the devices being connected to a common substrate

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/97the devices being connected to a common substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device with top side pin array and manufacturing method...
- Patent number 12,205,827
- Issue date Jan 21, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,199,024
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging semiconduct...
- Patent number 12,191,163
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having improved reliability and inspe...
- Patent number 12,183,707
- Issue date Dec 31, 2024
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 12,183,596
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,159,839
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures, packaged semiconductor devices, and method...
- Patent number 12,159,862
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked staggered electrode foil capacitor structures in semiconduc...
- Patent number 12,154,940
- Issue date Nov 26, 2024
- SARAS MICRO DEVICES, INC.
- Richard P. Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming large chips through stitching
- Patent number 12,148,719
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip integrated fan-out package
- Patent number 12,148,728
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in the packaging of integrated circuits
- Patent number 12,144,065
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etched trenches in bond materials for die singulation, and associat...
- Patent number 12,132,155
- Issue date Oct 29, 2024
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with fan-out feature
- Patent number 12,125,797
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 12,119,263
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 12,119,338
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 12,094,729
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in embedded wafer-level ball-grid array package
- Patent number 12,094,843
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing light emitting devices
- Patent number 12,080,695
- Issue date Sep 3, 2024
- Nichia Corporation
- Kenji Ozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated fan-out package having fan-ou...
- Patent number 12,080,615
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of chip package with fan-out structure
- Patent number 12,080,653
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250029951
- Publication date Jan 23, 2025
- Advanced Semiconductor Engineering, Inc.
- Kay Stefan ESSIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Manufacture
- Publication number 20250022763
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Preparation Method of Chip Package Structure and Package Structure
- Publication number 20250022827
- Publication date Jan 16, 2025
- Guangdong Fozhixin Microelectronics Technology Research Co., Ltd
- Xiangang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20250015030
- Publication date Jan 9, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...
- Publication number 20250015021
- Publication date Jan 9, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC...
- Publication number 20250015002
- Publication date Jan 9, 2025
- AOI ELECTRONICS CO., LTD.
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR BONDING DIES
- Publication number 20250006689
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF
- Publication number 20250006596
- Publication date Jan 2, 2025
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS
- Publication number 20250006510
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006577
- Publication date Jan 2, 2025
- Innolux Corporation
- Mei-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH RETREATING METAL LAYERS
- Publication number 20250006607
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C. MOLINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES
- Publication number 20250006693
- Publication date Jan 2, 2025
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
- Publication number 20240429191
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure and manufacturing method thereof
- Publication number 20240429220
- Publication date Dec 26, 2024
- UNITED MICROELECTRONICS CORP.
- Chiu-Te Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BO...
- Publication number 20240429199
- Publication date Dec 26, 2024
- Intel Corporation
- Yi Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A FAN-OUT SEMICONDUCTOR ASSEMBLY WITH AN INTERMEDI...
- Publication number 20240429201
- Publication date Dec 26, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED STRUCTURE WITH MULTI-HEIGHT COMPONENTS COMPRISING BACK...
- Publication number 20240421017
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Clifford Sandstrom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421051
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421129
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- SEUNGDUK BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...
- Publication number 20240421055
- Publication date Dec 19, 2024
- STMicroelectronics International N.V.
- Loic Pierre Louis RENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20240413059
- Publication date Dec 12, 2024
- JCET GROUP CO., LTD.
- Lei ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BODY AND PREPARATION METHOD THEREFOR
- Publication number 20240404938
- Publication date Dec 5, 2024
- SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.
- Shijie ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH IMPROVED BOARD LEVEL RELIABILITY
- Publication number 20240404937
- Publication date Dec 5, 2024
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES, SYSTEMS AND METHODS RELATED TO DUAL-SIDED MODULES
- Publication number 20240405009
- Publication date Dec 5, 2024
- Skyworks Solutions, Inc.
- Sundeep Nand NANGALIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES, PACKAGED SEMICONDUCTOR DEVICES, AND METHOD...
- Publication number 20240395782
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240395721
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395771
- Publication date Nov 28, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...
- Publication number 20240395792
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS

the devices being connected to a common substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device with top side pin array and manufacturing method...

Selective micro device transfer to receiver substrate

Semiconductor device and method of manufacture

Package structure

Packaged semiconductor devices and methods of packaging semiconduct...

Packaged semiconductor device having improved reliability and inspe...

Low cost package warpage solution

Single-shot encapsulation

Semiconductor packages

Interconnect structures, packaged semiconductor devices, and method...

Stacked staggered electrode foil capacitor structures in semiconduc...

Solder reflow apparatus and method of manufacturing an electronic d...

Forming large chips through stitching

Multi-chip integrated fan-out package

Warpage control in the packaging of integrated circuits

Tools and systems for processing semiconductor devices, and methods...

Etched trenches in bond materials for die singulation, and associat...

Package structure with fan-out feature

Methods and apparatus for an improved integrated circuit package

Semiconductor bonding structures and methods

Semiconductor device packages, packaging methods, and packaged semi...

Leadframe package with pre-applied filler material

Semiconductor device with encapsulant deposited along sides and sur...

Antenna in embedded wafer-level ball-grid array package

Semiconductor device assembly with surface-mount die support struct...

Method for manufacturing light emitting devices

Method of manufacturing an integrated fan-out package having fan-ou...

Formation method of chip package with fan-out structure

Methods and devices for fabricating and assembling printable semico...

Selective transfer of micro devices

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

Semiconductor Device and Methods of Manufacture

Preparation Method of Chip Package Structure and Package Structure

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...

SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC...

STRUCTURES AND METHODS FOR BONDING DIES

QFN PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF

SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH RETREATING METAL LAYERS

METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES

SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...

Semiconductor structure and manufacturing method thereof

METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BO...

METHOD OF MAKING A FAN-OUT SEMICONDUCTOR ASSEMBLY WITH AN INTERMEDI...

FULLY MOLDED STRUCTURE WITH MULTI-HEIGHT COMPONENTS COMPRISING BACK...

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

PACKAGE BODY AND PREPARATION METHOD THEREFOR

ELECTRONIC COMPONENT WITH IMPROVED BOARD LEVEL RELIABILITY

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

DEVICES, SYSTEMS AND METHODS RELATED TO DUAL-SIDED MODULES

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

INTERCONNECT STRUCTURES, PACKAGED SEMICONDUCTOR DEVICES, AND METHOD...

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...