the imperfections being within the semiconductor body

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier

Current Industry

H01L29/32the imperfections being within the semiconductor body

Industries

Patents Grantslast 30 patents

Information Patent Grant
SiC epitaxial wafer, production method therefor, and defect identif...
- Patent number 11,961,736
- Issue date Apr 16, 2024
- Resonac Corporation
- Ling Guo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon carbide crystal
- Patent number 11,952,676
- Issue date Apr 9, 2024
- GlobalWafers Co., Ltd.
- Ching-Shan Lin
- C30 - CRYSTAL GROWTH
Information Patent Grant
Semiconductor device including trench structure and manufacturing m...
- Patent number 11,929,397
- Issue date Mar 12, 2024
- Infineon Technologies AG
- Thomas Basler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer
- Patent number 11,929,229
- Issue date Mar 12, 2024
- MI2-FACTORY GMBH
- Florian Krippendorf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
MOSFET and memory cell having improved drain current through back b...
- Patent number 11,908,899
- Issue date Feb 20, 2024
- Zeno Semiconductor, Inc.
- Jin-Woo Han
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 11,901,416
- Issue date Feb 13, 2024
- Mitsubishi Electric Corporation
- Tetsujiro Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,894,258
- Issue date Feb 6, 2024
- Fuji Electric Co., Ltd.
- Takahiro Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device
- Patent number 11,888,024
- Issue date Jan 30, 2024
- Infineon Technologies AG
- Reinhard Ploss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating a semiconductor device
- Patent number 11,869,963
- Issue date Jan 9, 2024
- Infineon Technologies AG
- John Twynam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method
- Patent number 11,854,782
- Issue date Dec 26, 2023
- Fuji Electric Co., Ltd.
- Yasunori Agata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,855,077
- Issue date Dec 26, 2023
- Fuji Electric Co., Ltd.
- Shigeki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF substrate structure and method of production
- Patent number 11,848,191
- Issue date Dec 19, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Emmanuel Augendre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing MOSFET having a semiconductor base substrat...
- Patent number 11,843,048
- Issue date Dec 12, 2023
- Shindengen Electric Manufacturing Co., Ltd.
- Daisuke Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device having overvoltage protection and method...
- Patent number 11,843,045
- Issue date Dec 12, 2023
- Infineon Technologies Austria AG
- Markus Beninger-Bina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 11,830,782
- Issue date Nov 28, 2023
- Fuji Electric Co., Ltd.
- Motoyoshi Kubouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,823,898
- Issue date Nov 21, 2023
- Fuji Electric Co., Ltd.
- Yuichi Onozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dislocation glide suppression for misfit dislocation free heteroepi...
- Patent number 11,804,525
- Issue date Oct 31, 2023
- The Regents of the University of California
- John Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,777,028
- Issue date Oct 3, 2023
- Kabushiki Kaisha Toshiba
- Yusuke Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,756,791
- Issue date Sep 12, 2023
- Kabushiki Kaisha Toshiba
- Shingo Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulk substrates with a self-aligned buried polycrystalline layer
- Patent number 11,749,559
- Issue date Sep 5, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Steven M. Shank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,749,722
- Issue date Sep 5, 2023
- Kabushiki Kaisha Toshiba
- Takuma Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having a diode structure in a SiC semicondu...
- Patent number 11,742,391
- Issue date Aug 29, 2023
- Infineon Technologies AG
- Thomas Basler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method for semiconductor device
- Patent number 11,742,249
- Issue date Aug 29, 2023
- Fuji Electric Co., Ltd.
- Motoyoshi Kubouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,735,424
- Issue date Aug 22, 2023
- Fuji Electric Co., Ltd.
- Yasunori Agata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,735,584
- Issue date Aug 22, 2023
- Fuji Electric Co., Ltd.
- Tatsuya Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device containing an oxygen concentration distribution
- Patent number 11,710,766
- Issue date Jul 25, 2023
- Fuji Electric Co., Ltd.
- Tomoyuki Obata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for implanting ions in wafers
- Patent number 11,705,300
- Issue date Jul 18, 2023
- MI2-FACTORY GMBH
- Florian Krippendorf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon wafer and manufacturing method of the same
- Patent number 11,695,048
- Issue date Jul 4, 2023
- Sumco Corporation
- Kazuhisa Torigoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power diode and method of manufacturing a power diode
- Patent number 11,695,083
- Issue date Jul 4, 2023
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low etch pit density 6 inch semi-insulating gallium arsenide wafers
- Patent number 11,680,340
- Issue date Jun 20, 2023
- AXT, Inc.
- Rajaram Shetty
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MONOCRYSTALLINE SILICON CARBIDE SUBSTRATE, METHOD FOR MANUFACTURING...
- Publication number 20240105782
- Publication date Mar 28, 2024
- TANKEBLUE SEMICONDUCTOR CO., LTD.
- Yanfang LOU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD
- Publication number 20240096629
- Publication date Mar 21, 2024
- Fuji Electric Co., Ltd.
- Yasunori AGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240087898
- Publication date Mar 14, 2024
- Kabushiki Kaisha Toshiba
- Seiya SAKAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20240079286
- Publication date Mar 7, 2024
- Fuji Electric Co., Ltd.
- Motoyoshi KUBOUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING TH...
- Publication number 20240055258
- Publication date Feb 15, 2024
- Fuji Electric Co., Ltd.
- Yoshihito ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240047200
- Publication date Feb 8, 2024
- Fuji Electric Co., Ltd.
- Yuichi Onozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240047454
- Publication date Feb 8, 2024
- Mitsubishi Electric Corporation
- Hidenori FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230420524
- Publication date Dec 28, 2023
- Mitsubishi Electric Corporation
- Kenji SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230420523
- Publication date Dec 28, 2023
- DENSO CORPORATION
- Yusuke HAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW ETCH PIT DENSITY 6 INCH SEMI-INSULATING GALLIUM ARSENIDE WAFERS
- Publication number 20230407522
- Publication date Dec 21, 2023
- AXT, Inc.
- Rajaram Shetty
- C30 - CRYSTAL GROWTH
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230402511
- Publication date Dec 14, 2023
- Fuji Electric Co., Ltd.
- Motoyoshi KUBOUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230386844
- Publication date Nov 30, 2023
- Sumitomo Heavy Industries, Ltd.
- Suguru YACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230369137
- Publication date Nov 16, 2023
- Fuji Electric Co., Ltd.
- Motoyoshi KUBOUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING POWER SEMICO...
- Publication number 20230369515
- Publication date Nov 16, 2023
- Mitsubishi Electric Corporation
- Katsumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230361111
- Publication date Nov 9, 2023
- Fuji Electric Co., Ltd.
- Tatsuya NAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230360915
- Publication date Nov 9, 2023
- Fuji Electric Co., Ltd.
- Yasunori AGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20230361167
- Publication date Nov 9, 2023
- Fuji Electric Co., Ltd.
- Tomoyuki OBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230317812
- Publication date Oct 5, 2023
- Fuji Electric Co., Ltd.
- Takashi YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Diode and Method of Manufacturing a Power Diode
- Publication number 20230307554
- Publication date Sep 28, 2023
- Infineon Technologies Austria AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON WAFER AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230307505
- Publication date Sep 28, 2023
- SUMCO CORPORATION
- Kazuhisa TORIGOE
- C30 - CRYSTAL GROWTH
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230299078
- Publication date Sep 21, 2023
- Fuji Electric Co., Ltd.
- Soichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230299077
- Publication date Sep 21, 2023
- Fuji Electric Co., Ltd.
- Toru MURAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER
- Publication number 20230282439
- Publication date Sep 7, 2023
- mi2-factory GmbH
- Florian KRIPPENDORF
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230275129
- Publication date Aug 31, 2023
- Fuji Electric Co., Ltd.
- Hiroki WAKIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER SEMIC...
- Publication number 20230268398
- Publication date Aug 24, 2023
- Mitsubishi Electric Corporation
- Katsumi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230261044
- Publication date Aug 17, 2023
- Fuji Electric Co., Ltd.
- Yuki SAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE BANDGAP UNIPOLAR/BIPOLAR TRANSISTOR
- Publication number 20230246073
- Publication date Aug 3, 2023
- Wolfspeed, Inc.
- Thomas E. Harrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20230231045
- Publication date Jul 20, 2023
- FUJITSU LIMITED
- Atsushi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20230223443
- Publication date Jul 13, 2023
- Fuji Electric Co., Ltd.
- Takumi FUJIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING DISLOCATION ENHANCED STRAIN IN NMOS AND PMOS STR...
- Publication number 20230197848
- Publication date Jun 22, 2023
- Daedalus Prime LLC
- Michael Jackson
- H01 - BASIC ELECTRIC ELEMENTS

the imperfections being within the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

SiC epitaxial wafer, production method therefor, and defect identif...

Silicon carbide crystal

Semiconductor device including trench structure and manufacturing m...

Semiconductor wafer

MOSFET and memory cell having improved drain current through back b...

Semiconductor device

Semiconductor device and manufacturing method thereof

Method of forming a semiconductor device

Semiconductor device and method of fabricating a semiconductor device

Semiconductor device and fabrication method

Semiconductor device

RF substrate structure and method of production

Method of manufacturing MOSFET having a semiconductor base substrat...

Power semiconductor device having overvoltage protection and method...

Semiconductor device and fabrication method thereof

Semiconductor device and method for manufacturing the same

Dislocation glide suppression for misfit dislocation free heteroepi...

Semiconductor device

Semiconductor device and method for manufacturing the same

Bulk substrates with a self-aligned buried polycrystalline layer

Semiconductor device

Semiconductor component having a diode structure in a SiC semicondu...

Semiconductor device and fabrication method for semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device

Semiconductor device containing an oxygen concentration distribution

Method and device for implanting ions in wafers

Silicon wafer and manufacturing method of the same

Power diode and method of manufacturing a power diode

Low etch pit density 6 inch semi-insulating gallium arsenide wafers

Patents Applicationslast 30 patents

MONOCRYSTALLINE SILICON CARBIDE SUBSTRATE, METHOD FOR MANUFACTURING...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING TH...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

LOW ETCH PIT DENSITY 6 INCH SEMI-INSULATING GALLIUM ARSENIDE WAFERS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING POWER SEMICO...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Power Diode and Method of Manufacturing a Power Diode

SILICON WAFER AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR WAFER

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER SEMIC...

SEMICONDUCTOR DEVICE

WIDE BANDGAP UNIPOLAR/BIPOLAR TRANSISTOR

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

SILICON CARBIDE SEMICONDUCTOR DEVICE

METHODS OF FORMING DISLOCATION ENHANCED STRAIN IN NMOS AND PMOS STR...