the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates

Industry

CPC
H01L23/538

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
Deep trench capacitors in an inter-layer medium on an interconnect...
- Patent number 11,973,019
- Issue date Apr 30, 2024
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure
- Patent number 11,973,023
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip and die test without cell array
- Patent number 11,972,825
- Issue date Apr 30, 2024
- SK hynix Inc.
- Ji-Hwan Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,973,007
- Issue date Apr 30, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,973,036
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,973,037
- Issue date Apr 30, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,973,042
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Jingu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with low parasitic connection to passive device
- Patent number 11,973,063
- Issue date Apr 30, 2024
- Infineon Technologies AG
- Urban Medic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,973,071
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Gerhard Noebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Visual digital decoration apparatus and control method therefor
- Patent number 11,972,166
- Issue date Apr 30, 2024
- Seongkyu Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,973,039
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Chia-Hao Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplet first architecture for die tiling applications
- Patent number 11,973,041
- Issue date Apr 30, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die assembly
- Patent number 11,973,058
- Issue date Apr 30, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended through wafer vias for power delivery in face-to-face dies
- Patent number 11,973,060
- Issue date Apr 30, 2024
- NVIDIA Corporation
- Joseph Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package including stacked chips and chip couplers
- Patent number 11,973,061
- Issue date Apr 30, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with improved antenna patterns performance
- Patent number 11,973,038
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unit with wiring board, module, and equipment
- Patent number 11,972,990
- Issue date Apr 30, 2024
- Canon Kabushiki Kaisha
- Satoshi Nozu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silica-containing substrates with vias having an axially variable s...
- Patent number 11,972,993
- Issue date Apr 30, 2024
- Corning Incorporated
- Rachel Eileen Dahlberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,967,543
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,967,549
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Jung Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stacking structure and manufacturing method thereof
- Patent number 11,967,558
- Issue date Apr 23, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Shou-Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info packages including thermal dissipation blocks
- Patent number 11,967,591
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Giga interposer integration through Chip-On-Wafer-On-Substrate
- Patent number 11,967,546
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and electronic systems including the same
- Patent number 11,967,623
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Sunggil Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 11,967,559
- Issue date Apr 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabric-based items with electrical component arrays
- Patent number 11,967,561
- Issue date Apr 23, 2024
- Apple Inc.
- Daniel D. Sunshine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 11,967,563
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure with cavity substrate
- Patent number 11,967,579
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit
- Patent number 11,967,560
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device and method for fabricating a packaged...
- Patent number 11,967,562
- Issue date Apr 23, 2024
- Infineon Technologies AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Active Microelectronic Assembly Containing A Decoupling Capacitor
- Publication number 20240145449
- Publication date May 2, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE
- Publication number 20240145457
- Publication date May 2, 2024
- Micron Technology, Inc.
- Faxing CHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240145322
- Publication date May 2, 2024
- Medtronic, Inc.
- Chunho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240145329
- Publication date May 2, 2024
- Samsung Electronics Co. Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA
- Publication number 20240145346
- Publication date May 2, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Joo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE DIELECTRIC STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES AN...
- Publication number 20240145436
- Publication date May 2, 2024
- Micron Technology, Inc.
- Hung Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240145396
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Sehoon JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240145397
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Jeongho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF AMPLIFIERS WITH IMPROVED STABILITY BY SOURCE INDUCTANCE ADJUSTMENT
- Publication number 20240145414
- Publication date May 2, 2024
- Wolfspeed, Inc.
- Gerard Bouisse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI PROGRAMABLE-DIE MODULE
- Publication number 20240145434
- Publication date May 2, 2024
- Intel Corporation
- Mahesh Kumashikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cross-Wafer RDLs in Constructed Wafers
- Publication number 20240145257
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...
- Publication number 20240145393
- Publication date May 2, 2024
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ARCHITECTURE WITH SILICON INTERPOSER AND EMIB
- Publication number 20240145395
- Publication date May 2, 2024
- Intel Corporation
- MD Altaf HOSSAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-On-Wafer Assembly Containing A Decoupling Capacitor
- Publication number 20240145451
- Publication date May 2, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER POWER CORRIDOR
- Publication number 20240145394
- Publication date May 2, 2024
- Intel Corporation
- Poh Boon KHOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240136294
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Ikuya TERAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...
- Publication number 20240136297
- Publication date Apr 25, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240136293
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
- Publication number 20240136299
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240136347
- Publication date Apr 25, 2024
- ROHM CO., LTD.
- Isamu NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME
- Publication number 20240136203
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240136246
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT SHARING MISMATCH REDUCTION IN POWER SEMICONDUCTOR DEVICE MO...
- Publication number 20240136259
- Publication date Apr 25, 2024
- Semiconductor Components Industries, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND SEMICONDUCTO...
- Publication number 20240136265
- Publication date Apr 25, 2024
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20240136292
- Publication date Apr 25, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...
- Publication number 20240136295
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240136296
- Publication date Apr 25, 2024
- Hyundai Motor Company
- Sung Taek HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240136341
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Seokgeun AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE ELECTRONIC COMPONENT
- Publication number 20240136342
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yukihiro FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240136275
- Publication date Apr 25, 2024
- MEDIATEK INC.
- Shi-Bai Chen
- H01 - BASIC ELECTRIC ELEMENTS

the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Deep trench capacitors in an inter-layer medium on an interconnect...

Stacked via structure

Integrated circuit chip and die test without cell array

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor package structure and method of manufacturing the same

Package structure and manufacturing method thereof

Semiconductor package

Semiconductor package with low parasitic connection to passive device

Semiconductor module

Visual digital decoration apparatus and control method therefor

Semiconductor device package and method of manufacturing the same

Chiplet first architecture for die tiling applications

Multiple die assembly

Extended through wafer vias for power delivery in face-to-face dies

Chip package including stacked chips and chip couplers

Package structure with improved antenna patterns performance

Unit with wiring board, module, and equipment

Silica-containing substrates with vias having an axially variable s...

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor package

Wafer stacking structure and manufacturing method thereof

Info packages including thermal dissipation blocks

Giga interposer integration through Chip-On-Wafer-On-Substrate

Semiconductor devices and electronic systems including the same

Electronic package

Fabric-based items with electrical component arrays

Fan-out package having a main die and a dummy die

Method for forming package structure with cavity substrate

Integrated circuit

Packaged semiconductor device and method for fabricating a packaged...

Patents Applicationslast 30 patents

Active Microelectronic Assembly Containing A Decoupling Capacitor

FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA

COMPOSITE DIELECTRIC STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES AN...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

RF AMPLIFIERS WITH IMPROVED STABILITY BY SOURCE INDUCTANCE ADJUSTMENT

MULTI PROGRAMABLE-DIE MODULE

Cross-Wafer RDLs in Constructed Wafers

ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...

INTERCONNECT ARCHITECTURE WITH SILICON INTERPOSER AND EMIB

Chip-On-Wafer Assembly Containing A Decoupling Capacitor

INTERPOSER POWER CORRIDOR

WIRING SUBSTRATE

MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE

PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CURRENT SHARING MISMATCH REDUCTION IN POWER SEMICONDUCTOR DEVICE MO...

INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND SEMICONDUCTO...

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...

POWER MODULE

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

COMPOSITE ELECTRONIC COMPONENT

SEMICONDUCTOR PACKAGE STRUCTURE