the devices being of a type provided for in group H01L27/00

Industry

CPC
H01L25/065

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/065the devices being of a type provided for in group H01L27/00

Industries

Patents Grantslast 30 patents

Information Patent Grant
Film covers for sensor packages
- Patent number 11,972,994
- Issue date Apr 30, 2024
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip and die test without cell array
- Patent number 11,972,825
- Issue date Apr 30, 2024
- SK hynix Inc.
- Ji-Hwan Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Coplanar control for film-type thermal interface
- Patent number 11,973,005
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory with efficient signal routing
- Patent number 11,973,044
- Issue date Apr 30, 2024
- SANDISK TECHNOLOGIES LLC
- Shiqian Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,973,037
- Issue date Apr 30, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon transmission lines and other structures enabled by...
- Patent number 11,973,057
- Issue date Apr 30, 2024
- Analog Devices, Inc.
- Ed Balboni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit product and chip floorplan arrangement thereof
- Patent number 11,973,059
- Issue date Apr 30, 2024
- Alchip Technologies, Ltd.
- Wen-Hsi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,973,001
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method
- Patent number 11,973,055
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple die assembly
- Patent number 11,973,058
- Issue date Apr 30, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended through wafer vias for power delivery in face-to-face dies
- Patent number 11,973,060
- Issue date Apr 30, 2024
- NVIDIA Corporation
- Joseph Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-the-fly compression scheme for soft bit data in non-volatile memory
- Patent number 11,971,829
- Issue date Apr 30, 2024
- SANDISK TECHNOLOGIES LLC
- Hua-Ling Cynthia Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Soft motherboard-rigid plugin module architecture
- Patent number 11,974,502
- Issue date Apr 30, 2024
- The Regents of the University of Colorado
- Jianliang Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge pump current regulation during voltage ramp
- Patent number 11,972,807
- Issue date Apr 30, 2024
- SANDISK TECHNOLOGIES LLC
- Hiroki Yabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 11,972,995
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Dahee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical architecture for a multi-chip module
- Patent number 11,973,004
- Issue date Apr 30, 2024
- Tesla, Inc.
- Robert Yinan Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package including stacked chips and chip couplers
- Patent number 11,973,061
- Issue date Apr 30, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and electronic system including the same
- Patent number 11,973,035
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Ha-Min Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with warpage-relief trenches
- Patent number 11,973,040
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Yang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density pillar interconnect conversion with stack to substrate...
- Patent number 11,973,062
- Issue date Apr 30, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for sub-column parallel digitizers for hybrid sta...
- Patent number 11,973,090
- Issue date Apr 30, 2024
- DePuy Synthes Products, Inc.
- Laurent Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unit with wiring board, module, and equipment
- Patent number 11,972,990
- Issue date Apr 30, 2024
- Canon Kabushiki Kaisha
- Satoshi Nozu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of the same
- Patent number 11,967,553
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures having underfills
- Patent number 11,967,581
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous packaging integration of photonic and electronic elem...
- Patent number 11,966,090
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder resist structure to mitigate solder bridge risk
- Patent number 11,967,547
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with communication networks
- Patent number 11,967,580
- Issue date Apr 23, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,967,583
- Issue date Apr 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and electronic systems including the same
- Patent number 11,967,623
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Sunggil Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC ASSEMBLY WITH POWER MODULE INTERPOSER AND METHODS OF FOR...
- Publication number 20240145368
- Publication date May 2, 2024
- Intel Corporation
- Jackson Chung Peng KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240145433
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturiing Co., Ltd.
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING MULTI-DIMENSION THROUGH SILICON VIA...
- Publication number 20240145435
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20240145445
- Publication date May 2, 2024
- Sony Semiconductor Solutions Corporation
- TAKUSHI SHIGETOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240147708
- Publication date May 2, 2024
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Takanori MATSUZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME
- Publication number 20240147722
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Byongju Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Assembly
- Publication number 20240145529
- Publication date May 2, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NAND DIE WITH WIRE-BOND INDUCTIVE COMPENSATION FOR ALTERED BOND WIR...
- Publication number 20240145424
- Publication date May 2, 2024
- Western Digital Technologies, Inc.
- John Contreras
- G11 - INFORMATION STORAGE
Information Patent Application
COMPOSITE DIELECTRIC STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES AN...
- Publication number 20240145436
- Publication date May 2, 2024
- Micron Technology, Inc.
- Hung Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR NON-VOLATILE RANDOM ACCESS MEMORY STACKS
- Publication number 20240145438
- Publication date May 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Heat Dissipation Structure and Method for Forming the...
- Publication number 20240145342
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA
- Publication number 20240145346
- Publication date May 2, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Joo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-On-Interposer Assembly Containing A Decoupling Capacitor
- Publication number 20240145528
- Publication date May 2, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240145366
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Dongjoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID-REPELLING COATING FOR UNDERFILL BLEED OUT CONTROL
- Publication number 20240145422
- Publication date May 2, 2024
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLED SYSTEM-ON-WAFER WITH MEANS FOR REDUCING THE EFFECTS OF ELECT...
- Publication number 20240145432
- Publication date May 2, 2024
- Tesla, Inc.
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI PROGRAMABLE-DIE MODULE
- Publication number 20240145434
- Publication date May 2, 2024
- Intel Corporation
- Mahesh Kumashikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUIT WITH INTERCONNECT NETWORK LAYER
- Publication number 20240145459
- Publication date May 2, 2024
- Silicon Genesis Corporation
- Michael I. CURRENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY WITH DUMMY WORD LINE ASSISTED PRE-CHARGE
- Publication number 20240145006
- Publication date May 2, 2024
- SANDISK TECHNOLOGIES LLC
- Peng Zhang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...
- Publication number 20240145305
- Publication date May 2, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20240145332
- Publication date May 2, 2024
- Hitachi Energy Ltd
- Niko PAVLICEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE, METHOD FOR MANUFACTURING THE SAME AND...
- Publication number 20240147739
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Ji Hong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MEMORY SEMICONDUCTOR DEVICES AND STRUCTURES WITH MEMORY-LINE PIL...
- Publication number 20240147740
- Publication date May 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VIA STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20240145379
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Kun Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...
- Publication number 20240145393
- Publication date May 2, 2024
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A HIGH RELIABILITY
- Publication number 20240145437
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- JI-HWAN HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240145344
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
- Publication number 20240145458
- Publication date May 2, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145403
- Publication date May 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices and Methods of Forming the Same
- Publication number 20240145431
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS

the devices being of a type provided for in group H01L27/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Film covers for sensor packages

Integrated circuit chip and die test without cell array

Coplanar control for film-type thermal interface

Non-volatile memory with efficient signal routing

Package structure and manufacturing method thereof

Through-silicon transmission lines and other structures enabled by...

Integrated circuit product and chip floorplan arrangement thereof

Semiconductor device and method of manufacture

Wafer bonding method

Multiple die assembly

Extended through wafer vias for power delivery in face-to-face dies

On-the-fly compression scheme for soft bit data in non-volatile memory

Soft motherboard-rigid plugin module architecture

Charge pump current regulation during voltage ramp

Semiconductor package and method of manufacturing semiconductor pac...

Mechanical architecture for a multi-chip module

Chip package including stacked chips and chip couplers

Semiconductor memory device and electronic system including the same

Interposer with warpage-relief trenches

Methods for low temperature bonding using nanoparticles

High density pillar interconnect conversion with stack to substrate...

System and method for sub-column parallel digitizers for hybrid sta...

Unit with wiring board, module, and equipment

Semiconductor package and manufacturing method of the same

Package structures having underfills

Heterogeneous packaging integration of photonic and electronic elem...

Solder resist structure to mitigate solder bridge risk

Microelectronic assemblies with communication networks

3D semiconductor device and structure with metal layers

Semiconductor devices and electronic systems including the same

Patents Applicationslast 30 patents

ELECTRONIC ASSEMBLY WITH POWER MODULE INTERPOSER AND METHODS OF FOR...

INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR DEVICE INCLUDING MULTI-DIMENSION THROUGH SILICON VIA...

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME

Semiconductor Package Assembly

NAND DIE WITH WIRE-BOND INDUCTIVE COMPENSATION FOR ALTERED BOND WIR...

COMPOSITE DIELECTRIC STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES AN...

APPARATUS FOR NON-VOLATILE RANDOM ACCESS MEMORY STACKS

Package with Heat Dissipation Structure and Method for Forming the...

SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA

Chip-On-Interposer Assembly Containing A Decoupling Capacitor

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

LIQUID-REPELLING COATING FOR UNDERFILL BLEED OUT CONTROL

COOLED SYSTEM-ON-WAFER WITH MEANS FOR REDUCING THE EFFECTS OF ELECT...

MULTI PROGRAMABLE-DIE MODULE

THREE DIMENSIONAL INTEGRATED CIRCUIT WITH INTERCONNECT NETWORK LAYER

NON-VOLATILE MEMORY WITH DUMMY WORD LINE ASSISTED PRE-CHARGE

SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR MEMORY DEVICE, METHOD FOR MANUFACTURING THE SAME AND...

3D MEMORY SEMICONDUCTOR DEVICES AND STRUCTURES WITH MEMORY-LINE PIL...

STACKED VIA STRUCTURES AND METHODS FOR FORMING THE SAME

ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...

SEMICONDUCTOR PACKAGE HAVING A HIGH RELIABILITY

VIA STRUCTURE AND METHOD FOR FORMING THE SAME

STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Packaged Semiconductor Devices and Methods of Forming the Same