the devices being of a type provided for in group H01L27/00

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

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H01L25/065the devices being of a type provided for in group H01L27/00

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for laser drilling process for an integrated circuit package
- Patent number 12,368,053
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Shen Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic devices with through-substrate interconnects and as...
- Patent number 12,368,096
- Issue date Jul 22, 2025
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 12,368,104
- Issue date Jul 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Hung-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,368,138
- Issue date Jul 22, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for using spacer-on-spacer design for solder...
- Patent number 12,368,113
- Issue date Jul 22, 2025
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,368,122
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Jinhee Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including stacked pillar portions and method for...
- Patent number 12,368,123
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method of manufacturing the semiconduct...
- Patent number 12,368,136
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Hyunsu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with isolation trenches in upper portions o...
- Patent number 12,369,333
- Issue date Jul 22, 2025
- Yi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field programmable platform array
- Patent number 12,366,882
- Issue date Jul 22, 2025
- Movellus Circuits Inc.
- Mohammad Faisal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked column floorplan for NAND
- Patent number 12,367,931
- Issue date Jul 22, 2025
- SanDisk Technologies, Inc.
- Yuki Mizutani
- G11 - INFORMATION STORAGE
Information Patent Grant
Chip package structure with ring structure
- Patent number 12,368,080
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device, and tiled display device including the display device
- Patent number 12,368,135
- Issue date Jul 22, 2025
- Samsung Display Co., Ltd.
- Hyun Joon Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor memory device
- Patent number 12,368,121
- Issue date Jul 22, 2025
- SK hynix Inc.
- Yu Jin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive coupling system and method for adaptive control of power...
- Patent number 12,368,324
- Issue date Jul 22, 2025
- Zhejiang University
- Xiaolei Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method comprising formation of redistribu...
- Patent number 12,368,077
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,368,119
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including dam patterns and methods for manuf...
- Patent number 12,368,134
- Issue date Jul 22, 2025
- SK hynix Inc.
- Shin Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management
- Patent number 12,367,939
- Issue date Jul 22, 2025
- Micron Technology, Inc.
- Liang Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,368,084
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having underfill material surrounding a...
- Patent number 12,368,127
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including passivation...
- Patent number 12,368,090
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer structure for semiconductor package including peripheral...
- Patent number 12,368,109
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth die to die interconnect with package area reduction
- Patent number 12,368,137
- Issue date Jul 22, 2025
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory devices and methods of manufacturing thereof
- Patent number 12,369,316
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Electrostatic discharge protection for integrated circuit during ba...
- Patent number 12,369,406
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Yu Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parameter exchange for a die-to-die interconnect
- Patent number 12,360,934
- Issue date Jul 15, 2025
- Intel Corporation
- Debendra Das Sharma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonded memory devices and methods of making the same
- Patent number 12,362,301
- Issue date Jul 15, 2025
- SanDisk Technologies, Inc.
- Adarsh Rajashekhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding layer and process of making
- Patent number 12,362,304
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Robert D. Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with balanced wiring structure
- Patent number 12,362,313
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250237830
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD OF ELECTRONIC PACKAGE
- Publication number 20250239530
- Publication date Jul 24, 2025
- VIA TECHNOLOGIES, INC.
- Yeh-Chi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND MECHANISM FOR PROCESSING NEURAL NETWORK TASKS USING A...
- Publication number 20250238668
- Publication date Jul 24, 2025
- Google LLC
- Uday Kumar Dasari
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY DEVICE
- Publication number 20250240979
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Kohji KANAMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH REINFORCEMENT STRUCTURES
- Publication number 20250239514
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cong-Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...
- Publication number 20250239548
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yung Lin Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250239553
- Publication date Jul 24, 2025
- KIOXIA Corporation
- Keisuke NAKATSUKA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE, METHOD OF FABRICATING THE SAME, AND EL...
- Publication number 20250240957
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Hoon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES HAVING REFLECTIVE STRUCTURES THEREIN THA...
- Publication number 20250240958
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Seongkeun Cho
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor structure with a deep trench capacitor structures and...
- Publication number 20250240985
- Publication date Jul 24, 2025
- UNITED MICROELECTRONICS CORP.
- Yi-Fan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH DIE AND COPPER POSTS
- Publication number 20250239507
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- GUANGXU LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTE...
- Publication number 20250239522
- Publication date Jul 24, 2025
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...
- Publication number 20250239528
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250239536
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239571
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Jaejun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239572
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250240980
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- KEONWOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CAPACITY HIGH BANDWIDTH NON-VOLATILE MEMORY DEVICE
- Publication number 20250239510
- Publication date Jul 24, 2025
- SANDISK TECHNOLOGIES, INC.
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250239512
- Publication date Jul 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Che-Neng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239554
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Wonil Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250239560
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Tetsuo YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
- Publication number 20250239570
- Publication date Jul 24, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH MEMORY
- Publication number 20250240977
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- CHI WOO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20250240978
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Soochan CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY FOR PROVIDING AN ENHANCED MEMORY BANDWIDTH A...
- Publication number 20250239509
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Han-Jong Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION...
- Publication number 20250239543
- Publication date Jul 24, 2025
- SK HYNIX INC.
- Jae Yong AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239552
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Discrete Three-Dimensional Processor
- Publication number 20250239580
- Publication date Jul 24, 2025
- ShenZhen CunDi Technology Co., Ltd.
- Guobiao ZHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROCESS CONDITION MEASUREMENT DEVICE INCLUDING THERMALLY ISOLATED E...
- Publication number 20250239473
- Publication date Jul 24, 2025
- KLA Corporation
- Farhat A. Quli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRUTH TABLE EXTENSION FOR STACKED MEMORY SYSTEMS
- Publication number 20250238166
- Publication date Jul 24, 2025
- Micron Technology, Inc.
- Joseph T. Pawlowski
- G06 - COMPUTING CALCULATING COUNTING

the devices being of a type provided for in group H01L27/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for laser drilling process for an integrated circuit package

Microelectronic devices with through-substrate interconnects and as...

Electronic package

3D semiconductor device and structure with metal layers

Methods and apparatus for using spacer-on-spacer design for solder...

Semiconductor package

Package structure including stacked pillar portions and method for...

Semiconductor package and a method of manufacturing the semiconduct...

Microelectronic devices with isolation trenches in upper portions o...

Field programmable platform array

Stacked column floorplan for NAND

Chip package structure with ring structure

Display device, and tiled display device including the display device

Semiconductor memory device

Inductive coupling system and method for adaptive control of power...

Semiconductor package and method comprising formation of redistribu...

Semiconductor package

Semiconductor packages including dam patterns and methods for manuf...

Power management

Package structure and manufacturing method thereof

Semiconductor chip package having underfill material surrounding a...

Method of manufacturing semiconductor device including passivation...

Interposer structure for semiconductor package including peripheral...

High bandwidth die to die interconnect with package area reduction

Semiconductor memory devices and methods of manufacturing thereof

Electrostatic discharge protection for integrated circuit during ba...

Parameter exchange for a die-to-die interconnect

Bonded memory devices and methods of making the same

Bonding layer and process of making

Semiconductor package with balanced wiring structure

Patents Applicationslast 30 patents

OPTICAL DEVICES AND METHODS OF MANUFACTURE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD OF ELECTRONIC PACKAGE

APPARATUS AND MECHANISM FOR PROCESSING NEURAL NETWORK TASKS USING A...

MEMORY DEVICE

SEMICONDUCTOR PACKAGES WITH REINFORCEMENT STRUCTURES

BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR MEMORY DEVICE, METHOD OF FABRICATING THE SAME, AND EL...

INTEGRATED CIRCUIT DEVICES HAVING REFLECTIVE STRUCTURES THEREIN THA...

Semiconductor structure with a deep trench capacitor structures and...

IC PACKAGE WITH DIE AND COPPER POSTS

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTE...

SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MEMORY DEVICE

HIGH CAPACITY HIGH BANDWIDTH NON-VOLATILE MEMORY DEVICE

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS

HIGH BANDWIDTH MEMORY

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

SEMICONDUCTOR ASSEMBLY FOR PROVIDING AN ENHANCED MEMORY BANDWIDTH A...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION...

SEMICONDUCTOR PACKAGE

Discrete Three-Dimensional Processor

PROCESS CONDITION MEASUREMENT DEVICE INCLUDING THERMALLY ISOLATED E...

TRUTH TABLE EXTENSION FOR STACKED MEMORY SYSTEMS