the devices being of a type provided for in group H01L27/00

Industry

CPC
H01L25/065

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/065the devices being of a type provided for in group H01L27/00

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device with heat-conductive cover
- Patent number 12,200,900
- Issue date Jan 14, 2025
- HTC Corporation
- Li-Hsun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including via structure and method for manufac...
- Patent number 12,199,015
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency module and communication device
- Patent number 12,199,052
- Issue date Jan 14, 2025
- Murata Manufacturing Co., Ltd.
- Hiromichi Kitajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and method for preparing same
- Patent number 12,198,942
- Issue date Jan 14, 2025
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier collar for interconnects
- Patent number 12,198,981
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package, package-on-package structure, and manuf...
- Patent number 12,198,996
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous annealing method and device
- Patent number 12,199,069
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper connected glass modules on a glass board
- Patent number 12,199,007
- Issue date Jan 14, 2025
- BROADCOM INTERNATIONAL PTE. LTD.
- Thomas Edward Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and semiconductor device
- Patent number 12,199,053
- Issue date Jan 14, 2025
- Renesas Electronics Corporation
- Shuuichi Kariyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package and method of manufactu...
- Patent number 12,199,056
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxially integrated protection diodes for monochromatic photosen...
- Patent number 12,199,112
- Issue date Jan 14, 2025
- National Technology & Engineering Solutions of Sandia, LLC
- Erik J. Skogen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded liquid cooling
- Patent number 12,199,011
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer structure containing embedded silicon-less link chiplet
- Patent number 12,199,025
- Issue date Jan 14, 2025
- Chengdu ECHINT Technology Co., Ltd.
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable embedded silicon bridge via pillars in lithographically de...
- Patent number 12,199,067
- Issue date Jan 14, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics card including multi-chip module
- Patent number 12,199,080
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including vertically integrated circuits a...
- Patent number 12,199,001
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-dimensional integrated circuits having semiconductors mounted...
- Patent number 12,199,196
- Issue date Jan 14, 2025
- GBT Tokenize Corp.
- Danny Rittman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having uniform multi-package antenna array and...
- Patent number 12,199,333
- Issue date Jan 14, 2025
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic device assemblies and packages
- Patent number 12,199,068
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D NAND memory device devices and related electronic systems
- Patent number 12,199,070
- Issue date Jan 14, 2025
- Lodestar Licensing Group LLC
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible interposer
- Patent number 12,199,026
- Issue date Jan 14, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,199,061
- Issue date Jan 14, 2025
- SK hynix Inc.
- Ha Gyeong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 12,199,066
- Issue date Jan 14, 2025
- Kioxia Corporation
- Gen Toyota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shared pad/bridge layout for a 3D IC
- Patent number 12,191,282
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Facilitating alignment of stacked chiplets
- Patent number 12,191,297
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Robert Clark
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Computer system, memory device formed on a wafer on wafer stack in...
- Patent number 12,189,954
- Issue date Jan 7, 2025
- WHALECHIP CO., LTD.
- Kun-Hua Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including separation patterns and an electroni...
- Patent number 12,193,232
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- JoongShik Shin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250022824
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE DEVICE
- Publication number 20250022846
- Publication date Jan 16, 2025
- FORCE MOS TECHNOLOGY CO., LTD.
- YUAN-SHUN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED INTERCONNECT BRIDGING
- Publication number 20250022847
- Publication date Jan 16, 2025
- ADVANCED MICRO DEVICES, INC.
- LEI FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250022785
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- PYUNGHWA HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022803
- Publication date Jan 16, 2025
- Siliconware Precision Industries Co., Ltd.
- You-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022806
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hong Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDIE SUPPORTS AND RELATED METHODS
- Publication number 20250022813
- Publication date Jan 16, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING CONTROLLED LATERAL ISOLATION...
- Publication number 20250024676
- Publication date Jan 16, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Masanori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS
- Publication number 20250022831
- Publication date Jan 16, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Nam Khong THEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022834
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY INTEGRATED MEMORY SYSTEM AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20250022849
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Lingming Yang
- G11 - INFORMATION STORAGE
Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20250022850
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20250022851
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250022723
- Publication date Jan 16, 2025
- AaltoSemi Inc.
- Min-Yao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interface Bridge Between Integrated Circuit Die
- Publication number 20250021506
- Publication date Jan 16, 2025
- Altera Corporation
- Jeffrey Erik Schulz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PROCESSING ELEMENT AND I/O ELEMENT
- Publication number 20250022848
- Publication date Jan 16, 2025
- Advanced Semiconductor Engineering, Inc.
- Chang Chi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL STACKED DIE STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20250022852
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Chih Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE VIA
- Publication number 20250022961
- Publication date Jan 16, 2025
- ZINITE CORPORATION
- Douglas W. BARLAGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE LEADLESS PACKAGE
- Publication number 20250022781
- Publication date Jan 16, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH STRESS BUFFER PADS AND METHODS...
- Publication number 20250022810
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Hsin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022811
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Myungyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND CIRCUITS
- Publication number 20250022775
- Publication date Jan 16, 2025
- Murata Manufacturing Co., Ltd.
- Shishir RAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH STRESS BUFFER PADS AND METHODS...
- Publication number 20250022789
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Hsin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022843
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022844
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250022845
- Publication date Jan 16, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING ADHESION ENHANCER LAYER AND METHOD...
- Publication number 20250022764
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Minjung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022787
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR...
- Publication number 20250022798
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- HAKSEON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS
- Publication number 20250022808
- Publication date Jan 16, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS

the devices being of a type provided for in group H01L27/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device with heat-conductive cover

Semiconductor device and a manufacturing method thereof

Semiconductor device including via structure and method for manufac...

Radio-frequency module and communication device

Multi-die package structures including redistribution layers

Packaging structure and method for preparing same

Diffusion barrier collar for interconnects

Integrated fan-out package, package-on-package structure, and manuf...

Heterogeneous annealing method and device

Copper connected glass modules on a glass board

Electronic device and semiconductor device

Semiconductor device, semiconductor package and method of manufactu...

Epitaxially integrated protection diodes for monochromatic photosen...

Embedded liquid cooling

Interposer structure containing embedded silicon-less link chiplet

Scalable embedded silicon bridge via pillars in lithographically de...

Electronics card including multi-chip module

Semiconductor assemblies including vertically integrated circuits a...

Multi-dimensional integrated circuits having semiconductors mounted...

Semiconductor device having uniform multi-package antenna array and...

Methods of forming microelectronic device assemblies and packages

3D NAND memory device devices and related electronic systems

Flexible interposer

Semiconductor packages

Semiconductor device and method for producing the same

Shared pad/bridge layout for a 3D IC

Package structure

Facilitating alignment of stacked chiplets

Computer system, memory device formed on a wafer on wafer stack in...

Semiconductor device including separation patterns and an electroni...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

MULTI-CHIP PACKAGE DEVICE

HYBRID BONDED INTERCONNECT BRIDGING

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

MULTIDIE SUPPORTS AND RELATED METHODS

THREE-DIMENSIONAL MEMORY DEVICE HAVING CONTROLLED LATERAL ISOLATION...

SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

VERTICALLY INTEGRATED MEMORY SYSTEM AND ASSOCIATED SYSTEMS AND METHODS

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF

Interface Bridge Between Integrated Circuit Die

SEMICONDUCTOR PACKAGE INCLUDING PROCESSING ELEMENT AND I/O ELEMENT

WAFER-LEVEL STACKED DIE STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS

ACTIVE VIA

MULTI-CHIP MODULE LEADLESS PACKAGE

SEMICONDUCTOR PACKAGE SUBSTRATE WITH STRESS BUFFER PADS AND METHODS...

SEMICONDUCTOR PACKAGE

3-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND CIRCUITS

SEMICONDUCTOR PACKAGE SUBSTRATE WITH STRESS BUFFER PADS AND METHODS...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

MICROELECTRONIC ASSEMBLIES

SEMICONDUCTOR PACKAGE COMPRISING ADHESION ENHANCER LAYER AND METHOD...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR...

SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS