the devices being of a type provided for in group H01L27/00

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

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H01L25/065the devices being of a type provided for in group H01L27/00

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages
- Patent number 12,283,555
- Issue date Apr 22, 2025
- Analog Devices International Unlimited Company
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for semiconductor, production method therefor, and semicon...
- Patent number 12,283,565
- Issue date Apr 22, 2025
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,283,545
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures for three-dimensional memory devices and methods...
- Patent number 12,283,547
- Issue date Apr 22, 2025
- Yangtze Memory Technologies Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 12,283,549
- Issue date Apr 22, 2025
- Apple Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,283,556
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding alignment
- Patent number 12,283,568
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,283,570
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,283,569
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra high-bandwidth artificial intelligence (AI) processor with DR...
- Patent number 12,283,571
- Issue date Apr 22, 2025
- Kepler Computing Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of forming the same
- Patent number 12,283,537
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,283,543
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended seal ring structure on wafer-stacking
- Patent number 12,283,552
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with warpage release layer structure in package a...
- Patent number 12,283,553
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,283,564
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symbiotic network on layers
- Patent number 12,283,572
- Issue date Apr 22, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,283,566
- Issue date Apr 22, 2025
- Rohm Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array dependent voltage compensation in a memory device
- Patent number 12,283,324
- Issue date Apr 22, 2025
- SanDisk Technologies, Inc.
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor wafer seal ring having protrusion extending into tren...
- Patent number 12,278,151
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 12,278,160
- Issue date Apr 15, 2025
- Google LLC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory device with a conductive etch stop layer, metho...
- Patent number 12,278,201
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 12,278,211
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator and passive components
- Patent number 12,278,215
- Issue date Apr 15, 2025
- Adeia Semiconductor Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device interface and method
- Patent number 12,277,056
- Issue date Apr 15, 2025
- Micron Technology, Inc.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High bandwidth package structure
- Patent number 12,278,166
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including through substrate via barrier structure...
- Patent number 12,278,167
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package
- Patent number 12,278,171
- Issue date Apr 15, 2025
- Infineon Technologies AG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding of packaged magnetic random access memory
- Patent number 12,278,195
- Issue date Apr 15, 2025
- Avalanche Technology, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus including LED with plurality of light emitting la...
- Patent number 12,278,256
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 12,278,154
- Issue date Apr 15, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250132232
- Publication date Apr 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Jen-Hao PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250132275
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Sangho Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132296
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20250131953
- Publication date Apr 24, 2025
- Rambus Inc.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Application
PACKAGE WITH BACK-TO-BACK DIE STACKING
- Publication number 20250132240
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Faxing CHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132241
- Publication date Apr 24, 2025
- Siliconware Precision Industries Co., Ltd.
- Chung-Chih YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250132268
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY PACKAGING WITH INTEGRATED ACTIVE COOLING DEVICES AND RELATED...
- Publication number 20250132290
- Publication date Apr 24, 2025
- SMART Modular Technologies, Inc.
- Satyanarayan Iyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250133738
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Chulmin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH SIDE-BY-SIDE INTEGRATED CIRCUIT DEVICES
- Publication number 20250132292
- Publication date Apr 24, 2025
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132294
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250132187
- Publication date Apr 24, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE HAVING HEXAGONAL MEMORY CELLS WITH GATE-ALL-AROUND TR...
- Publication number 20250133724
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH DIFFERENT WIDTH SUPPORT PILLAR...
- Publication number 20250133737
- Publication date Apr 24, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Tomohiro KUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK TYPE SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250133752
- Publication date Apr 24, 2025
- SK HYNIX INC.
- Hee Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250133656
- Publication date Apr 24, 2025
- LG Innotek Co., Ltd.
- Sang Il KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20250133731
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- JOONGWON SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICON...
- Publication number 20250132266
- Publication date Apr 24, 2025
- Universal Global Technology(Shanghai)Co.,Ltd.
- Yao LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...
- Publication number 20250132286
- Publication date Apr 24, 2025
- Yibu Semiconductor Co., Ltd.
- Wenqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Dual-Sided Bridge Die P...
- Publication number 20250132291
- Publication date Apr 24, 2025
- STATS ChipPAC Pte Ltd.
- DanFeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250131961
- Publication date Apr 24, 2025
- SK HYNIX INC.
- Won Jae CHOI
- G11 - INFORMATION STORAGE
Information Patent Application
HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPL...
- Publication number 20250132666
- Publication date Apr 24, 2025
- MURATA MANUFACTURING CO., LTD.
- David GIULIANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat-Electricity Discrete Power Module Including Two-Way Heat-Dissi...
- Publication number 20250132233
- Publication date Apr 24, 2025
- ICP TECHNOLOGY CO., LTD.
- HO-CHIEH YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package And Method Of Fabricating The Same
- Publication number 20250132263
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Hae-Jung YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH TAMPER PREVENTION
- Publication number 20250132270
- Publication date Apr 24, 2025
- ADVANCED MICRO DEVICES, INC.
- Mohit ARORA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250132274
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Hansung Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...
- Publication number 20250132287
- Publication date Apr 24, 2025
- Yibu Semiconductor Co., Ltd.
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID HIGH BANDWIDTH MEMORY STACK
- Publication number 20250132293
- Publication date Apr 24, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE ASSEMBLIES WITH INK-...
- Publication number 20250132209
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED PACKAGING FOR FLIP-CHIP DEVICES
- Publication number 20250132222
- Publication date Apr 24, 2025
- Qorvo US, Inc.
- Matthew Tyler Irvine
- H01 - BASIC ELECTRIC ELEMENTS

the devices being of a type provided for in group H01L27/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages

Adhesive for semiconductor, production method therefor, and semicon...

Package structure and method of manufacturing the same

Contact structures for three-dimensional memory devices and methods...

High density interconnection using fanout interposer chiplet

Package structure

Wafer bonding alignment

Package structure

Semiconductor device package and a method of manufacturing the same

Ultra high-bandwidth artificial intelligence (AI) processor with DR...

Electronic package and method of forming the same

Semiconductor packages

Extended seal ring structure on wafer-stacking

Semiconductor die with warpage release layer structure in package a...

Semiconductor structure and manufacturing method thereof

Symbiotic network on layers

Semiconductor device and method for manufacturing the same

Array dependent voltage compensation in a memory device

Semiconductor wafer seal ring having protrusion extending into tren...

Methods and heat distribution devices for thermal management of chi...

Non-volatile memory device with a conductive etch stop layer, metho...

Manufacturing method of semiconductor device

Integrated voltage regulator and passive components

Memory device interface and method

High bandwidth package structure

Semiconductor die including through substrate via barrier structure...

Chip package and method of forming a chip package

Shielding of packaged magnetic random access memory

Display apparatus including LED with plurality of light emitting la...

Semiconductor device and a method of manufacturing a semiconductor...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

PACKAGE WITH BACK-TO-BACK DIE STACKING

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

MEMORY PACKAGING WITH INTEGRATED ACTIVE COOLING DEVICES AND RELATED...

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

DEVICE WITH SIDE-BY-SIDE INTEGRATED CIRCUIT DEVICES

PACKAGE AND MANUFACTURING METHOD THEREOF

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

MEMORY DEVICE HAVING HEXAGONAL MEMORY CELLS WITH GATE-ALL-AROUND TR...

THREE-DIMENSIONAL MEMORY DEVICE WITH DIFFERENT WIDTH SUPPORT PILLAR...

STACK TYPE SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICON...

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...

Semiconductor Device and Method of Making a Dual-Sided Bridge Die P...

SEMICONDUCTOR DEVICE

HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPL...

Heat-Electricity Discrete Power Module Including Two-Way Heat-Dissi...

Semiconductor Package And Method Of Fabricating The Same

CHIP PACKAGE WITH TAMPER PREVENTION

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...

HYBRID HIGH BANDWIDTH MEMORY STACK

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE ASSEMBLIES WITH INK-...

ENHANCED PACKAGING FOR FLIP-CHIP DEVICES