the devices being of a type provided for in group H01L27/00

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/065the devices being of a type provided for in group H01L27/00

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,210,188
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,211,829
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and data storage systems including the same
- Patent number 12,213,310
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Seokcheon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arched membrane structure for MEMS device
- Patent number 12,209,013
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhao-Yi Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 12,211,819
- Issue date Jan 28, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Eiichiro Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,211,776
- Issue date Jan 28, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device and method for fabricating semiconduct...
- Patent number 12,211,812
- Issue date Jan 28, 2025
- Kioxia Corporation
- Yuanting Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with shared barrier layer in redistribution a...
- Patent number 12,211,823
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 12,211,873
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Inyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer capping layer for metal arcing protection
- Patent number 12,211,741
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for improving power integrity characteristics
- Patent number 12,213,256
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Junghwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with substrate heat sinks and...
- Patent number 12,211,822
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method of manufacturing the same
- Patent number 12,213,318
- Issue date Jan 28, 2025
- SK hynix Inc.
- Sun Mi Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package including forming cav...
- Patent number 12,205,861
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including monolithic silicon struct...
- Patent number 12,205,865
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having package substrate
- Patent number 12,205,925
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 12,205,926
- Issue date Jan 21, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,205,935
- Issue date Jan 21, 2025
- AISIN CORPORATION
- Takanobu Naruse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,205,939
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold plates incorporating reactive multilayer systems and S-cells
- Patent number 12,207,450
- Issue date Jan 21, 2025
- TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA INC.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,205,914
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Inhyung Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Honeycomb pattern for conductive features
- Patent number 12,205,916
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and packaging method thereof
- Patent number 12,205,940
- Issue date Jan 21, 2025
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,205,946
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concurrent write to programmable resistance memory cells in cross-p...
- Patent number 12,205,638
- Issue date Jan 21, 2025
- SANDISK TECHNOLOGIES LLC
- Nathan Franklin
- G11 - INFORMATION STORAGE
Information Patent Grant
Die to die high-speed communication without discrete amplifiers bet...
- Patent number 12,205,908
- Issue date Jan 21, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogenous bonding layers for direct semiconductor bonding
- Patent number 12,205,921
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module and method for manufacturing electronic...
- Patent number 12,205,858
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Ryohei Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modeling method and apparatus, computer device and storage medium
- Patent number 12,204,841
- Issue date Jan 21, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kun Weng
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
DENDRITE MITIGATION OF PASSIVE COMPONENTS
- Publication number 20250038043
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Jui Shen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE, SEMICONDUCTOR STRUCTURE, AND FABRICATING...
- Publication number 20250038063
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xin Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038090
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Minjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...
- Publication number 20250038091
- Publication date Jan 30, 2025
- CHENGDU HAIGUANG INTEGRATED CIRCUIT DESIGN CO., LTD.
- Shuan Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH CAPACITORS
- Publication number 20250038104
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SYSTEM
- Publication number 20250036583
- Publication date Jan 30, 2025
- KIOXIA Corporation
- Kenji SAKAUE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250040153
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- HYUN-MOOK CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250040154
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Hakseon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250040176
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Youngtaek Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...
- Publication number 20250038059
- Publication date Jan 30, 2025
- JCET STATS ChipPAC Korea Limited
- HyeonChul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038134
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Junbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038149
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- HYUNGJUN JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTRICAL VIAS
- Publication number 20250038151
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Kyuha Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED METAL LINES
- Publication number 20250038152
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, CHIP, ELECTRONIC APPARATUS, MANUFACTURING METHOD...
- Publication number 20250038086
- Publication date Jan 30, 2025
- HYGON INFORMATION TECHNOLOGY CO., LTD.
- Shuan Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Fan-Out Structure and Method of Manufacture
- Publication number 20250038087
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE ERASE PULSE TO IMPROVE MEMORY CELL ENDURANCE AND ERASE TIM...
- Publication number 20250037772
- Publication date Jan 30, 2025
- Western Digital Technologies, Inc.
- Ming Wang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250038095
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Junho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT BRIDGE
- Publication number 20250038114
- Publication date Jan 30, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20250038119
- Publication date Jan 30, 2025
- SK HYNIX INC.
- Hyun Chul SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING DYNAMIC SECURITY FABRIC INTERPOSE...
- Publication number 20250038132
- Publication date Jan 30, 2025
- The Charles Stark Draper Laboratory, Inc.
- Douglas La Tulipe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DIE
- Publication number 20250038133
- Publication date Jan 30, 2025
- MEDIATEK INC.
- Chi-Shun CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250038145
- Publication date Jan 30, 2025
- MEDIATEK INC.
- Tzu-Jui FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20250038148
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE DYNAMIC RANDOM ACCESS MEMORY
- Publication number 20250038162
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Antenna-in-Package St...
- Publication number 20250038058
- Publication date Jan 30, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING AN INTERCONNECTION AREA AND SEMICONDUCTOR...
- Publication number 20250038118
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- YOUNG-DEUK KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038122
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250040053
- Publication date Jan 30, 2025
- Kabushiki Kaisha Toshiba
- Eitaro Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY
- Publication number 20250040231
- Publication date Jan 30, 2025
- Intel Corporation
- Han Wui THEN
- H01 - BASIC ELECTRIC ELEMENTS

the devices being of a type provided for in group H01L27/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Semiconductor package

Semiconductor devices and data storage systems including the same

Arched membrane structure for MEMS device

Method of manufacturing semiconductor device and semiconductor device

Electronic package and manufacturing method thereof

Semiconductor storage device and method for fabricating semiconduct...

Semiconductor package with shared barrier layer in redistribution a...

Package-on-package assembly with wire bond vias

Image sensor

Multi-wafer capping layer for metal arcing protection

Semiconductor package for improving power integrity characteristics

Stacked semiconductor die assemblies with substrate heat sinks and...

Semiconductor memory device and method of manufacturing the same

Manufacturing method of semiconductor package including forming cav...

Semiconductor device assemblies including monolithic silicon struct...

Semiconductor package having package substrate

TSV as pad

Semiconductor device

Semiconductor package

Cold plates incorporating reactive multilayer systems and S-cells

Semiconductor package

Honeycomb pattern for conductive features

Semiconductor package structure and packaging method thereof

Semiconductor device structure and methods of forming the same

Concurrent write to programmable resistance memory cells in cross-p...

Die to die high-speed communication without discrete amplifiers bet...

Heterogenous bonding layers for direct semiconductor bonding

Electronic component module and method for manufacturing electronic...

Modeling method and apparatus, computer device and storage medium

Patents Applicationslast 30 patents

DENDRITE MITIGATION OF PASSIVE COMPONENTS

CHIP PACKAGING STRUCTURE, SEMICONDUCTOR STRUCTURE, AND FABRICATING...

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...

INTEGRATED CIRCUITS WITH CAPACITORS

MEMORY SYSTEM

SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH ELECTRICAL VIAS

EMBEDDED METAL LINES

PACKAGE STRUCTURE, CHIP, ELECTRONIC APPARATUS, MANUFACTURING METHOD...

Heterogeneous Fan-Out Structure and Method of Manufacture

ADAPTIVE ERASE PULSE TO IMPROVE MEMORY CELL ENDURANCE AND ERASE TIM...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

ELECTRICAL INTERCONNECT BRIDGE

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

SYSTEMS AND METHODS FOR PROVIDING DYNAMIC SECURITY FABRIC INTERPOSE...

SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DIE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING SAME

NON-VOLATILE DYNAMIC RANDOM ACCESS MEMORY

Semiconductor Device and Method of Forming an Antenna-in-Package St...

SEMICONDUCTOR CHIP HAVING AN INTERCONNECTION AREA AND SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY