the devices being of a type provided for in group H01L27/00

Industry

CPC
H01L25/065

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/065the devices being of a type provided for in group H01L27/00

Industries

Patents Grantslast 30 patents

Information Patent Grant
Mechanically tolerant couplers
- Patent number 12,327,164
- Issue date Jun 10, 2025
- International Business Machines Corporation
- Timothy Phung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal performance in hybrid bonded 3D die stacks
- Patent number 12,327,775
- Issue date Jun 10, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for semiconductor package mounting with improved co-planarity
- Patent number 12,327,782
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including glass cores
- Patent number 12,327,797
- Issue date Jun 10, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on chip scale package comprising standardized com...
- Patent number 12,327,816
- Issue date Jun 10, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having chip stack
- Patent number 12,327,821
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Won-young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically stacked and bonded memory arrays
- Patent number 12,327,809
- Issue date Jun 10, 2025
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,812
- Issue date Jun 10, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on multichip package using interconnection bridge
- Patent number 12,327,813
- Issue date Jun 10, 2025
- iCometrue Company
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device
- Patent number 12,327,823
- Issue date Jun 10, 2025
- FUZHOU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zecun Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with underfill containment barrier
- Patent number 12,327,773
- Issue date Jun 10, 2025
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 12,327,777
- Issue date Jun 10, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,327,781
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D system integration
- Patent number 12,327,783
- Issue date Jun 10, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supply voltage control systems and methods for integrated circuits
- Patent number 12,326,749
- Issue date Jun 10, 2025
- Altera Corporation
- Archanna Srinivasan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory controller that transmits hammer addresses with different co...
- Patent number 12,327,583
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Sungyong Cho
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
- Patent number 12,327,779
- Issue date Jun 10, 2025
- SK hynix Inc.
- Ho Young Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die coupling using a substrate with a glass core
- Patent number 12,327,794
- Issue date Jun 10, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide interconnect bridges
- Patent number 12,327,795
- Issue date Jun 10, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming the same
- Patent number 12,327,815
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ASIC package with photonics and vertical power delivery
- Patent number 12,327,817
- Issue date Jun 10, 2025
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices employing thermal and mechanical enhanced layers and method...
- Patent number 12,327,819
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of three-dimensional integrated circuits
- Patent number 12,327,820
- Issue date Jun 10, 2025
- Kambix Innovations, LLC
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,327,827
- Issue date Jun 10, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,328,867
- Issue date Jun 10, 2025
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate core having an embedded laser stop to control...
- Patent number 12,327,814
- Issue date Jun 10, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 12,327,818
- Issue date Jun 10, 2025
- TOHOKU-MICROTEC CO., LTD.
- Makoto Motoyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,322,705
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,322,729
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20250194011
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Eunhye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250194110
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Jihye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MEMORY DEVICE WITH IMPROVED PER-DIE POWER DELIVERY
- Publication number 20250194111
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Sujeet Ayyapureddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
- Publication number 20250192101
- Publication date Jun 12, 2025
- Intel Corporation
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
- Publication number 20250192102
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGE INCLUDING A MULTI-CONTACT INTERCONNECT
- Publication number 20250192111
- Publication date Jun 12, 2025
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER SUBSTRATE INCLUDING OFFSET CORE LAYER
- Publication number 20250192010
- Publication date Jun 12, 2025
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATIVE SURFACES FOR CONDUCTIVE PAD LAYERS OF SILICON BRIDGES F...
- Publication number 20250192017
- Publication date Jun 12, 2025
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192074
- Publication date Jun 12, 2025
- Siliconware Precision Industries Co., Ltd.
- Chung-Chih YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-ASPECT-RATIO VERTICAL INTERCONNECTS FOR HIGH-FREQUENCY APPLICA...
- Publication number 20250192077
- Publication date Jun 12, 2025
- CIENA CORPORATION
- Joël Boyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM ON INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250192100
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACK PACKAGE STRUCTURE
- Publication number 20250192105
- Publication date Jun 12, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192109
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH CONFIGURATION FOR BACK-END-OF-LINE WIRING
- Publication number 20250194199
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192131
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- DOOHWAN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDBY EXIT FOR MEMORY DIE STACK
- Publication number 20250191620
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Hari Giduturi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA TRANSFERRING METHOD FOR SEMICONDUCTOR...
- Publication number 20250192063
- Publication date Jun 12, 2025
- Preferred Networks, Inc.
- Nobuyoshi TANAKA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH POWER MODULE PACKAGE STRUCTURES
- Publication number 20250192097
- Publication date Jun 12, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING ALIGNMENT PATTERN AND MANUFACTURING...
- Publication number 20250192104
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Hung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250192108
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Haseob SEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192112
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192016
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- HYEONJEONG HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192083
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Jongpa HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR HIGH BANDWIDTH MEMORY CONFIGURATIONS
- Publication number 20250192107
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Hyoun Kwon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250191991
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Soohyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...
- Publication number 20250191997
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY THROUGH SUBSTRATE CONDUCTIVE STRUCTURES
- Publication number 20250192004
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250192014
- Publication date Jun 12, 2025
- AaltoSemi Inc.
- Yin-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...
- Publication number 20250192019
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Byung Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20250194112
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS

the devices being of a type provided for in group H01L27/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Mechanically tolerant couplers

Thermal performance in hybrid bonded 3D die stacks

Systems for semiconductor package mounting with improved co-planarity

Microelectronic structures including glass cores

Logic drive based on chip scale package comprising standardized com...

Semiconductor package having chip stack

Vertically stacked and bonded memory arrays

Semiconductor device and manufacturing method thereof

Logic drive based on multichip package using interconnection bridge

Display panel and display device

Package with underfill containment barrier

Semiconductor package structure and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

3D system integration

Supply voltage control systems and methods for integrated circuits

Memory controller that transmits hammer addresses with different co...

Semiconductor chip including through electrode, and semiconductor p...

Die coupling using a substrate with a glass core

Waveguide interconnect bridges

Integrated circuit package and method of forming the same

ASIC package with photonics and vertical power delivery

Devices employing thermal and mechanical enhanced layers and method...

Thermal management of three-dimensional integrated circuits

Microelectronic assemblies

Memory devices having vertical transistors and methods for forming...

Electronic substrate core having an embedded laser stop to control...

Stacked semiconductor device

Chip package and manufacturing method thereof

Device and method for UBM/RDL routing

Semiconductor device

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME

SEMICONDUCTOR DEVICE

STACKED MEMORY DEVICE WITH IMPROVED PER-DIE POWER DELIVERY

NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...

THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS

STACKED DIE PACKAGE INCLUDING A MULTI-CONTACT INTERCONNECT

INTERPOSER SUBSTRATE INCLUDING OFFSET CORE LAYER

ALTERNATIVE SURFACES FOR CONDUCTIVE PAD LAYERS OF SILICON BRIDGES F...

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

HIGH-ASPECT-RATIO VERTICAL INTERCONNECTS FOR HIGH-FREQUENCY APPLICA...

SYSTEM ON INTEGRATED CIRCUIT STRUCTURE

3D STACK PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

PITCH CONFIGURATION FOR BACK-END-OF-LINE WIRING

SEMICONDUCTOR PACKAGE

STANDBY EXIT FOR MEMORY DIE STACK

SEMICONDUCTOR DEVICE AND DATA TRANSFERRING METHOD FOR SEMICONDUCTOR...

HIGH POWER MODULE PACKAGE STRUCTURES

SEMICONDUCTOR STRUCTURE HAVING ALIGNMENT PATTERN AND MANUFACTURING...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SYSTEMS AND METHODS FOR HIGH BANDWIDTH MEMORY CONFIGURATIONS

SEMICONDUCTOR PACKAGE

PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...

HIGH DENSITY THROUGH SUBSTRATE CONDUCTIVE STRUCTURES

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...