the guiding structures being at least partially left in the finished device

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H01L2224/82138

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/82138the guiding structures being at least partially left in the finished device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic module and method for producing same
- Patent number 10,932,386
- Issue date Feb 23, 2021
- Dyconex AG
- Marc Hauer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for producing a circuit board element
- Patent number 10,426,040
- Issue date Sep 24, 2019
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages and methods of making and using the same
- Patent number 9,666,516
- Issue date May 30, 2017
- General Electric Company
- Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D device packaging using through-substrate posts
- Patent number 9,515,006
- Issue date Dec 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting devices in substrate and device-mounting substra...
- Patent number 9,119,332
- Issue date Aug 25, 2015
- Sony Corporation
- Katsuhiro Tomoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Diode for a printable composition
- Patent number 9,105,812
- Issue date Aug 11, 2015
- NthDegree Technologies Worldwide Inc.
- Mark David Lowenthal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Diode for a printable composition
- Patent number 8,723,408
- Issue date May 13, 2014
- NthDegree Technologies Worldwide Inc.
- Mark David Lowenthal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Diode for a printable composition
- Patent number 8,674,593
- Issue date Mar 18, 2014
- NthDegree Technologies Worldwide Inc.
- Mark D. Lowenthal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Devices and methods for embedding semiconductors in printed circuit...
- Patent number 8,664,656
- Issue date Mar 4, 2014
- Apple Inc.
- Shawn X. Arnold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assemblies and methods of forming electronic assemblies
- Patent number 8,523,071
- Issue date Sep 3, 2013
- intelliPaper, LLC
- Andrew DePaula
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Diode for a printable composition
- Patent number 8,415,879
- Issue date Apr 9, 2013
- NthDegree Technologies Worldwide Inc.
- Mark D. Lowenthal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Module with embedded semiconductor IC and method of fabricating the...
- Patent number 7,547,975
- Issue date Jun 16, 2009
- TDK Corporation
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and Associated Methods
- Publication number 20140345924
- Publication date Nov 27, 2014
- Nokia Corporation
- Mark Lee ALLEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diode for a Printable Composition
- Publication number 20140291644
- Publication date Oct 2, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Mark David Lowenthal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140284795
- Publication date Sep 25, 2014
- SK HYNIX INC.
- Sang Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diode for a Printable Composition
- Publication number 20140138666
- Publication date May 22, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Mark David Lowenthal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS FOR EMBEDDING SEMICONDUCTORS IN PRINTED CIRCUIT...
- Publication number 20140134760
- Publication date May 15, 2014
- Apple Inc.
- Shawn X. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diode for a Printable Composition
- Publication number 20130168658
- Publication date Jul 4, 2013
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Mark David Lowenthal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130111744
- Publication date May 9, 2013
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130112989
- Publication date May 9, 2013
- COOLEDGE LIGHTING, INC.
- Michael Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130056749
- Publication date Mar 7, 2013
- Michael Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diode for a Printable Composition
- Publication number 20120161113
- Publication date Jun 28, 2012
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Mark David Lowenthal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Diode for a Printable Composition
- Publication number 20120161112
- Publication date Jun 28, 2012
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Mark David Lowenthal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic Assemblies and Methods of Forming Electronic Assemblies
- Publication number 20120081868
- Publication date Apr 5, 2012
- Andrew DePaula
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MOUNTING DEVICES IN SUBSTRATE AND DEVICE-MOUNTING SUBSTRA...
- Publication number 20110266039
- Publication date Nov 3, 2011
- SONY CORPORATION
- Katsuhiro TOMODA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Module with embedded semiconductor IC and method of fabricating the...
- Publication number 20050029642
- Publication date Feb 10, 2005
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

the guiding structures being at least partially left in the finished device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic module and method for producing same

Method for producing a circuit board element

Electronic packages and methods of making and using the same

3D device packaging using through-substrate posts

Method of mounting devices in substrate and device-mounting substra...

Diode for a printable composition

Diode for a printable composition

Diode for a printable composition

Devices and methods for embedding semiconductors in printed circuit...

Electronic assemblies and methods of forming electronic assemblies

Diode for a printable composition

Module with embedded semiconductor IC and method of fabricating the...

Patents Applicationslast 30 patents

Apparatus and Associated Methods

Diode for a Printable Composition

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Diode for a Printable Composition

DEVICES AND METHODS FOR EMBEDDING SEMICONDUCTORS IN PRINTED CIRCUIT...

Diode for a Printable Composition

BROAD-AREA LIGHTING SYSTEMS

BROAD-AREA LIGHTING SYSTEMS

BROAD-AREA LIGHTING SYSTEMS

Diode for a Printable Composition

Diode for a Printable Composition

Electronic Assemblies and Methods of Forming Electronic Assemblies

METHOD OF MOUNTING DEVICES IN SUBSTRATE AND DEVICE-MOUNTING SUBSTRA...

Module with embedded semiconductor IC and method of fabricating the...