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the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted
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Electronic package including electronic structure and electronic co...
Patent number
11,973,047
Issue date
Apr 30, 2024
Siliconware Precision Industries Co., Ltd.
Feng Kao
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package and manufacturing method thereof
Patent number
11,948,891
Issue date
Apr 2, 2024
NEPES CO., LTD.
Sang Yong Park
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package
Patent number
11,901,336
Issue date
Feb 13, 2024
Samsung Electronics Co., Ltd.
Hyuekjae Lee
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device with through-mold via
Patent number
11,869,829
Issue date
Jan 9, 2024
Amkor Technology Singapore Holding Pte Ltd.
Dong Joo Park
H01 - BASIC ELECTRIC ELEMENTS
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Asymmetric stackup structure for SoC package substrates
Patent number
11,862,597
Issue date
Jan 2, 2024
Apple Inc.
Yikang Deng
H01 - BASIC ELECTRIC ELEMENTS
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Package structure and method of manufacturing the same
Patent number
11,855,030
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Shu Lin
H01 - BASIC ELECTRIC ELEMENTS
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Circuit board structure and method for manufacturing a circuit boar...
Patent number
11,792,941
Issue date
Oct 17, 2023
IMBERATEK, LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and power converter
Patent number
11,784,105
Issue date
Oct 10, 2023
Mitsubishi Electric Corporation
Hodaka Rokubuichi
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Light emitting diode display with redundancy scheme
Patent number
11,778,842
Issue date
Oct 3, 2023
Apple Inc.
Andreas Bibl
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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Chip package structure with molding layer
Patent number
11,756,931
Issue date
Sep 12, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
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Integrated fan-out package and manufacturing method thereof
Patent number
11,742,219
Issue date
Aug 29, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Kai-Chiang Wu
H01 - BASIC ELECTRIC ELEMENTS
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Method for manufacturing an electronic module and electronic module
Patent number
11,716,816
Issue date
Aug 1, 2023
IMBERATEK, LLC
Antti Iihola
H01 - BASIC ELECTRIC ELEMENTS
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Electronic component embedded substrate
Patent number
11,640,952
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May 2, 2023
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Mi Sun Hwang
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Multi-layer semiconductor package with stacked passive components
Patent number
11,587,899
Issue date
Feb 21, 2023
Texas Instruments Incorporated
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
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Multi-die package with bridge layer
Patent number
11,476,125
Issue date
Oct 18, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei Sen Chang
H01 - BASIC ELECTRIC ELEMENTS
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Antenna in embedded wafer-level ball-grid array package
Patent number
11,469,191
Issue date
Oct 11, 2022
STATS ChipPAC Pte. Ltd.
Pandi Chelvam Marimuthu
H01 - BASIC ELECTRIC ELEMENTS
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Chip package structure with molding layer and method for forming th...
Patent number
11,469,215
Issue date
Oct 11, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
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Display device and fabricating method for display device
Patent number
11,450,268
Issue date
Sep 20, 2022
Samsung Display Co., Ltd.
Chong Sup Chang
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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Method for fabricating package structure having encapsulate sensing...
Patent number
11,404,361
Issue date
Aug 2, 2022
Siliconware Precision Industries Co., Ltd.
Shao-Tzu Tang
H01 - BASIC ELECTRIC ELEMENTS
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Chip package with fan-out structure
Patent number
11,404,381
Issue date
Aug 2, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Shing-Chao Chen
H01 - BASIC ELECTRIC ELEMENTS
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Light emitting diode display with redundancy scheme
Patent number
11,380,862
Issue date
Jul 5, 2022
Apple Inc.
Andreas Bibi
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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Package structure and method of fabricating the same
Patent number
11,374,303
Issue date
Jun 28, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Fang-Yu Liang
H01 - BASIC ELECTRIC ELEMENTS
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Chip package structure and manufacturing method thereof
Patent number
11,362,057
Issue date
Jun 14, 2022
Unimicron Technology Corp.
Pu-Ju Lin
H01 - BASIC ELECTRIC ELEMENTS
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Module
Patent number
11,322,472
Issue date
May 3, 2022
Murata Manufacturing Co., Ltd.
Yoshihito Otsubo
H01 - BASIC ELECTRIC ELEMENTS
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Integrated fan-out package and manufacturing method thereof
Patent number
11,239,096
Issue date
Feb 1, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Kai-Chiang Wu
H01 - BASIC ELECTRIC ELEMENTS
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Circuit board structure and method for manufacturing a circuit boar...
Patent number
11,134,572
Issue date
Sep 28, 2021
IMBERATEK, LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
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Module assembly
Patent number
11,127,665
Issue date
Sep 21, 2021
Qorvo US, Inc.
Deep C. Dumka
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Electronic device and manufacturing method thereof
Patent number
11,075,439
Issue date
Jul 27, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Pei-Hsuan Lee
H01 - BASIC ELECTRIC ELEMENTS
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Package structure and method of manufacturing the same
Patent number
11,069,642
Issue date
Jul 20, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Shu Lin
H01 - BASIC ELECTRIC ELEMENTS
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Method for electrically contacting a component by galvanic connecti...
Patent number
11,037,862
Issue date
Jun 15, 2021
Siemens Aktiengesellschaft
Hubert Baueregger
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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last 30 patents
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Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240136329
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Hyuekjae Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRAT...
Publication number
20240113087
Publication date
Apr 4, 2024
Intel Corporation
Brandon Marin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME
Publication number
20240105661
Publication date
Mar 28, 2024
Unimicron Technology Corp.
Yu-Shen CHEN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240096837
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Shu Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240088085
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Shu Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240071995
Publication date
Feb 29, 2024
Samsung Electronics Co., Ltd.
Raeyoung Kang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
WORKPIECE CHUCK, WORKPIECE HANDLING APPARATUS, MANUFACTURING METHOD...
Publication number
20240063048
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Ching Lo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELECTRONIC CIRCUIT MODULE
Publication number
20240014121
Publication date
Jan 11, 2024
MURATA MANUFACTURING CO., LTD.
Yoshihito OTSUBO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
Publication number
20240008298
Publication date
Jan 4, 2024
Apple Inc.
Andreas Bibl
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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Patent Application
Packages Including Interconnect Die Embedded in Package Substrates
Publication number
20230307427
Publication date
Sep 28, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Sheng-Chi Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230268288
Publication date
Aug 24, 2023
nD-HI Technologies Lab,Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS
Publication number
20230207509
Publication date
Jun 29, 2023
TEXAS INSTRUMENTS INCORPORATED
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Asymmetric Stackup Structure for SoC Package Substrates
Publication number
20230092505
Publication date
Mar 23, 2023
Apple Inc.
Yikang Deng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
GLASS CORE WITH CAVITY STRUCTURE FOR HETEROGENEOUS PACKAGING ARCHIT...
Publication number
20230085411
Publication date
Mar 16, 2023
Intel Corporation
Sameer Paital
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
COMPOSITE IC DIE PACKAGE INCLUDING IC DIE DIRECTLY BONDED TO FRONT...
Publication number
20230034737
Publication date
Feb 2, 2023
Intel Corporation
Junxin Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
DISPLAY DEVICE
Publication number
20230005962
Publication date
Jan 5, 2023
LG Display Co., Ltd.
Chang Ho LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Antenna in Embedded Wafer-Level Ball-Grid Array Package
Publication number
20220375886
Publication date
Nov 24, 2022
STATS ChipPAC Pte Ltd.
Pandi Chelvam Marimuthu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
Publication number
20220293876
Publication date
Sep 15, 2022
Apple Inc.
Andreas Bibl
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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Patent Application
Seamless Interconnect Thresholds using Dielectric Fluid Channels
Publication number
20220238401
Publication date
Jul 28, 2022
SCIPERIO, INC.
Jason Benoit
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20220157625
Publication date
May 19, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Chiang Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20220139880
Publication date
May 5, 2022
Samsung Electronics Co., Ltd.
Hyuekjae Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR
Publication number
20220068876
Publication date
Mar 3, 2022
SAMSUNG DISPLAY CO., LTD.
Young Rag DO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20220068867
Publication date
Mar 3, 2022
Siliconware Precision Industries Co., Ltd.
Feng Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS
Publication number
20220037280
Publication date
Feb 3, 2022
TEXAS INSTRUMENTS INCORPORATED
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
FAN-OUT PACKAGING METHOD EMPLOYING COMBINED PROCESS
Publication number
20210358883
Publication date
Nov 18, 2021
SHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP (LIMITED PARTNERSHIP)
Chuan HU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20210351491
Publication date
Nov 11, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Pei-Hsuan Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20210343675
Publication date
Nov 4, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Shu Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE
Publication number
20210329788
Publication date
Oct 21, 2021
IMBERATEK, LLC
Antti Iihola
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20210313274
Publication date
Oct 7, 2021
NEPES CO., LTD.
Sang Yong PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
Publication number
20210257572
Publication date
Aug 19, 2021
Apple Inc.
Andreas Bibl
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS