the die mounting substrate comprising a recess for hosting the device

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/15153the die mounting substrate comprising a recess for hosting the device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Asymmetric Stackup Structure for SoC package substrates
- Patent number 12,322,721
- Issue date Jun 3, 2025
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 12,324,268
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic wafer communication systems and related packages
- Patent number 12,306,434
- Issue date May 20, 2025
- Lightmatter, Inc.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,682
- Issue date May 13, 2025
- Kabushiki Kaisha Toshiba
- Jia Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method for package structure
- Patent number 12,300,511
- Issue date May 13, 2025
- University of Electronic Science and Technology of China
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,283,555
- Issue date Apr 22, 2025
- Analog Devices International Unlimited Company
- Bilge Bayrakci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package structure and manufacturing method thereof
- Patent number 12,267,961
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,266,582
- Issue date Apr 1, 2025
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device including forming a first...
- Patent number 12,266,612
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metallization of integrated circuit packages
- Patent number 12,261,123
- Issue date Mar 25, 2025
- Advanced Technical Ceramics Company
- Aaron Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,261,089
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor device
- Patent number 12,230,623
- Issue date Feb 18, 2025
- Kioxia Corporation
- Masaki Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold plates incorporating reactive multilayer systems and S-cells
- Patent number 12,207,450
- Issue date Jan 21, 2025
- TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA INC.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,199,063
- Issue date Jan 14, 2025
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having improved reliability and inspe...
- Patent number 12,183,707
- Issue date Dec 31, 2024
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead between a plurality of encapsulated...
- Patent number 12,159,816
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and fabrication method thereof
- Patent number 12,136,581
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Youngho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 12,094,831
- Issue date Sep 17, 2024
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device module having vertical metallic contacts and a...
- Patent number 12,080,669
- Issue date Sep 3, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,074,121
- Issue date Aug 27, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrations and methods of making thereof
- Patent number 12,068,231
- Issue date Aug 20, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages, antenna modules, and communication dev...
- Patent number 12,068,525
- Issue date Aug 20, 2024
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,057,434
- Issue date Aug 6, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
- Patent number 12,033,929
- Issue date Jul 9, 2024
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element mounting substrate, and electronic device
- Patent number 11,996,339
- Issue date May 28, 2024
- Kyocera Corporation
- Kenichi Ura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic wafer communication systems and related packages
- Patent number 11,947,164
- Issue date Apr 2, 2024
- Lightmatter, Inc.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250227849
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250226271
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH SELECTIVE METALLIZATION FOR GLASS C...
- Publication number 20250210495
- Publication date Jun 26, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATE SHAPED SUBSTRATE AND PACKAGING SUBSTRATE
- Publication number 20250210423
- Publication date Jun 26, 2025
- ABSOLICS INC.
- SeHan YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250201676
- Publication date Jun 19, 2025
- INFINEON TECHNOLOGIES AG
- Achim Althaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE IN DIE SEMICONDUCTOR DEVICE AND METHOD THEREFOR
- Publication number 20250157986
- Publication date May 15, 2025
- NXP B.V.
- Yen-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250149489
- Publication date May 8, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140770
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Che-Yu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250132272
- Publication date Apr 24, 2025
- InnoLux Corporation
- Jui-Jen YUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH BACK-TO-BACK DIE STACKING
- Publication number 20250132240
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Faxing CHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250096194
- Publication date Mar 20, 2025
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVIC...
- Publication number 20250096051
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Jaehyun YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING IMPROVED RELIABILITY AND INSPE...
- Publication number 20250087623
- Publication date Mar 13, 2025
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079243
- Publication date Mar 6, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...
- Publication number 20250079244
- Publication date Mar 6, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20250070056
- Publication date Feb 27, 2025
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046728
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Dongwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of a system in package having several layers a...
- Publication number 20250038121
- Publication date Jan 30, 2025
- THALES
- Damien CHALAVOUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250015064
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Yoon Young JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250015033
- Publication date Jan 9, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250015065
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240429173
- Publication date Dec 26, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20240421098
- Publication date Dec 19, 2024
- Tahoe Research, Ltd.
- Mihir K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240407103
- Publication date Dec 5, 2024
- LG Innotek Co., Ltd.
- Chae Young YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395771
- Publication date Nov 28, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
- Publication number 20240387393
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240355794
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES, ANTENNA MODULES, AND COMMUNICATION DEV...
- Publication number 20240356198
- Publication date Oct 24, 2024
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...
- Publication number 20240339390
- Publication date Oct 10, 2024
- Lodestar Licensing Group LLC
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS

the die mounting substrate comprising a recess for hosting the device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Asymmetric Stackup Structure for SoC package substrates

Image sensor device

Photonic wafer communication systems and related packages

Semiconductor package

Fabrication method for package structure

Semiconductor packages

Embedded component package structure and manufacturing method thereof

Hermetic package for high CTE mismatch

Method for forming a semiconductor device including forming a first...

Selective metallization of integrated circuit packages

Semiconductor device package and a method of manufacturing the same

Method for manufacturing semiconductor device and semiconductor device

Cold plates incorporating reactive multilayer systems and S-cells

Microelectronic assemblies

Packaged semiconductor device having improved reliability and inspe...

Metal-free frame design for silicon bridges for semiconductor packages

Semiconductor device with lead between a plurality of encapsulated...

Semiconductor package structure and fabrication method thereof

Hermetic package for high CTE mismatch

Multi-chip package and method of providing die-to-die interconnects...

High density interconnect device and method

Semiconductor device module having vertical metallic contacts and a...

Metal-free frame design for silicon bridges for semiconductor packages

Multi-die fine grain integrated voltage regulation

3D integrations and methods of making thereof

Integrated circuit packages, antenna modules, and communication dev...

Semiconductor package and manufacturing method thereof

Package-on-package semiconductor assemblies and methods of manufact...

Electronic element mounting substrate, and electronic device

Photonic wafer communication systems and related packages

Patents Applicationslast 30 patents

EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

MICROELECTRONIC ASSEMBLIES WITH SELECTIVE METALLIZATION FOR GLASS C...

PLATE SHAPED SUBSTRATE AND PACKAGING SUBSTRATE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

DIE IN DIE SEMICONDUCTOR DEVICE AND METHOD THEREFOR

Multi-Die Fine Grain Integrated Voltage Regulation

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE

PACKAGE WITH BACK-TO-BACK DIE STACKING

MICROELECTRONIC ASSEMBLIES

PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVIC...

PACKAGED SEMICONDUCTOR DEVICE HAVING IMPROVED RELIABILITY AND INSPE...

PACKAGING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

Manufacturing method of a system in package having several layers a...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Multi-Die Fine Grain Integrated Voltage Regulation

SEMICONDUCTOR PACKAGE

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

CIRCUIT BOARD

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Method for Forming a Semiconductor Device Having TSV Formed Through...

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGES, ANTENNA MODULES, AND COMMUNICATION DEV...

PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...