennas and waveguides for communication between i...
- Patent number 12,165,994
- Issue date Dec 10, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded bridge die with through-silicon vias
- Patent number 12,159,813
- Issue date Dec 3, 2024
- Intel Corporation
- Aditya S. Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D package configuration
- Patent number 12,159,824
- Issue date Dec 3, 2024
- CCS TECHNOLOGY CORPORATION
- Tung-Po Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,159,810
- Issue date Dec 3, 2024
- Denso Corporation
- Akinori Sakakibara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,161,015
- Issue date Dec 3, 2024
- Samsung Display Co., Ltd.
- Ho Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,159,819
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrayed switch circuit, switching element and system chip package s...
- Patent number 12,154,905
- Issue date Nov 26, 2024
- Industrial Technology Research Institute
- Jie Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having redistribution pattern
- Patent number 12,154,881
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Yunrae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
- Patent number 12,154,884
- Issue date Nov 26, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 12,154,817
- Issue date Nov 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect bridge
- Patent number 12,148,704
- Issue date Nov 19, 2024
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method for manufacturing the same
- Patent number 12,148,681
- Issue date Nov 19, 2024
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with interconnectors of different density
- Patent number 12,148,689
- Issue date Nov 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Liang-Pin Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMIB patch on glass laminate substrate
- Patent number 12,148,703
- Issue date Nov 19, 2024
- Intel Corporation
- Robert Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module leadless package
- Patent number 12,142,550
- Issue date Nov 12, 2024
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die ultrafine pitch patch architecture of interconnect bridge...
- Patent number 12,142,568
- Issue date Nov 12, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
- Patent number 12,142,553
- Issue date Nov 12, 2024
- Intel Corporation
- Arnab Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having an annular frame with trunca...
- Patent number 12,142,598
- Issue date Nov 12, 2024
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,142,544
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite bridge die-to-die interconnects for integrated-circuit pa...
- Patent number 12,142,570
- Issue date Nov 12, 2024
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with embedded programmable logic
- Patent number 12,135,660
- Issue date Nov 5, 2024
- Altera Corporation
- Arifur Rahman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interface bridge between integrated circuit die
- Patent number 12,135,667
- Issue date Nov 5, 2024
- Altera Corporation
- Jeffrey Erik Schulz
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY
- Publication number 20240418951
- Publication date Dec 19, 2024
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED STRUCTURE WITH MULTI-HEIGHT COMPONENTS COMPRISING BACK...
- Publication number 20240421017
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240421018
- Publication date Dec 19, 2024
- Fuji Electric Co., Ltd.
- Kazuma KAWAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS INTERCONNECTS IN INTEGRATED CIRCUIT PACKAGE SUBSTRATES WIT...
- Publication number 20240421465
- Publication date Dec 19, 2024
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATED CHIP AND SIGNAL TRANSMITTING DEVICE
- Publication number 20240420884
- Publication date Dec 19, 2024
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240421094
- Publication date Dec 19, 2024
- DAEDUCK ELECTRONICS CO., LTD.
- Seon-Kyu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE
- Publication number 20240421124
- Publication date Dec 19, 2024
- VIA TECHNOLOGIES, INC.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421125
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- SEUNGDUK BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Singulation Assisted Structures and Methods for Improving Bond...
- Publication number 20240421126
- Publication date Dec 19, 2024
- Apple Inc.
- Chi Nung Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED I/O SEMICONDUCTOR CHIP PACKAGE AND COOLING ASSEMBLY HAVING...
- Publication number 20240421025
- Publication date Dec 19, 2024
- Intel Corporation
- Lianchang DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...
- Publication number 20240421062
- Publication date Dec 19, 2024
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20240421098
- Publication date Dec 19, 2024
- Tahoe Research, Ltd.
- Mihir K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421123
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Chengtar Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240421127
- Publication date Dec 19, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Yi Seul Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE
- Publication number 20240421096
- Publication date Dec 19, 2024
- VIA TECHNOLOGIES, INC.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Converter, Package Structure, and Heat Dissipation Structure
- Publication number 20240421100
- Publication date Dec 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Xingzhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20240421073
- Publication date Dec 19, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...
- Publication number 20240421115
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421011
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- WanSun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413049
- Publication date Dec 12, 2024
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RADIATION DEVICES
- Publication number 20240413053
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Youngjoon Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240413061
- Publication date Dec 12, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVING SIZE AND EFFICIENCY OF DIES
- Publication number 20240413089
- Publication date Dec 12, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER
- Publication number 20240413051
- Publication date Dec 12, 2024
- Denka Company Limited
- Daisuke GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...
- Publication number 20240413069
- Publication date Dec 12, 2024
- SERIPHY TECHNOLOGY CORPORATION
- TZU-WEI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING STIFFENER STRUCTURE
- Publication number 20240413096
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- OKGYEONG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RINGS IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240413101
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404971
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20240404977
- Publication date Dec 5, 2024
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE HAVING A METALLIC CLIP WITH ULTRASONICAL...
- Publication number 20240404982
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Marian Sebastian Broll
- H01 - BASIC ELECTRIC ELEMENTS

the devices being arranged next to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package including interposer

Metal-free frame design for silicon bridges for semiconductor packages

Semiconductor package and method of manufacturing the same

Memory system

Package structure and method of manufacturing the same

Interposer directly bonded to bonding pads on a plurality of dies

Semiconductor device and semiconductor module

Isolation device and method of transmitting a signal across an isol...

Radio frequency antennas and waveguides for communication between i...

Embedded bridge die with through-silicon vias

3D package configuration

Semiconductor device

Display device

Semiconductor device

Arrayed switch circuit, switching element and system chip package s...

Integrated circuit device having redistribution pattern

Semiconductor packaging method, semiconductor assembly and electron...

Methods for producing a 3D semiconductor memory device and structure

Electrical interconnect bridge

Fan-out package structure and method for manufacturing the same

Semiconductor device with interconnectors of different density

EMIB patch on glass laminate substrate

Multi-chip module leadless package

Multi-die ultrafine pitch patch architecture of interconnect bridge...

Guard ring design enabling in-line testing of silicon bridges for s...

Semiconductor package structure having an annular frame with trunca...

Semiconductor package

Composite bridge die-to-die interconnects for integrated-circuit pa...

Integrated circuit device with embedded programmable logic

Interface bridge between integrated circuit die

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY

FULLY MOLDED STRUCTURE WITH MULTI-HEIGHT COMPONENTS COMPRISING BACK...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

WIRELESS INTERCONNECTS IN INTEGRATED CIRCUIT PACKAGE SUBSTRATES WIT...

INSULATED CHIP AND SIGNAL TRANSMITTING DEVICE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE

SEMICONDUCTOR PACKAGE

Chip Singulation Assisted Structures and Methods for Improving Bond...

ENHANCED I/O SEMICONDUCTOR CHIP PACKAGE AND COOLING ASSEMBLY HAVING...

PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE

Power Converter, Package Structure, and Heat Dissipation Structure

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

HEAT RADIATION DEVICES

PACKAGE STRUCTURE

IMPROVING SIZE AND EFFICIENCY OF DIES

HEAT DISSIPATION MEMBER

SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...

SEMICONDUCTOR PACKAGE COMPRISING STIFFENER STRUCTURE

SEAL RINGS IN INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

POWER SEMICONDUCTOR MODULE HAVING A METALLIC CLIP WITH ULTRASONICAL...