TREA

the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates

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  • CPC
  • H01L23/538
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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