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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/0655the devices being arranged next to each other

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for laser drilling process for an integrated circuit package
- Patent number 12,368,053
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Shen Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package structure with ring structure
- Patent number 12,368,080
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device, and tiled display device including the display device
- Patent number 12,368,135
- Issue date Jul 22, 2025
- Samsung Display Co., Ltd.
- Hyun Joon Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor packages including dam patterns and methods for manuf...
- Patent number 12,368,134
- Issue date Jul 22, 2025
- SK hynix Inc.
- Shin Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including passivation...
- Patent number 12,368,090
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer structure for semiconductor package including peripheral...
- Patent number 12,368,109
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parameter exchange for a die-to-die interconnect
- Patent number 12,360,934
- Issue date Jul 15, 2025
- Intel Corporation
- Debendra Das Sharma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package assembly including package substrate with elongated solder...
- Patent number 12,362,268
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,362,309
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with underfill
- Patent number 12,362,196
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 12,362,219
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package structure
- Patent number 12,362,256
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with ball grid array connection having improv...
- Patent number 12,362,307
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar magnetic radial inductors to enable VR disaggregation
- Patent number 12,362,295
- Issue date Jul 15, 2025
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer sheet for mold underfill encapsulation, method for mold...
- Patent number 12,362,310
- Issue date Jul 15, 2025
- Nagase Chemtex Corporation
- Daisuke Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protruding SN substrate features for epoxy flow control
- Patent number 12,362,250
- Issue date Jul 15, 2025
- Intel Corporation
- Edvin Cetegen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double seal ring and electrical connection of multiple chiplets
- Patent number 12,362,293
- Issue date Jul 15, 2025
- MARVELL ASIA PTE. LTD.
- Lijuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,354,927
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate and a high-density interconnect inte...
- Patent number 12,355,000
- Issue date Jul 8, 2025
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hyperchip
- Patent number 12,355,002
- Issue date Jul 8, 2025
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing
- Patent number 12,354,938
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D package configuration
- Patent number 12,354,942
- Issue date Jul 8, 2025
- CCS TECHNOLOGY CORPORATION
- Tung-Po Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,354,928
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 12,355,001
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Chu Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method for manufacturing the same
- Patent number 12,354,926
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under chip bridge
- Patent number 12,354,964
- Issue date Jul 8, 2025
- FRONTGRADE TECHNOLOGIES INC.
- Sean Thorne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, electronic structure and manufacturing method t...
- Patent number 12,354,885
- Issue date Jul 8, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structure with support features and methods
- Patent number 12,354,940
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,349,327
- Issue date Jul 1, 2025
- Murata Manufacturing Co., Ltd.
- Shota Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
- Patent number 12,347,802
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD OF ELECTRONIC PACKAGE
- Publication number 20250239530
- Publication date Jul 24, 2025
- VIA TECHNOLOGIES, INC.
- Yeh-Chi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH REINFORCEMENT STRUCTURES
- Publication number 20250239514
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cong-Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250239536
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250239560
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Tetsuo YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS CONDITION MEASUREMENT DEVICE INCLUDING THERMALLY ISOLATED E...
- Publication number 20250239473
- Publication date Jul 24, 2025
- KLA Corporation
- Farhat A. Quli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE CHIP MODULE DIRECT ATTACH COOLING
- Publication number 20250233051
- Publication date Jul 17, 2025
- International Business Machines Corporation
- Mark D. Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250233076
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH HEAT DISSIPATION STRUCTURE HAVING ONE OR MOR...
- Publication number 20250233047
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20250233077
- Publication date Jul 17, 2025
- Mitsubishi Electric Corporation
- Maki HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR ELECTRONIC DEVICE
- Publication number 20250233031
- Publication date Jul 17, 2025
- SOITEC
- Hugo Biard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250233083
- Publication date Jul 17, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250233098
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Huan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20250233039
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250233111
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250233119
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMUNICATION SYSTEM BETWEEN DIES AND OPERATION METHOD THEREOF
- Publication number 20250225100
- Publication date Jul 10, 2025
- GLOBAL UNICHIP CORPORATION
- Yung-Sheng Fang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226329
- Publication date Jul 10, 2025
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMUNICATION SYSTEM BETWEEN DIES AND OPERATION METHOD THEREOF
- Publication number 20250225101
- Publication date Jul 10, 2025
- GLOBAL UNICHIP CORPORATION
- Yung-Sheng Fang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR WIRING SUBSTRATE THE...
- Publication number 20250226330
- Publication date Jul 10, 2025
- Global Unichip Corporation
- Wei-Chiao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MISMATCH REDUCTION IN SEMICONDUCTOR DEVICE MODULES
- Publication number 20250226284
- Publication date Jul 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SUBSTRATE WITH EMBEDDED COMPONENT
- Publication number 20250226302
- Publication date Jul 10, 2025
- QUALCOMM Incorporated
- Yeoil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250226315
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Kohji KANAMORI
- G11 - INFORMATION STORAGE
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226317
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226325
- Publication date Jul 10, 2025
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250226336
- Publication date Jul 10, 2025
- MEDIATEK SINGAPORE PTE LTD
- Zhigang DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
V-BONDING USING DOUBLE STACKED STAND-OFF-STITCH FOR IMPROVED RF PER...
- Publication number 20250226352
- Publication date Jul 10, 2025
- Lumentum Technology (UK) Limited
- Angelito Pizarro LAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATE...
- Publication number 20250219034
- Publication date Jul 3, 2025
- Celestial AI Inc.
- Matteo Staffaroni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION GOLD-ELECTROLESS PALLADIUM-IMMERSION GOLD (IGEPIG) AS A S...
- Publication number 20250218910
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...
- Publication number 20250218880
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID-BASED METHOD FOR EMBEDDING COMPONENTS IN THICK SUBSTRATES
- Publication number 20250218881
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi MOHAMMADIGHALENI
- H01 - BASIC ELECTRIC ELEMENTS

the devices being arranged next to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for laser drilling process for an integrated circuit package

Chip package structure with ring structure

Display device, and tiled display device including the display device

Semiconductor packages including dam patterns and methods for manuf...

Method of manufacturing semiconductor device including passivation...

Interposer structure for semiconductor package including peripheral...

Parameter exchange for a die-to-die interconnect

Package assembly including package substrate with elongated solder...

Package structure

Package structure with underfill

3D semiconductor memory device and structure

Method for forming semiconductor package structure

Semiconductor package with ball grid array connection having improv...

Planar magnetic radial inductors to enable VR disaggregation

Multi-layer sheet for mold underfill encapsulation, method for mold...

Protruding SN substrate features for epoxy flow control

Double seal ring and electrical connection of multiple chiplets

Semiconductor device

Package comprising a substrate and a high-density interconnect inte...

Hyperchip

Semiconductor package and methods of manufacturing

3D package configuration

Semiconductor device and manufacturing method thereof

Semiconductor package structure and method for forming the same

Package and method for manufacturing the same

Under chip bridge

Electronic package, electronic structure and manufacturing method t...

Redistribution layer structure with support features and methods

Module

Die corner removal for underfill crack suppression in semiconductor...

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD OF ELECTRONIC PACKAGE

SEMICONDUCTOR PACKAGES WITH REINFORCEMENT STRUCTURES

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE

PROCESS CONDITION MEASUREMENT DEVICE INCLUDING THERMALLY ISOLATED E...

MULTIPLE CHIP MODULE DIRECT ATTACH COOLING

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE WITH HEAT DISSIPATION STRUCTURE HAVING ONE OR MOR...

POWER SEMICONDUCTOR DEVICE

SUBSTRATE FOR ELECTRONIC DEVICE

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE

METHOD OF FABRICATING PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

COMMUNICATION SYSTEM BETWEEN DIES AND OPERATION METHOD THEREOF

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

COMMUNICATION SYSTEM BETWEEN DIES AND OPERATION METHOD THEREOF

SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR WIRING SUBSTRATE THE...

THERMAL MISMATCH REDUCTION IN SEMICONDUCTOR DEVICE MODULES

HYBRID SUBSTRATE WITH EMBEDDED COMPONENT

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE

V-BONDING USING DOUBLE STACKED STAND-OFF-STITCH FOR IMPROVED RF PER...

ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATE...

IMMERSION GOLD-ELECTROLESS PALLADIUM-IMMERSION GOLD (IGEPIG) AS A S...

MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...

LIQUID-BASED METHOD FOR EMBEDDING COMPONENTS IN THICK SUBSTRATES