the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates

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CPC
H01L23/538

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,205,888
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a semiconductor wafer, semiconductor die, and...
- Patent number 12,205,919
- Issue date Jan 21, 2025
- Infineon Technologies AG
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having package substrate
- Patent number 12,205,925
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,205,939
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density interconnects for integrated circuit packages
- Patent number 12,205,902
- Issue date Jan 21, 2025
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method of forming same
- Patent number 12,205,911
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,205,914
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Inhyung Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Honeycomb pattern for conductive features
- Patent number 12,205,916
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,205,946
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,205,903
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die to die high-speed communication without discrete amplifiers bet...
- Patent number 12,205,908
- Issue date Jan 21, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foldable substrates having a cavity filled with a polymer and metho...
- Patent number 12,207,539
- Issue date Jan 21, 2025
- Corning Incorporated
- Gabriel Pierce Agnello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, circuit board structure and manufacturing met...
- Patent number 12,205,923
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,207,495
- Issue date Jan 21, 2025
- Innolux Corporation
- Yuan-Lin Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,205,906
- Issue date Jan 21, 2025
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mountable electronic component and electronic circuit module
- Patent number 12,201,028
- Issue date Jan 14, 2025
- Murata Manufacturing Co., Ltd.
- Takafumi Kusuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package, package-on-package structure, and manuf...
- Patent number 12,198,996
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonding in microelectronic assemblies
- Patent number 12,199,018
- Issue date Jan 14, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package with improved performance
- Patent number 12,199,045
- Issue date Jan 14, 2025
- Wolfspeed, Inc.
- Guy Moxey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices and methods of manufacture
- Patent number 12,199,046
- Issue date Jan 14, 2025
- Faraday Semi, Inc.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,199,048
- Issue date Jan 14, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for non-overlap enforcement for inverter for el...
- Patent number 12,194,870
- Issue date Jan 14, 2025
- Borg Warner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Interposer structure containing embedded silicon-less link chiplet
- Patent number 12,199,025
- Issue date Jan 14, 2025
- Chengdu ECHINT Technology Co., Ltd.
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable embedded silicon bridge via pillars in lithographically de...
- Patent number 12,199,067
- Issue date Jan 14, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-dimensional integrated circuits having semiconductors mounted...
- Patent number 12,199,196
- Issue date Jan 14, 2025
- GBT Tokenize Corp.
- Danny Rittman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with integral heat spreaders
- Patent number 12,199,004
- Issue date Jan 14, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Charles Bailley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method
- Patent number 12,199,051
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,199,022
- Issue date Jan 14, 2025
- Fuji Electric Co., Ltd.
- Masayoshi Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible interposer
- Patent number 12,199,026
- Issue date Jan 14, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022803
- Publication date Jan 16, 2025
- Siliconware Precision Industries Co., Ltd.
- You-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022806
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hong Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250022818
- Publication date Jan 16, 2025
- MURATA MANUFACTURING CO., LTD.
- Yoshiki NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250022835
- Publication date Jan 16, 2025
- Fuji Electric Co., Ltd.
- Hideo AMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022842
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Ilbok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED INTERCONNECT BRIDGING
- Publication number 20250022847
- Publication date Jan 16, 2025
- ADVANCED MICRO DEVICES, INC.
- LEI FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20250022850
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20250022851
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DEVICE SEMICONDUCTOR CHIP WITH ELECTRICAL ACCESS TO DEVICES A...
- Publication number 20250022872
- Publication date Jan 16, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...
- Publication number 20250022784
- Publication date Jan 16, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PROCESSING ELEMENT AND I/O ELEMENT
- Publication number 20250022848
- Publication date Jan 16, 2025
- Advanced Semiconductor Engineering, Inc.
- Chang Chi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022860
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Chengtar Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...
- Publication number 20250022774
- Publication date Jan 16, 2025
- Altera Corporation
- Loke Yip FOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH STRESS BUFFER PADS AND METHODS...
- Publication number 20250022810
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Hsin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022811
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Myungyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Array And Method Used In Forming A Memory Array
- Publication number 20250024675
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Sidhartha Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...
- Publication number 20250022804
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL-ELECTRICAL CO-PACKAGE STRUCTURE AND COMMUNICATION DEVICE
- Publication number 20250022805
- Publication date Jan 16, 2025
- Huawei Technologies Co., Ltd
- Shun ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH GLASS CORE SUBSTRATE AND METHOD OF FABRI...
- Publication number 20250022859
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250015063
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250015064
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Yoon Young JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR PACKAGE WITH CAPACITOR...
- Publication number 20250015018
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION OF MICROELECTRONIC COMPONENTS WITH DIRECT BONDING INTER...
- Publication number 20250015028
- Publication date Jan 9, 2025
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSING, SEMICONDUCTOR MODULE AND METHODS FOR PRODUCING THE SAME
- Publication number 20250014952
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Georg Troska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250014977
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Yun-Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLINKED GROUND WELLS WITH SPECIALIZED PATTERNS FOR LIQUID METAL...
- Publication number 20250014980
- Publication date Jan 9, 2025
- Intel Corporation
- Eric ERIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA ARRAY IN A REDISTRIBUTION LAYER STRUCTURE FOR STRESS RELIEF
- Publication number 20250015007
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250015062
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20250015004
- Publication date Jan 9, 2025
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-FREE SEMICONDUCTOR DEVICE ASSEMBLIES WITH MULTIPLE SEMICO...
- Publication number 20250015006
- Publication date Jan 9, 2025
- Micron Technology, Inc.
- Hung Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS

the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages and methods of forming the same

Method of processing a semiconductor wafer, semiconductor die, and...

Semiconductor package having package substrate

Semiconductor package

High-density interconnects for integrated circuit packages

Bonding structure and method of forming same

Semiconductor package

Honeycomb pattern for conductive features

Semiconductor device structure and methods of forming the same

Semiconductor package and manufacturing method thereof

Die to die high-speed communication without discrete amplifiers bet...

Foldable substrates having a cavity filled with a polymer and metho...

Semiconductor device, circuit board structure and manufacturing met...

Display device

Electronic package and fabrication method thereof

Multi-die package structures including redistribution layers

Mountable electronic component and electronic circuit module

Integrated fan-out package, package-on-package structure, and manuf...

Direct bonding in microelectronic assemblies

Power semiconductor package with improved performance

Electrical devices and methods of manufacture

Heterogeneous nested interposer package for IC chips

Systems and methods for non-overlap enforcement for inverter for el...

Interposer structure containing embedded silicon-less link chiplet

Scalable embedded silicon bridge via pillars in lithographically de...

Multi-dimensional integrated circuits having semiconductors mounted...

Electronic packages with integral heat spreaders

Integrated circuit structure and method

Semiconductor module

Flexible interposer

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE

HYBRID BONDED INTERCONNECT BRIDGING

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

MULTI-DEVICE SEMICONDUCTOR CHIP WITH ELECTRICAL ACCESS TO DEVICES A...

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...

SEMICONDUCTOR PACKAGE INCLUDING PROCESSING ELEMENT AND I/O ELEMENT

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...

SEMICONDUCTOR PACKAGE SUBSTRATE WITH STRESS BUFFER PADS AND METHODS...

SEMICONDUCTOR PACKAGE

Memory Array And Method Used In Forming A Memory Array

FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...

OPTICAL-ELECTRICAL CO-PACKAGE STRUCTURE AND COMMUNICATION DEVICE

SEMICONDUCTOR PACKAGE WITH GLASS CORE SUBSTRATE AND METHOD OF FABRI...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR PACKAGE WITH CAPACITOR...

SINGULATION OF MICROELECTRONIC COMPONENTS WITH DIRECT BONDING INTER...

HOUSING, SEMICONDUCTOR MODULE AND METHODS FOR PRODUCING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

INTERLINKED GROUND WELLS WITH SPECIALIZED PATTERNS FOR LIQUID METAL...

VIA ARRAY IN A REDISTRIBUTION LAYER STRUCTURE FOR STRESS RELIEF

SEMICONDUCTOR PACKAGE

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

SUBSTRATE-FREE SEMICONDUCTOR DEVICE ASSEMBLIES WITH MULTIPLE SEMICO...