the die mounting substrate comprising a recess for hosting the device

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CPC
H01L2924/15153

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/15153the die mounting substrate comprising a recess for hosting the device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Photonic wafer communication systems and related packages
- Patent number 11,947,164
- Issue date Apr 2, 2024
- Lightmatter, Inc.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 11,935,907
- Issue date Mar 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 11,901,330
- Issue date Feb 13, 2024
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package structure and manufacturing method thereof
- Patent number 11,882,660
- Issue date Jan 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging with high density interconnects
- Patent number 11,881,457
- Issue date Jan 23, 2024
- Tahoe Research, LTD.
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,876,053
- Issue date Jan 16, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack packaging structure and chip stack packaging method
- Patent number 11,869,872
- Issue date Jan 9, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid felts of electrospun nanofibers
- Patent number RE49773
- Issue date Jan 2, 2024
- NANOPAREIL, LLC
- Todd J. Menkhaus
Information Patent Grant
Asymmetric stackup structure for SoC package substrates
- Patent number 11,862,597
- Issue date Jan 2, 2024
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,862,525
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device having TSV formed through...
- Patent number 11,854,990
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and fabrication method thereof
- Patent number 11,842,941
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Youngho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead between a plurality of encapsulated MOSFETs
- Patent number 11,830,792
- Issue date Nov 28, 2023
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with dielectric structure covering...
- Patent number 11,824,031
- Issue date Nov 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,824,008
- Issue date Nov 21, 2023
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board, COF module and electronic device including...
- Patent number 11,800,639
- Issue date Oct 24, 2023
- LG Innotek Co., Ltd
- Jun Young Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
- Patent number 11,791,252
- Issue date Oct 17, 2023
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded multi-die interconnect bridge packages with lithographical...
- Patent number 11,764,158
- Issue date Sep 19, 2023
- Intel Corporation
- Amruthavalli Pallavi Alur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip packaging structure with dissipation l...
- Patent number 11,735,503
- Issue date Aug 22, 2023
- HEFEI SMAT TECHNOLOGY CO., LTD.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch on interposer package with wireless communication interface
- Patent number 11,737,154
- Issue date Aug 22, 2023
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,728,252
- Issue date Aug 15, 2023
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 11,721,792
- Issue date Aug 8, 2023
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with spaces for embedding components
- Patent number 11,664,360
- Issue date May 30, 2023
- Micron Technology, Inc.
- Quang Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 11,664,320
- Issue date May 30, 2023
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 11,626,372
- Issue date Apr 11, 2023
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board, COF module and electronic device including...
- Patent number 11,622,444
- Issue date Apr 4, 2023
- LG Innotek Co., Ltd
- Jun Young Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 11,600,594
- Issue date Mar 7, 2023
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity structures in integrated circuit package supports
- Patent number 11,557,489
- Issue date Jan 17, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package structure and manufacturing method thereof
- Patent number 11,553,596
- Issue date Jan 10, 2023
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240145319
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20240136323
- Publication date Apr 25, 2024
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR THERMAL CONDUCTION AND ELECTRICAL ISOLATION
- Publication number 20240121895
- Publication date Apr 11, 2024
- Nitride Global Inc.
- Jason Schmitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTISIDED INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20240112966
- Publication date Apr 4, 2024
- Azimuth Industrial Company, Inc.
- David Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079393
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Youngdeuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING ELECTRONIC PACKAGE
- Publication number 20240071991
- Publication date Feb 29, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240063103
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMABLE DIE BOND FILM (DBF) IN GLASS CAVITY
- Publication number 20240063127
- Publication date Feb 22, 2024
- Intel Corporation
- Jeremy D. ECTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD PLATES INCORPORATING REACTIVE MULTILAYER SYSTEMS AND S-CELLS
- Publication number 20240064943
- Publication date Feb 22, 2024
- Toyota Motor Engineering & Manufacturing North America Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240055329
- Publication date Feb 15, 2024
- ROHM CO., LTD.
- Kentaro NASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SUBSTRATE CAVITY
- Publication number 20240047328
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Jinduck Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING
- Publication number 20230395443
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Comprising a Semiconductor-based Component and Method of Man...
- Publication number 20230245971
- Publication date Aug 3, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20230223361
- Publication date Jul 13, 2023
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20230225055
- Publication date Jul 13, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK PACKAGING STRUCTURE AND CHIP STACK PACKAGING METHOD
- Publication number 20230178514
- Publication date Jun 8, 2023
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230164920
- Publication date May 25, 2023
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY CHIP PACKAGE
- Publication number 20230154874
- Publication date May 18, 2023
- WAVEPIA CO., LTD.
- Sang-Hun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20230127749
- Publication date Apr 27, 2023
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230107554
- Publication date Apr 6, 2023
- Korea Electronics Technology Institute
- Jong Min YOOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asymmetric Stackup Structure for SoC Package Substrates
- Publication number 20230092505
- Publication date Mar 23, 2023
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230080478
- Publication date Mar 16, 2023
- Kabushiki Kaisha Toshiba
- Jia LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LIGHT-EMITTING ELEMENT TRANSFERRING AND DISPLAY PANEL
- Publication number 20230061742
- Publication date Mar 2, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Fei PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230040019
- Publication date Feb 9, 2023
- Fuji Electric Co., Ltd.
- Yuji IIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES, ANTENNA MODULES, AND COMMUNICATION DEV...
- Publication number 20230035608
- Publication date Feb 2, 2023
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230008518
- Publication date Jan 12, 2023
- AMOSENSE CO.,LTD
- Ji-Hyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE, METHOD, DEVICE AND ELECTRONIC PR...
- Publication number 20220320028
- Publication date Oct 6, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICE...
- Publication number 20220246554
- Publication date Aug 4, 2022
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20220223561
- Publication date Jul 14, 2022
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20220216121
- Publication date Jul 7, 2022
- Samsung Electronics Co., Ltd.
- Youngho KIM
- H01 - BASIC ELECTRIC ELEMENTS

the die mounting substrate comprising a recess for hosting the device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Photonic wafer communication systems and related packages

Image sensor device

Microelectronic assemblies

Embedded component package structure and manufacturing method thereof

Semiconductor packaging with high density interconnects

Multi-chip package and method of providing die-to-die interconnects...

Chip stack packaging structure and chip stack packaging method

Hybrid felts of electrospun nanofibers

Asymmetric stackup structure for SoC package substrates

Semiconductor device package and a method of manufacturing the same

Method for forming a semiconductor device having TSV formed through...

Semiconductor package structure and fabrication method thereof

Lead between a plurality of encapsulated MOSFETs

Semiconductor package structure with dielectric structure covering...

Multi-chip package and method of providing die-to-die interconnects...

Flexible circuit board, COF module and electronic device including...

Circuit board structure and method for manufacturing a circuit boar...

Package-on-package semiconductor assemblies and methods of manufact...

Embedded multi-die interconnect bridge packages with lithographical...

Method of manufacturing chip packaging structure with dissipation l...

Patch on interposer package with wireless communication interface

Semiconductor device package

Light emitting device and fluidic manufacture thereof

Circuit board with spaces for embedding components

High density interconnect device and method

Metal-free frame design for silicon bridges for semiconductor packages

Flexible circuit board, COF module and electronic device including...

Microelectronic assemblies

Cavity structures in integrated circuit package supports

Embedded component package structure and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

MICROELECTRONIC ASSEMBLIES

DEVICE FOR THERMAL CONDUCTION AND ELECTRICAL ISOLATION

MULTISIDED INTEGRATED CIRCUIT ASSEMBLY

SEMICONDUCTOR PACKAGE

METHOD FOR MAKING ELECTRONIC PACKAGE

SEMICONDUCTOR PACKAGE

CONFORMABLE DIE BOND FILM (DBF) IN GLASS CAVITY

COLD PLATES INCORPORATING REACTIVE MULTILAYER SYSTEMS AND S-CELLS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH SUBSTRATE CAVITY

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING

Module Comprising a Semiconductor-based Component and Method of Man...

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

ELECTRONIC MODULE

CHIP STACK PACKAGING STRUCTURE AND CHIP STACK PACKAGING METHOD

EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

RADIO FREQUENCY CHIP PACKAGE

MICROELECTRONIC ASSEMBLIES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Asymmetric Stackup Structure for SoC Package Substrates

SEMICONDUCTOR PACKAGE

METHOD FOR LIGHT-EMITTING ELEMENT TRANSFERRING AND DISPLAY PANEL

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGES, ANTENNA MODULES, AND COMMUNICATION DEV...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGING STRUCTURE, METHOD, DEVICE AND ELECTRONIC PR...

MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICE...

MICROELECTRONIC ASSEMBLIES

SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF