the devices being of a type provided for in group H01L27/00

Industry

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H01L2225/065

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/065the devices being of a type provided for in group H01L27/00

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Correction die for wafer/die stack
- Patent number 12,237,306
- Issue date Feb 25, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,302
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Kihong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically mounted die groups
- Patent number 12,237,303
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concurrent multi-bit self-referenced read of programmable resistanc...
- Patent number 12,237,010
- Issue date Feb 25, 2025
- SanDisk Technologies, Inc.
- Nathan Franklin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy structure of stacked and bonded semiconductor device
- Patent number 12,237,291
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through stack bridge bonding devices and associated methods
- Patent number 12,237,301
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,308
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having plural stacked first chips sealed in a...
- Patent number 12,237,315
- Issue date Feb 25, 2025
- Kioxia Corporation
- Takayuki Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density through silicon conductive structures
- Patent number 12,237,244
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,237,276
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bump interface compatible with different orientations and type...
- Patent number 12,237,287
- Issue date Feb 25, 2025
- Xilinx, Inc.
- Ygal Arbel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 12,237,253
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jun Hyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having supportive plating structures
- Patent number 12,237,275
- Issue date Feb 25, 2025
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for direct bonding in semiconductor die manufac...
- Patent number 12,237,299
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Chia Jung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having pads with stepped structure
- Patent number 12,237,309
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Myung Kee Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 12,237,305
- Issue date Feb 25, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-chip packages
- Patent number 12,237,319
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Daeho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies employing copper in multiple locations
- Patent number 12,230,596
- Issue date Feb 18, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising stacked integrated devices with overhang
- Patent number 12,230,604
- Issue date Feb 18, 2025
- QUALCOMM Incorporated
- Krishna Vemuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided substrate with cavities for direct die-to-die intercon...
- Patent number 12,230,610
- Issue date Feb 18, 2025
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor package including horizontally stacked dies...
- Patent number 12,230,613
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die on interposer packages
- Patent number 12,230,582
- Issue date Feb 18, 2025
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,230,606
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory component with input/output data rate alignment
- Patent number 12,229,435
- Issue date Feb 18, 2025
- RAMBUS INC.
- Frederick A. Ware
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Shield structure for backside through substrate vias (TSVs)
- Patent number 12,230,554
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,230,560
- Issue date Feb 18, 2025
- Mediatek Inc.
- Che-Hung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,230,609
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with system and methods for conveying sign...
- Patent number 12,230,608
- Issue date Feb 18, 2025
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PROTECTIVE LAYER WITH FILLERS
- Publication number 20250069969
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Daehyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Switches in Interconnect Structures and the Method Forming th...
- Publication number 20250070011
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE DEVICE INCLUDING REDISTRIBUTION DIE
- Publication number 20250070086
- Publication date Feb 27, 2025
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-DIMENSIONAL ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250070089
- Publication date Feb 27, 2025
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Suk Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250071991
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Sangwoo HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR...
- Publication number 20250070070
- Publication date Feb 27, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Mirko BERNARDONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20250070085
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsang-Jiuh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250070087
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- JOO-YOUNG OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MEMORY DEVICES WITH MIXED-BANDWIDTH MEMORY DIES
- Publication number 20250070090
- Publication date Feb 27, 2025
- Micron Technology, Inc.
- Dong Uk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20250070091
- Publication date Feb 27, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070048
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Dawoon JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING DAM AND MULTI-LAYERED UNDER-FILL L...
- Publication number 20250070072
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Seongyo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES, METHODS FOR FABRICATING THE SAME AND...
- Publication number 20250071992
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Min Yong Lee
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MEMORY STRINGS ARRANGED IN A VERTICAL D...
- Publication number 20250072001
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Hanbyeol LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250069971
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Yong Hoe CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND PACKAGE STRUCTURE
- Publication number 20250070006
- Publication date Feb 27, 2025
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070088
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- JINHEE HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHARED PAD/BRIDGE LAYOUT FOR A 3D IC
- Publication number 20250070092
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250072005
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Kilho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250069980
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250070039
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Kwangyong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES AND METHODS FOR ASSEMBLING POWER MODULES
- Publication number 20250070093
- Publication date Feb 27, 2025
- MURATA MANUFACTURING CO., LTD.
- Laurence McGarry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND MECHANISM FOR PROCESSING NEURAL NETWORK TASKS USING A...
- Publication number 20250068897
- Publication date Feb 27, 2025
- Google LLC
- Uday Kumar Dasari
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING STOPPER LAYER AND ELECTRONIC SYSTEM...
- Publication number 20250072064
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Hyemi LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062177
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Han Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250062304
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- SEOKGEUN AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package With Thermal Conductive Structure and the Met...
- Publication number 20250062181
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING TH...
- Publication number 20250062202
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yi Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED STRUCTURAL STABILITY
- Publication number 20250062240
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- MyungDo Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062283
- Publication date Feb 20, 2025
- SK HYNIX INC.
- Seong Ju LEE
- H01 - BASIC ELECTRIC ELEMENTS

the devices being of a type provided for in group H01L27/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Correction die for wafer/die stack

Semiconductor package

Vertically mounted die groups

Concurrent multi-bit self-referenced read of programmable resistanc...

Dummy structure of stacked and bonded semiconductor device

Through stack bridge bonding devices and associated methods

Semiconductor package

Semiconductor device having plural stacked first chips sealed in a...

High density through silicon conductive structures

Package structure

Chip bump interface compatible with different orientations and type...

Integrated circuit structure

Semiconductor package and method for fabricating the same

Semiconductor devices having supportive plating structures

Systems and methods for direct bonding in semiconductor die manufac...

Semiconductor package having pads with stepped structure

Integrated circuit package having wirebonded multi-die stack

Stacked-chip packages

Electronics assemblies employing copper in multiple locations

Package comprising stacked integrated devices with overhang

Double-sided substrate with cavities for direct die-to-die intercon...

Vertical semiconductor package including horizontally stacked dies...

Embedded die on interposer packages

Semiconductor package and related methods

Memory component with input/output data rate alignment

Shield structure for backside through substrate vias (TSVs)

Semiconductor device and method of forming micro interconnect struc...

Semiconductor package structure

Semiconductor packages

Semiconductor assemblies with system and methods for conveying sign...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING PROTECTIVE LAYER WITH FILLERS

Power Switches in Interconnect Structures and the Method Forming th...

PACKAGE-ON-PACKAGE DEVICE INCLUDING REDISTRIBUTION DIE

3-DIMENSIONAL ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

STACKED MEMORY DEVICES WITH MIXED-BANDWIDTH MEMORY DIES

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE COMPRISING DAM AND MULTI-LAYERED UNDER-FILL L...

SEMICONDUCTOR MEMORY DEVICES, METHODS FOR FABRICATING THE SAME AND...

SEMICONDUCTOR DEVICE HAVING MEMORY STRINGS ARRANGED IN A VERTICAL D...

SEMICONDUCTOR PACKAGE

PACKAGE SUBSTRATE AND PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

SHARED PAD/BRIDGE LAYOUT FOR A 3D IC

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

POWER MODULES AND METHODS FOR ASSEMBLING POWER MODULES

APPARATUS AND MECHANISM FOR PROCESSING NEURAL NETWORK TASKS USING A...

SEMICONDUCTOR DEVICE INCLUDING STOPPER LAYER AND ELECTRONIC SYSTEM...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Package With Thermal Conductive Structure and the Met...

PACKAGE STRUCTURE, SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING TH...

SEMICONDUCTOR PACKAGE WITH IMPROVED STRUCTURAL STABILITY

SEMICONDUCTOR PACKAGE