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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

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H01L25/10the devices having separate containers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages including antenna pattern
- Patent number 12,261,135
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Se Ho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,261,156
- Issue date Mar 25, 2025
- Denso Corporation
- Hiroyoshi Kunieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,103
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,106
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having package on package structure and method...
- Patent number 12,261,157
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and package-on-package including the same
- Patent number 12,255,160
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Juyoun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure comprising via structure and redist...
- Patent number 12,255,166
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Neng-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package type semiconductor package
- Patent number 12,255,197
- Issue date Mar 18, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules employing three-dimensional (3D) build-up on mold p...
- Patent number 12,255,381
- Issue date Mar 18, 2025
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,255,184
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,255,116
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 12,249,587
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-group package having a deep trench device
- Patent number 12,249,590
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,249,593
- Issue date Mar 11, 2025
- Nagase & Co., Ltd.
- Yoichiro Kurita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,249,550
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of integrated substrate structure
- Patent number 12,249,567
- Issue date Mar 11, 2025
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system having combined high density, low bandwidth and low d...
- Patent number 12,243,575
- Issue date Mar 4, 2025
- Apple Inc.
- Sukalpa Biswas
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,243,830
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with electromagnetic interference film and met...
- Patent number 12,243,833
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Independent power control for integrated circuit (IC) chips
- Patent number 12,243,827
- Issue date Mar 4, 2025
- Auradine Inc.
- Guangbin Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,243,843
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising channel interconnects located between solder int...
- Patent number 12,243,855
- Issue date Mar 4, 2025
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stack of split graphics processing logic dies
- Patent number 12,243,797
- Issue date Mar 4, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fan out packaging pop mechanical attach method
- Patent number 12,243,856
- Issue date Mar 4, 2025
- Intel Corporation
- David O'Sullivan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,252
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Yoonyoung Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,256
- Issue date Feb 25, 2025
- Samsung Electronics Co, Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy structure of stacked and bonded semiconductor device
- Patent number 12,237,291
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Fine-Pitch Interconnecti...
- Publication number 20250105162
- Publication date Mar 27, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPLET DEVICE AND INTERPOSER
- Publication number 20250105163
- Publication date Mar 27, 2025
- Global Unichip Corporation
- Liang-Kai CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
- Publication number 20250105165
- Publication date Mar 27, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY COMMUNICATION DEVICE INCLUDING PACKAGE CONTAINING H...
- Publication number 20250105223
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Sangwook HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH INTEGRAL SEAL
- Publication number 20250105112
- Publication date Mar 27, 2025
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-BONDED LED ARRAYS AND DRIVER CIRCUITS
- Publication number 20250105234
- Publication date Mar 27, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20250105210
- Publication date Mar 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20250105224
- Publication date Mar 27, 2025
- JCET Management Co., Ltd.
- Cheng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105077
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105116
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- JU-IL CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105127
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Dohyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT LEVEL SEMICONDUCTOR PACKAGE
- Publication number 20250105159
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Pyunghwa Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20250105214
- Publication date Mar 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105235
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, AND A PACKAGE ON PACKAGE TYPE SEMICONDUCTOR...
- Publication number 20250105217
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...
- Publication number 20250105222
- Publication date Mar 27, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...
- Publication number 20250096008
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR ST...
- Publication number 20250096102
- Publication date Mar 20, 2025
- KIOXIA Corporation
- Kazuma HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A BRIDGE LOCATED BETWEEN METALLIZATION PORTIONS
- Publication number 20250096207
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Yue LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096179
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Wooyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250096044
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20250096199
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DIELECTRIC LAYER WITH STEP DIFFERENCE
- Publication number 20250096208
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Jeongoh HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087647
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH LATERALLY CONFINED SUBSTRATE AND METHODS...
- Publication number 20250087564
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087617
- Publication date Mar 13, 2025
- NEPES CO., LTD.
- Dong Hoon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087596
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Jaesun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250087572
- Publication date Mar 13, 2025
- AaltoSemi Inc.
- Yin-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER
- Publication number 20250087646
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20250087648
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS

the devices having separate containers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages including antenna pattern

Semiconductor package having an encapulant comprising conductive fi...

Electronic device

Semiconductor package

Semiconductor package

Semiconductor device having package on package structure and method...

Semiconductor package and package-on-package including the same

Semiconductor package structure comprising via structure and redist...

Secure semiconductor integration and method for making thereof

Package-on-package type semiconductor package

Antenna modules employing three-dimensional (3D) build-up on mold p...

Semiconductor packages and methods of forming the same

Wire bond wires for interference shielding

Semiconductor structure and manufacturing method thereof

Semiconductor structure and forming method thereof

Die-group package having a deep trench device

Electronic device

Semiconductor package and method manufacturing the same

Manufacturing method of integrated substrate structure

Memory system having combined high density, low bandwidth and low d...

Semiconductor devices and methods of manufacture

Semiconductor device with electromagnetic interference film and met...

Independent power control for integrated circuit (IC) chips

Integrated circuit package and method of forming same

Package comprising channel interconnects located between solder int...

3D stack of split graphics processing logic dies

Fan out packaging pop mechanical attach method

Semiconductor package

Semiconductor package

Dummy structure of stacked and bonded semiconductor device

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Fine-Pitch Interconnecti...

SEMICONDUCTOR CHIPLET DEVICE AND INTERPOSER

SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS

RADIO FREQUENCY COMMUNICATION DEVICE INCLUDING PACKAGE CONTAINING H...

ELECTRONIC PACKAGE WITH INTEGRAL SEAL

DIRECT-BONDED LED ARRAYS AND DRIVER CIRCUITS

ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

FAN-OUT LEVEL SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE, AND A PACKAGE ON PACKAGE TYPE SEMICONDUCTOR...

HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...

SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR ST...

PACKAGE COMPRISING A BRIDGE LOCATED BETWEEN METALLIZATION PORTIONS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING SAME

SEMICONDUCTOR PACKAGE HAVING DIELECTRIC LAYER WITH STEP DIFFERENCE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH LATERALLY CONFINED SUBSTRATE AND METHODS...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER

METHOD FOR FORMING PACKAGE STRUCTURE