the item being a discrete passive component

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H01L2224/24265

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/24265the item being a discrete passive component

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,170,251
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including IPD and method of forming the same
- Patent number 12,159,853
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip integrated fan-out package
- Patent number 12,148,728
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with near-die integrated passive device
- Patent number 12,136,613
- Issue date Nov 5, 2024
- Xilinx, Inc.
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,094,860
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit device
- Patent number 12,074,130
- Issue date Aug 27, 2024
- RISING TECHNOLOGIES CO., LTD.
- Shuzo Akejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,051,655
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure
- Patent number 12,046,588
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,996,381
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip having BS-PDN structure
- Patent number 11,984,421
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,948,891
- Issue date Apr 2, 2024
- NEPES CO., LTD.
- Sang Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die and package structure
- Patent number 11,948,904
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,435
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,942,451
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,824,033
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Gyoyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method of manufacturing the same
- Patent number 11,798,859
- Issue date Oct 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Chia-Pin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packaging structure and method
- Patent number 11,749,657
- Issue date Sep 5, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with antenna element
- Patent number 11,705,411
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device packages with passive device assemblies
- Patent number 11,688,709
- Issue date Jun 27, 2023
- Analog Devices, Inc.
- Vikram Venkatadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,664,323
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including IPD and method of forming the same
- Patent number 11,587,900
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,587,916
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer semiconductor package with stacked passive components
- Patent number 11,587,899
- Issue date Feb 21, 2023
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-feed packaged antenna based on fan-out package
- Patent number 11,569,191
- Issue date Jan 31, 2023
- 38TH RESEARCH INSTITUET, CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
- Chuanming Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,562,935
- Issue date Jan 24, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,557,561
- Issue date Jan 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,552,038
- Issue date Jan 10, 2023
- Samsung Electronics Co., Ltd.
- Gyoyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,309,295
- Issue date Apr 19, 2022
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,282,804
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure
- Patent number 11,257,797
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE SHIELDING STRUCTURE
- Publication number 20240413094
- Publication date Dec 12, 2024
- CYPRESS SEMICONDUCTOR CORPORATION
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20240371842
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE
- Publication number 20240355795
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332215
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240274567
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258287
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240203936
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE AND PACKAGE STRUCTURE
- Publication number 20240203924
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240194611
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integration of Discrete Embeddable Capacitors on Integrated Circuit...
- Publication number 20240145447
- Publication date May 2, 2024
- pSemi Corporation
- Shishir Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH NEAR-DIE INTEGRATED PASSIVE DEVICE
- Publication number 20230253380
- Publication date Aug 10, 2023
- Xilinx, Inc.
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS
- Publication number 20230207509
- Publication date Jun 29, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20230133567
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Gyoyoung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20230111006
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230089615
- Publication date Mar 23, 2023
- Kabushiki Kaisha Toshiba
- Kenichi AGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230068263
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CREATING A DOCUMENT STRUCTURE, AND DOCUMENT STRUCTURE
- Publication number 20230021853
- Publication date Jan 26, 2023
- INFINEON TECHNOLOGIES AG
- Frank Pueschner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230014450
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20230011666
- Publication date Jan 12, 2023
- MEDIATEK SINGAPORE PTE LTD
- Chang LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220367306
- Publication date Nov 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Chia-Pin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220285331
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME
- Publication number 20220278067
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FEED PACKAGED ANTENNA BASED ON FAN-OUT PACKAGE
- Publication number 20220246571
- Publication date Aug 4, 2022
- 38TH RESEARCH INSTITUET, CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
- Chuanming ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE AND PACKAGE STRUCTURE
- Publication number 20220208711
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE
- Publication number 20220173083
- Publication date Jun 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP HAVING BS-PDN STRUCTURE
- Publication number 20220139863
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20220130786
- Publication date Apr 28, 2022
- Samsung Electronics Co., Ltd.
- Gyoyoung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220102282
- Publication date Mar 31, 2022
- Samsung Electronics Co., Ltd.
- KYOUNG LIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING STRUCTURE AND METHOD
- Publication number 20220084996
- Publication date Mar 17, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT DEVICE
- Publication number 20220084974
- Publication date Mar 17, 2022
- RISING TECHNOLOGIES CO., LTD.
- Shuzo AKEJIMA
- H01 - BASIC ELECTRIC ELEMENTS

the item being a discrete passive component

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Package structure including IPD and method of forming the same

Multi-chip integrated fan-out package

Chip package with near-die integrated passive device

Package structure and manufacturing method thereof

Electronic circuit device

Package structure and method of forming the same

Package on package structure

Package structure and method of fabricating the same

Integrated circuit chip having BS-PDN structure

Semiconductor package and manufacturing method thereof

Die and package structure

Semiconductor package and method

Semiconductor structure and method of forming the same

Semiconductor package and method of manufacturing the semiconductor...

Electronic device package and method of manufacturing the same

Fan-out packaging structure and method

Chip package with antenna element

Integrated device packages with passive device assemblies

Semiconductor package and method

Package structure including IPD and method of forming the same

Package structure and manufacturing method thereof

Multi-layer semiconductor package with stacked passive components

Multi-feed packaged antenna based on fan-out package

Semiconductor structure

Package structure and method of fabricating the same

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor device package

Package structure and method of manufacturing the same

Package on package structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE SHIELDING STRUCTURE

MANUFACTURING METHOD OF PACKAGE STRUCTURE

PACKAGE ON PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE

DIE AND PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD

Integration of Discrete Embeddable Capacitors on Integrated Circuit...

CHIP PACKAGE WITH NEAR-DIE INTEGRATED PASSIVE DEVICE

MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

METHOD FOR CREATING A DOCUMENT STRUCTURE, AND DOCUMENT STRUCTURE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME

MULTI-FEED PACKAGED ANTENNA BASED ON FAN-OUT PACKAGE

DIE AND PACKAGE STRUCTURE

PACKAGE ON PACKAGE STRUCTURE

INTEGRATED CIRCUIT CHIP HAVING BS-PDN STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

FAN-OUT PACKAGING STRUCTURE AND METHOD

ELECTRONIC CIRCUIT DEVICE