the guiding structures being at least partially left in the finished device

Industry

CPC
H01L2224/83138

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83138the guiding structures being at least partially left in the finished device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Adhesive for semiconductor sensor chip mounting, and semiconductor...
- Patent number 10,790,217
- Issue date Sep 29, 2020
- Sekisui Chemical Co., Ltd.
- Saori Ueda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor package including multiple semiconductor chips and me...
- Patent number 10,784,244
- Issue date Sep 22, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas sensor packages
- Patent number 10,730,743
- Issue date Aug 4, 2020
- Analog Devices Global Unlimited Company
- Oliver J. Kierse
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Adhesive for semiconductor mounting, and semiconductor sensor
- Patent number 10,679,925
- Issue date Jun 9, 2020
- Sekisui Chemical Co., Ltd.
- Saori Ueda
- G01 - MEASURING TESTING
Information Patent Grant
Solution deposited magnetically guided chiplet displacement
- Patent number 10,636,837
- Issue date Apr 28, 2020
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 10,442,958
- Issue date Oct 15, 2019
- Dexerials Corporation
- Yuta Araki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor component support and semiconductor device
- Patent number 10,068,821
- Issue date Sep 4, 2018
- Nichia Corporation
- Takeaki Shirase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chips stacked via rela...
- Patent number 9,508,670
- Issue date Nov 29, 2016
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- Koji Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic devices and methods for manufacturing stack...
- Patent number 9,147,623
- Issue date Sep 29, 2015
- Micron Technology, Inc.
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode for a printable composition
- Patent number 9,130,124
- Issue date Sep 8, 2015
- NthDegree Technologies Worldwide Inc.
- Mark David Lowenthal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Stacked microelectronic devices and methods for manufacturing stack...
- Patent number 8,803,307
- Issue date Aug 12, 2014
- Micron Technology, Inc.
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit structure and method of forming the same usin...
- Patent number 8,723,335
- Issue date May 13, 2014
- Sang-Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode for a printable composition
- Patent number 8,674,593
- Issue date Mar 18, 2014
- NthDegree Technologies Worldwide Inc.
- Mark D. Lowenthal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Stacked microelectronic devices and methods for manufacturing stack...
- Patent number 8,501,546
- Issue date Aug 6, 2013
- Micron Technology, Inc.
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mosfet package
- Patent number 8,455,986
- Issue date Jun 4, 2013
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having substrate for high speed semiconductor...
- Patent number 8,441,116
- Issue date May 14, 2013
- Hynix Semiconductor Inc.
- Woong Sun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package through-electrode suitable for a stacked semi...
- Patent number 8,232,654
- Issue date Jul 31, 2012
- Hynix Semiconductor Inc.
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for bonding flip chip
- Patent number 8,211,745
- Issue date Jul 3, 2012
- Electronics and Telecommunications Research Institute
- Yong Sung Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,183,607
- Issue date May 22, 2012
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfilled semiconductor die assemblies and methods of forming the...
- Patent number 8,093,730
- Issue date Jan 10, 2012
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic devices and methods for manufacturing stack...
- Patent number 8,093,702
- Issue date Jan 10, 2012
- Micron Technology, Inc.
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package having adhesive/spacer structure and...
- Patent number 8,030,134
- Issue date Oct 4, 2011
- ChipPAC, Inc.
- Hyeog Chan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package reducing wiring layers on substrate and its carrier
- Patent number 8,026,615
- Issue date Sep 27, 2011
- ChipMOS Technologies Inc.
- Hung Tsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOSFET package
- Patent number 7,985,991
- Issue date Jul 26, 2011
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package through-electrode suitable for a stacked semi...
- Patent number 7,973,414
- Issue date Jul 5, 2011
- Hynix Semiconductor Inc.
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing stacked semiconductor device
- Patent number 7,955,896
- Issue date Jun 7, 2011
- Kabushiki Kaisha Toshiba
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting an electronic component on a preferably soft su...
- Patent number 7,948,764
- Issue date May 24, 2011
- Oberthur Technologies
- Guy Enouf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive for electronic components, method for manufacturing semico...
- Patent number 7,915,743
- Issue date Mar 29, 2011
- Sekisui Chemical Co., Ltd.
- Hideaki Ishizawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Low shrinkage polyester thermosetting resins
- Patent number 7,868,113
- Issue date Jan 11, 2011
- Designer Molecules, Inc.
- Stephen M. Dershem
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
IC package reducing wiring layers on substrate and its chip carrier
- Patent number 7,781,898
- Issue date Aug 24, 2010
- ChipMOS Technologies Inc.
- Hung-Tsun Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
- Publication number 20140346683
- Publication date Nov 27, 2014
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140284795
- Publication date Sep 25, 2014
- SK HYNIX INC.
- Sang Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140239467
- Publication date Aug 28, 2014
- Toyota Jidosha Kabushiki Kaisha
- Masaki AOSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diode for a Printable Composition
- Publication number 20140138666
- Publication date May 22, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Mark David Lowenthal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE
- Publication number 20140021595
- Publication date Jan 23, 2014
- Takeaki SHIRASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
- Publication number 20130292854
- Publication date Nov 7, 2013
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130264696
- Publication date Oct 10, 2013
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120217556
- Publication date Aug 30, 2012
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR HIGH SPEED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PA...
- Publication number 20120217637
- Publication date Aug 30, 2012
- Hynix Semiconductor Inc.
- Woong Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diode for a Printable Composition
- Publication number 20120161112
- Publication date Jun 28, 2012
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Mark David Lowenthal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
- Publication number 20120108010
- Publication date May 3, 2012
- Micron Technology, Inc.
- Edmund Lua Koon Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING MATERIAL, SINTERED BOND AND METHOD FOR PRODUCING A SINTER...
- Publication number 20120003465
- Publication date Jan 5, 2012
- Martin Rittner
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110298020
- Publication date Dec 8, 2011
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CIRCUIT STRUCTURE AND METHOD OF FORMING THE SAME USIN...
- Publication number 20110285027
- Publication date Nov 24, 2011
- Sang-Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE THROUGH-ELECTRODE SUITABLE FOR A STACKED SEMI...
- Publication number 20110198722
- Publication date Aug 18, 2011
- Hynix Semiconductor Inc.
- Min Suk SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR BONDING FLIP CHIP
- Publication number 20110089577
- Publication date Apr 21, 2011
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC Package Reducing Wiring Layers on Substrate and Its Carrier
- Publication number 20100264540
- Publication date Oct 21, 2010
- CHIPMOS TECHNOLOGIES INC.
- Hung Tsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING STACKED SEMICONDUCTOR DEVICE
- Publication number 20100035381
- Publication date Feb 11, 2010
- Kabushiki Kaisha Toshiba
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive for electronic components, method and for manufacturing se...
- Publication number 20090311827
- Publication date Dec 17, 2009
- Hideaki Ishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for mounting an electronic component on a preferably soft su...
- Publication number 20090200064
- Publication date Aug 13, 2009
- OBERTHUR CARD SYSTEMS SA
- Guy Enouf
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE FOR HIGH SPEED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PA...
- Publication number 20090152708
- Publication date Jun 18, 2009
- Woong Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20090051046
- Publication date Feb 26, 2009
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
- Publication number 20090045496
- Publication date Feb 19, 2009
- Micron Technology, Inc.
- Edmund Lua Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE THROUGH-ELECTRODE SUITABLE FOR A STACKED SEMI...
- Publication number 20090045504
- Publication date Feb 19, 2009
- Min Suk SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same, circuit bo...
- Publication number 20080274588
- Publication date Nov 6, 2008
- SEIKO EPSON CORPORATION
- Yoshiharu Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low shrinkage polyester thermosetting resins
- Publication number 20080251935
- Publication date Oct 16, 2008
- Stephen Dersham
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Chip package reducing wiring layers on substrate and its carrier
- Publication number 20080174031
- Publication date Jul 24, 2008
- ChipMOS TECHNOLOGIES INC.
- Hung-Tsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080169537
- Publication date Jul 17, 2008
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20070040249
- Publication date Feb 22, 2007
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20070040250
- Publication date Feb 22, 2007
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

the guiding structures being at least partially left in the finished device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Adhesive for semiconductor sensor chip mounting, and semiconductor...

Semiconductor package including multiple semiconductor chips and me...

Gas sensor packages

Adhesive for semiconductor mounting, and semiconductor sensor

Solution deposited magnetically guided chiplet displacement

Anisotropic conductive film and production method of the same

Semiconductor component support and semiconductor device

Semiconductor device including semiconductor chips stacked via rela...

Stacked microelectronic devices and methods for manufacturing stack...

Diode for a printable composition

Stacked microelectronic devices and methods for manufacturing stack...

Semiconductor circuit structure and method of forming the same usin...

Diode for a printable composition

Stacked microelectronic devices and methods for manufacturing stack...

Mosfet package

Semiconductor package having substrate for high speed semiconductor...

Semiconductor package through-electrode suitable for a stacked semi...

Method and structure for bonding flip chip

Semiconductor device

Underfilled semiconductor die assemblies and methods of forming the...

Stacked microelectronic devices and methods for manufacturing stack...

Stacked semiconductor package having adhesive/spacer structure and...

IC package reducing wiring layers on substrate and its carrier

MOSFET package

Semiconductor package through-electrode suitable for a stacked semi...

Method of manufacturing stacked semiconductor device

Method for mounting an electronic component on a preferably soft su...

Adhesive for electronic components, method for manufacturing semico...

Low shrinkage polyester thermosetting resins

IC package reducing wiring layers on substrate and its chip carrier

Patents Applicationslast 30 patents

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

Diode for a Printable Composition

SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SUBSTRATE FOR HIGH SPEED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PA...

Diode for a Printable Composition

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...

SINTERING MATERIAL, SINTERED BOND AND METHOD FOR PRODUCING A SINTER...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR CIRCUIT STRUCTURE AND METHOD OF FORMING THE SAME USIN...

SEMICONDUCTOR PACKAGE THROUGH-ELECTRODE SUITABLE FOR A STACKED SEMI...

METHOD AND STRUCTURE FOR BONDING FLIP CHIP

IC Package Reducing Wiring Layers on Substrate and Its Carrier

METHOD OF MANUFACTURING STACKED SEMICONDUCTOR DEVICE

Adhesive for electronic components, method and for manufacturing se...

Method for mounting an electronic component on a preferably soft su...

SUBSTRATE FOR HIGH SPEED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PA...

Semiconductor device and manufacturing method for the same

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...

SEMICONDUCTOR PACKAGE THROUGH-ELECTRODE SUITABLE FOR A STACKED SEMI...

Semiconductor device and method of fabricating the same, circuit bo...

Low shrinkage polyester thermosetting resins

Chip package reducing wiring layers on substrate and its carrier

SEMICONDUCTOR DEVICE

Semiconductor device

Semiconductor device