the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates

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H01L23/538

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming RDLs and structure formed thereof
- Patent number 12,315,819
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Package substrate, electronic device package and method for manufac...
- Patent number 12,315,828
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wu Chou Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,315,831
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,315,847
- Issue date May 27, 2025
- LG Display Co., Ltd.
- Hyowon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure including low- and high-density conductive structures
- Patent number 12,315,820
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,315,821
- Issue date May 27, 2025
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a fan-out panel level semiconductor package
- Patent number 12,315,822
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Jeongho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 12,317,416
- Issue date May 27, 2025
- Kioxia Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 12,315,806
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of a semiconductor chip having pads of di...
- Patent number 12,315,818
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor configurations for multi-deck memory devices
- Patent number 12,310,116
- Issue date May 20, 2025
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 12,308,334
- Issue date May 20, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsin He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic wafer communication systems and related packages
- Patent number 12,306,434
- Issue date May 20, 2025
- Lightmatter, Inc.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplet first architecture for die tiling applications
- Patent number 12,308,329
- Issue date May 20, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device and apparatus for manufactu...
- Patent number 12,308,259
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Dong Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures to increase substrate routing density and methods of for...
- Patent number 12,308,321
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip to chip interconnect beyond sealring boundary
- Patent number 12,308,330
- Issue date May 20, 2025
- Ceremorphic, Inc.
- Robert Wiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating and accessing passive components in wafer-level packages
- Patent number 12,308,335
- Issue date May 20, 2025
- Intel Corporation
- Gianni Signorini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,336
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Jungho Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting of capacitors on printed circuit boards for non-volatile m...
- Patent number 12,309,942
- Issue date May 20, 2025
- SanDisk Technologies, Inc.
- Uthayarajan A L Rasalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 12,308,308
- Issue date May 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Sung-Hua Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided routing in 3D semiconductor system-in-package structure...
- Patent number 12,308,322
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package device
- Patent number 12,308,323
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with die to die bridge solution and methods of forming t...
- Patent number 12,300,619
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,300,624
- Issue date May 13, 2025
- INNOLUX CORPORATION
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including outer conductive plate
- Patent number 12,300,625
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligning bumps in fan-out packaging process
- Patent number 12,300,659
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,682
- Issue date May 13, 2025
- Kabushiki Kaisha Toshiba
- Jia Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with conductive or magnetic nanowires for localized heating...
- Patent number 12,300,591
- Issue date May 13, 2025
- Regents of The University of Minnesota
- Bethanie J Stadler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20250167062
- Publication date May 22, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167084
- Publication date May 22, 2025
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20250167126
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES FORMED USING RDL-LAST PROCESS
- Publication number 20250167173
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167179
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Sangcheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE
- Publication number 20250167192
- Publication date May 22, 2025
- ADVANCED MICRO DEVICES, INC.
- Arsalan ALAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES
- Publication number 20250169375
- Publication date May 22, 2025
- Hyundai Motor Company
- Suk Hyun LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BUMP INTERFACE COMPATIBLE WITH DIFFERENT ORIENTATIONS AND TYPE...
- Publication number 20250167152
- Publication date May 22, 2025
- Xilinx, Inc.
- Ygal ARBEL
- G11 - INFORMATION STORAGE
Information Patent Application
Efficient Fan-Out (FO) Space Utilization in Package-On-Package (POP...
- Publication number 20250167186
- Publication date May 22, 2025
- Google LLC
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A STIFFENER
- Publication number 20250167135
- Publication date May 22, 2025
- STATS ChipPAC Pte Ltd.
- Jongkook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDIE FLIP CHIP PACKAGE WITH HEAT SINK
- Publication number 20250167067
- Publication date May 22, 2025
- STMicroelectronics International N.V.
- Jefferson Sismundo TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILD-UP FILM AND PRE-PREG SUBSTRATES IN ISOLATION PACKAGES
- Publication number 20250167125
- Publication date May 22, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester ANKAMAH-KUSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENTS FOR SOFT, FLEXIBLE CIRCUITRY LAYERS AND METHO...
- Publication number 20250167127
- Publication date May 22, 2025
- LOOMIA Technologies, Inc.
- Madison Thea MAXEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20250167674
- Publication date May 22, 2025
- Mitsubishi Heavy Industries, Ltd.
- Takashi MASUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSIBLE POWER MODULE AND A PROCESS OF IMPLEMENTING A REVERSIBLE...
- Publication number 20250167081
- Publication date May 22, 2025
- Wolfspeed, Inc.
- Ajit R. Kanale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250167138
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING-EMITTING DEVICE FILAMENT INCLUDING ELECTRODE PADS
- Publication number 20250167182
- Publication date May 22, 2025
- SEOUL SEMICONDUCTOR CO., LTD.
- Jae Hyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250167159
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250167163
- Publication date May 22, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING POWER MANAGEMENT DIE IN A STACK AND...
- Publication number 20250167177
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD
- Publication number 20250167183
- Publication date May 22, 2025
- Intel Corporation
- David O'SULLIVAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167098
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250157949
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157913
- Publication date May 15, 2025
- ROHM CO., LTD.
- Oji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20250157939
- Publication date May 15, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure and Manufacturing Method Therefor
- Publication number 20250157945
- Publication date May 15, 2025
- Huawei Technologies Co., Ltd
- Xuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157983
- Publication date May 15, 2025
- SAMSUNG ELECTRONICS CO., LTD.
- HYUNGJUN JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20250157985
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250157996
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR HEAT DISSIPATION
- Publication number 20250157876
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming RDLs and structure formed thereof

Systems and methods for an interlocking feature on a power module

Package substrate, electronic device package and method for manufac...

Package structure and manufacturing method thereof

Display device

Wiring structure including low- and high-density conductive structures

Semiconductor device and method for manufacturing semiconductor device

Methods of manufacturing a fan-out panel level semiconductor package

Wiring board, semiconductor device, and method of manufacturing wir...

Electronic device and manufacturing method thereof

Interconnection structure of a semiconductor chip having pads of di...

Transistor configurations for multi-deck memory devices

Semiconductor device and semiconductor package

Photonic wafer communication systems and related packages

Chiplet first architecture for die tiling applications

Method for manufacturing display device and apparatus for manufactu...

Structures to increase substrate routing density and methods of for...

Chip to chip interconnect beyond sealring boundary

Integrating and accessing passive components in wafer-level packages

Semiconductor package

Mounting of capacitors on printed circuit boards for non-volatile m...

Electronic package

Dual-sided routing in 3D semiconductor system-in-package structure...

Package-on-package device

Interposer with die to die bridge solution and methods of forming t...

Electronic device

Semiconductor package including outer conductive plate

Aligning bumps in fan-out packaging process

Semiconductor package

Devices with conductive or magnetic nanowires for localized heating...

Patents Applicationslast 30 patents

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME

PACKAGES FORMED USING RDL-LAST PROCESS

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE

POWER MODULES

CHIP BUMP INTERFACE COMPATIBLE WITH DIFFERENT ORIENTATIONS AND TYPE...

Efficient Fan-Out (FO) Space Utilization in Package-On-Package (POP...

SEMICONDUCTOR PACKAGE INCLUDING A STIFFENER

MULTIDIE FLIP CHIP PACKAGE WITH HEAT SINK

BUILD-UP FILM AND PRE-PREG SUBSTRATES IN ISOLATION PACKAGES

ELECTRONIC COMPONENTS FOR SOFT, FLEXIBLE CIRCUITRY LAYERS AND METHO...

POWER MODULE

REVERSIBLE POWER MODULE AND A PROCESS OF IMPLEMENTING A REVERSIBLE...

PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME

LIGHTING-EMITTING DEVICE FILAMENT INCLUDING ELECTRODE PADS

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING POWER MANAGEMENT DIE IN A STACK AND...

FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

Chip Package Structure and Manufacturing Method Therefor

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

SEMICONDUCTOR PACKAGES

PACKAGE STRUCTURE FOR HEAT DISSIPATION