the external layer being disposed on a redistribution layer on the semiconductor or solid-state body

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H01L2224/05569

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05569the external layer being disposed on a redistribution layer on the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 12,159,826
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having an electronic component and an encapsulant encapsula...
- Patent number 12,112,992
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 12,113,005
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split RDL connection between die and UBM
- Patent number 12,107,058
- Issue date Oct 1, 2024
- STATS ChipPAC Pte. Ltd.
- Jian Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory
- Patent number 12,089,409
- Issue date Sep 10, 2024
- Kioxia Corporation
- Masayoshi Tagami
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 12,087,668
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale package
- Patent number 12,057,417
- Issue date Aug 6, 2024
- Texas Instruments Incorporated
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,050,398
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Hidenori Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 12,051,669
- Issue date Jul 30, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through via structure
- Patent number 12,046,538
- Issue date Jul 23, 2024
- Samsung Electronics Co., Ltd.
- Sonkwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the same
- Patent number 12,040,349
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Kiwon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including chip pads of different surface areas,...
- Patent number 12,021,515
- Issue date Jun 25, 2024
- SK hynix Inc.
- Ju Il Eom
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Display device with alternating fan-out lines
- Patent number 12,022,699
- Issue date Jun 25, 2024
- Samsung Display Co., Ltd.
- Tae Jong Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-segment monolithic LED chip
- Patent number 12,002,915
- Issue date Jun 4, 2024
- CreeLED, Inc.
- Thomas Place
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer body and method of manufacturing the same
- Patent number 12,002,779
- Issue date Jun 4, 2024
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Method of forming brass-coated metals in flip-chip redistribution l...
- Patent number 11,984,418
- Issue date May 14, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package
- Patent number 11,978,716
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated high voltage capacitor
- Patent number 11,967,610
- Issue date Apr 23, 2024
- Semtech Corporation
- Christopher David Ainsworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,961,789
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,948,890
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,916,031
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive traces in semiconductor devices and methods of forming same
- Patent number 11,894,299
- Issue date Feb 6, 2024
- TAIWAN SEMICONDUCTOR LTD
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having processor and NAND flash memory...
- Patent number 11,864,367
- Issue date Jan 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide layered structure and methods of forming the same
- Patent number 11,854,826
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MIM Capacitor in IC Heterogenous Integration
- Publication number 20240421063
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421095
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240413028
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY
- Publication number 20240397722
- Publication date Nov 28, 2024
- KIOXIA Corporation
- Masayoshi TAGAMI
- G11 - INFORMATION STORAGE
Information Patent Application
WAFER CHIP SCALE PACKAGE
- Publication number 20240379597
- Publication date Nov 14, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240369765
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240363496
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH SI-SUBSTRATE-FREE INTERPOSER AND METHOD FORMING SAME
- Publication number 20240363512
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258253
- Publication date Aug 1, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDE LAYER DEPRESSIONS BETWEEN METAL PILLARS
- Publication number 20240258251
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo TIMBOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240250036
- Publication date Jul 25, 2024
- TAIWAN SEMICODUCTOR MANUFACTURING CO., LTD.
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240213218
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROFILE CONTROL FOR STRESS RELAXATION
- Publication number 20240213190
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194626
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- SOOJEOUNG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME
- Publication number 20240162174
- Publication date May 16, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP
- Publication number 20240162177
- Publication date May 16, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL HYBRID BONDED RF SWITCH WITH REDISTRIBUTION LAYER
- Publication number 20240153893
- Publication date May 9, 2024
- Qorvo US, Inc.
- Michael Carroll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...
- Publication number 20240105527
- Publication date Mar 28, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096760
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240047403
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Neng-Chieh CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FORMED IN A WAFER USING A FRONT-SIDE AND A BACK-SIDE PROCESS
- Publication number 20240038695
- Publication date Feb 1, 2024
- Celestial AI Inc.
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA FORMED USING A PARTIAL PLUG THAT STOPS BEFORE...
- Publication number 20240038694
- Publication date Feb 1, 2024
- Celestial AI Inc.
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Side Wall Interconnection
- Publication number 20240038724
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDE PROFILE CONTROL
- Publication number 20230387050
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Chi HUANG
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230378132
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming RDL and Side and Back...
- Publication number 20230343668
- Publication date Oct 26, 2023
- UTAC Headquarters Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20230307410
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shifting Contact Pad for Reducing Stress
- Publication number 20230275047
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Recesses in Molding Compound of Wafer to Reduce Stress
- Publication number 20230253370
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230238305
- Publication date Jul 27, 2023
- XINTEC INC.
- Ching-Ting PENG
- H01 - BASIC ELECTRIC ELEMENTS

the external layer being disposed on a redistribution layer on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of manufacturing the semiconductor...

Integrated chip for standard logic performance improvement having a...

Package having an electronic component and an encapsulant encapsula...

Packages with Si-substrate-free interposer and method forming same

Split RDL connection between die and UBM

Semiconductor memory

Semiconductor package and method for manufacturing the same

Semiconductor device and method for manufacturing semiconductor device

Wafer chip scale package

Semiconductor device and method of forming the same

Contact and die attach metallization for silicon carbide based devi...

Semiconductor device including through via structure

Light emitting device and method of manufacturing the same

Semiconductor chip including chip pads of different surface areas,...

Display device with alternating fan-out lines

Advanced device assembly structures and methods

Multi-segment monolithic LED chip

Multilayer body and method of manufacturing the same

Multiple plated via arrays of different wire heights on a same subs...

Method of forming brass-coated metals in flip-chip redistribution l...

Package

Integrated high voltage capacitor

Semiconductor package and manufacturing method thereof

Semiconductor package and method

Semiconductor device and method of manufacturing

Conductive traces in semiconductor devices and methods of forming same

Methods of manufacturing a semiconductor device including a joint a...

Bonded semiconductor devices having processor and NAND flash memory...

Metal oxide layered structure and methods of forming the same

Semiconductor device and method

Patents Applicationslast 30 patents

MIM Capacitor in IC Heterogenous Integration

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DIE STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR MEMORY

WAFER CHIP SCALE PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PACKAGES WITH SI-SUBSTRATE-FREE INTERPOSER AND METHOD FORMING SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

POLYIMIDE LAYER DEPRESSIONS BETWEEN METAL PILLARS

SEMICONDUCTOR PACKAGE AND METHOD

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

PROFILE CONTROL FOR STRESS RELAXATION

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME

SEMICONDUCTOR DEVICE WITH AIR GAP

WAFER-LEVEL HYBRID BONDED RF SWITCH WITH REDISTRIBUTION LAYER

ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE

VIA FORMED IN A WAFER USING A FRONT-SIDE AND A BACK-SIDE PROCESS

THROUGH-SUBSTRATE VIA FORMED USING A PARTIAL PLUG THAT STOPS BEFORE...

Semiconductor Package with Side Wall Interconnection

POLYIMIDE PROFILE CONTROL

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Packages and Methods of Forming RDL and Side and Back...

PACKAGE

Shifting Contact Pad for Reducing Stress

Forming Recesses in Molding Compound of Wafer to Reduce Stress

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF