the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted

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H01L2224/24227

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/24227the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted

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Patents Grantslast 30 patents

Information Patent Grant
Seamless interconnect thresholds using dielectric fluid channels
- Patent number 12,154,837
- Issue date Nov 26, 2024
- Sciperio, Inc.
- Jason Benoit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with fan-out feature
- Patent number 12,125,797
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacture of semiconductor devices having redistributi...
- Patent number 12,119,235
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in embedded wafer-level ball-grid array package
- Patent number 12,094,843
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of chip package with fan-out structure
- Patent number 12,080,653
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 12,062,832
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of additively manufacturing an integrated circuit of an inte...
- Patent number 12,027,477
- Issue date Jul 2, 2024
- Board of Trustees of Michigan State University
- Ioannis Papapolymerou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Electronic package including electronic structure and electronic co...
- Patent number 11,973,047
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,948,891
- Issue date Apr 2, 2024
- NEPES CO., LTD.
- Sang Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,901,336
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through-mold via
- Patent number 11,869,829
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Joo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric stackup structure for SoC package substrates
- Patent number 11,862,597
- Issue date Jan 2, 2024
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,855,030
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power converter
- Patent number 11,784,105
- Issue date Oct 10, 2023
- Mitsubishi Electric Corporation
- Hodaka Rokubuichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Chip package structure with molding layer
- Patent number 11,756,931
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,742,219
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component embedded substrate
- Patent number 11,640,952
- Issue date May 2, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Sun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer semiconductor package with stacked passive components
- Patent number 11,587,899
- Issue date Feb 21, 2023
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in embedded wafer-level ball-grid array package
- Patent number 11,469,191
- Issue date Oct 11, 2022
- STATS ChipPAC Pte. Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with molding layer and method for forming th...
- Patent number 11,469,215
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and fabricating method for display device
- Patent number 11,450,268
- Issue date Sep 20, 2022
- Samsung Display Co., Ltd.
- Chong Sup Chang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Chip package with fan-out structure
- Patent number 11,404,381
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating package structure having encapsulate sensing...
- Patent number 11,404,361
- Issue date Aug 2, 2022
- Siliconware Precision Industries Co., Ltd.
- Shao-Tzu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,380,862
- Issue date Jul 5, 2022
- Apple Inc.
- Andreas Bibi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,374,303
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250022857
- Publication date Jan 16, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240387194
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...
- Publication number 20240379571
- Publication date Nov 14, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240356199
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240290913
- Publication date Aug 29, 2024
- InnoLux Corporation
- Jia-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240274556
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Won CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Dissipation Structures and Methods for Forming Same
- Publication number 20240266334
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
- Publication number 20240258274
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Sangkyu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234374
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240222305
- Publication date Jul 4, 2024
- Industrial Technology Research Institute
- Yu-Wei HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240178120
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE INCLUDING ELECTRONIC STRUCTURE AND ELECTRONIC CO...
- Publication number 20240162180
- Publication date May 16, 2024
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asymmetric Stackup Structure for SoC Package Substrates
- Publication number 20240162182
- Publication date May 16, 2024
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136329
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRAT...
- Publication number 20240113087
- Publication date Apr 4, 2024
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105661
- Publication date Mar 28, 2024
- Unimicron Technology Corp.
- Yu-Shen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096837
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240088085
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240071995
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Raeyoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE CHUCK, WORKPIECE HANDLING APPARATUS, MANUFACTURING METHOD...
- Publication number 20240063048
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ching Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT MODULE
- Publication number 20240014121
- Publication date Jan 11, 2024
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Packages Including Interconnect Die Embedded in Package Substrates
- Publication number 20230307427
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268288
- Publication date Aug 24, 2023
- nD-HI Technologies Lab,Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS
- Publication number 20230207509
- Publication date Jun 29, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asymmetric Stackup Structure for SoC Package Substrates
- Publication number 20230092505
- Publication date Mar 23, 2023
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE WITH CAVITY STRUCTURE FOR HETEROGENEOUS PACKAGING ARCHIT...
- Publication number 20230085411
- Publication date Mar 16, 2023
- Intel Corporation
- Sameer Paital
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE IC DIE PACKAGE INCLUDING IC DIE DIRECTLY BONDED TO FRONT...
- Publication number 20230034737
- Publication date Feb 2, 2023
- Intel Corporation
- Junxin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230005962
- Publication date Jan 5, 2023
- LG Display Co., Ltd.
- Chang Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna in Embedded Wafer-Level Ball-Grid Array Package
- Publication number 20220375886
- Publication date Nov 24, 2022
- STATS ChipPAC Pte Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS

the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Seamless interconnect thresholds using dielectric fluid channels

Package structure with fan-out feature

Methods of manufacture of semiconductor devices having redistributi...

Antenna in embedded wafer-level ball-grid array package

Formation method of chip package with fan-out structure

Electronic device and manufacturing method thereof

Method of additively manufacturing an integrated circuit of an inte...

Multiple plated via arrays of different wire heights on a same subs...

Electronic package including electronic structure and electronic co...

Semiconductor package and manufacturing method thereof

Semiconductor package

Semiconductor device with through-mold via

Asymmetric stackup structure for SoC package substrates

Package structure and method of manufacturing the same

Circuit board structure and method for manufacturing a circuit boar...

Semiconductor device and power converter

Light emitting diode display with redundancy scheme

Chip package structure with molding layer

Integrated fan-out package and manufacturing method thereof

Method for manufacturing an electronic module and electronic module

Electronic component embedded substrate

Multi-layer semiconductor package with stacked passive components

Multi-die package with bridge layer

Antenna in embedded wafer-level ball-grid array package

Chip package structure with molding layer and method for forming th...

Display device and fabricating method for display device

Chip package with fan-out structure

Method for fabricating package structure having encapsulate sensing...

Light emitting diode display with redundancy scheme

Package structure and method of fabricating the same

Patents Applicationslast 30 patents

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Thermal Dissipation Structures and Methods for Forming Same

SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE INCLUDING ELECTRONIC STRUCTURE AND ELECTRONIC CO...

Asymmetric Stackup Structure for SoC Package Substrates

SEMICONDUCTOR PACKAGE

HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRAT...

CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

WORKPIECE CHUCK, WORKPIECE HANDLING APPARATUS, MANUFACTURING METHOD...

ELECTRONIC CIRCUIT MODULE

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

Packages Including Interconnect Die Embedded in Package Substrates

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS

Asymmetric Stackup Structure for SoC Package Substrates

GLASS CORE WITH CAVITY STRUCTURE FOR HETEROGENEOUS PACKAGING ARCHIT...

COMPOSITE IC DIE PACKAGE INCLUDING IC DIE DIRECTLY BONDED TO FRONT...

DISPLAY DEVICE

Antenna in Embedded Wafer-Level Ball-Grid Array Package