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SEMICONDUCTOR PACKAGE
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Publication number 20240136329
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Publication date Apr 25, 2024
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Samsung Electronics Co., Ltd.
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Hyuekjae Lee
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGES
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Publication number 20240055403
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Publication date Feb 15, 2024
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Samsung Electronics Co., Ltd.
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Changeun Joo
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240038725
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Publication date Feb 1, 2024
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Samsung Electronics Co., Ltd.
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Keumhee MA
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240021524
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Publication date Jan 18, 2024
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LG Innotek Co., Ltd.
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Tae Gyu KANG
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H01 - BASIC ELECTRIC ELEMENTS
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SEAL RING FOR HYBRID-BOND
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Publication number 20240021544
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Publication date Jan 18, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Chih-Chia Hu
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20230411268
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Publication date Dec 21, 2023
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LG Innotek Co., Ltd.
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Hodol YOO
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE
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Publication number 20230369273
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Publication date Nov 16, 2023
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Hsien-Wei Chen
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H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT PACKAGES
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Publication number 20230352471
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Publication date Nov 2, 2023
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TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
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Chen-Hua Yu
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H01 - BASIC ELECTRIC ELEMENTS
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