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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/24155the item being non-metallic

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of processing a semiconductor wafer, semiconductor die, and...
- Patent number 12,205,919
- Issue date Jan 21, 2025
- Infineon Technologies AG
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly comprising a 3D block and method of making t...
- Patent number 12,205,881
- Issue date Jan 21, 2025
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple pixel package structure with buried chip and electronic de...
- Patent number 12,183,724
- Issue date Dec 31, 2024
- Lite-On Opto Technology (Changzhou) Co., Ltd.
- Chen-Hsiu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,176,337
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing die encapsulated by an encapsulant with a roughness surface...
- Patent number 12,087,654
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,051,655
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier comprising at least two components
- Patent number 12,041,721
- Issue date Jul 16, 2024
- AT&S(Chongqing) Company Limited
- Dominik Wilding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, endoscope, and method for manufacturing semic...
- Patent number 12,033,975
- Issue date Jul 9, 2024
- Olympus Corporation
- Keiichi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,996,381
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,894,336
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,862,587
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Mark Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondutor package substrate with die cavity and redistribution l...
- Patent number 11,854,922
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,824,033
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Gyoyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing component encapsulated by an encapsulant with a roughness s...
- Patent number 11,764,124
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,710,715
- Issue date Jul 25, 2023
- Samsung Electronics Co., Ltd.
- Joo Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vias in composite IC chip structures
- Patent number 11,694,986
- Issue date Jul 4, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including thick pad
- Patent number 11,652,076
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Taeho Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth die to die interconnect with package area reduction
- Patent number 11,587,909
- Issue date Feb 21, 2023
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,557,561
- Issue date Jan 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,552,038
- Issue date Jan 10, 2023
- Samsung Electronics Co., Ltd.
- Gyoyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of making the same
- Patent number 11,552,014
- Issue date Jan 10, 2023
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded packaging module and manufacturing method for the same
- Patent number 11,552,039
- Issue date Jan 10, 2023
- Delta Electronics (Shanghai) Co., Ltd.
- Zengsheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, redistribution structure and method for form...
- Patent number 11,545,457
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiang-Hao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 11,430,776
- Issue date Aug 30, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including glass substrate having improved reli...
- Patent number 11,355,465
- Issue date Jun 7, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Shun Mitarai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including thick pad
- Patent number 11,355,467
- Issue date Jun 7, 2022
- Samsung Electronics Co., Ltd.
- Taeho Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing component encapsulated by an encapsulation layer with a rou...
- Patent number 11,289,396
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packaging method, image sensor packaging structure, an...
- Patent number 11,282,879
- Issue date Mar 22, 2022
- Inno-Pach Technology Pte Ltd.
- Liping Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vias in composite IC chip structures
- Patent number 11,205,630
- Issue date Dec 21, 2021
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming double-sided fan-out waf...
- Patent number 11,127,668
- Issue date Sep 21, 2021
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Inverted EWLB Package wi...
- Publication number 20250006608
- Publication date Jan 2, 2025
- STATS ChipPAC Pte Ltd.
- Linda Pei Ee Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SENSING DIE ENCAPSULATED BY ENCAPSULANT WIT...
- Publication number 20240355698
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332215
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MAGNET FRAME, INTEGRATED STRUCTURE AND MANUFACTURING METHOD
- Publication number 20240321594
- Publication date Sep 26, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240274567
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING T...
- Publication number 20240213135
- Publication date Jun 27, 2024
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF EMBEDDING A BARE DIE IN A CARRIER LAMINATE
- Publication number 20240203935
- Publication date Jun 20, 2024
- INFINEON TECHNOLOGIES AG
- Toni SALMINEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240186283
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRU...
- Publication number 20240178086
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP HIGH-DENSITY INTERCONNECTION PACKAGE STRUCTURE AND MANUFACTURI...
- Publication number 20240096836
- Publication date Mar 21, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...
- Publication number 20240072032
- Publication date Feb 29, 2024
- QUALCOMM Incorporated
- Yanmei SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR SEMICONDUCTOR DEVICES AND ELECTRONIC DEVICES INCORPORATING...
- Publication number 20230411263
- Publication date Dec 21, 2023
- STATS ChipPAC Pte Ltd.
- SooHan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230386949
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Jiyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING DIE ENCAPSULATED BY AN ENCAPSULANT WITH A ROUGHNESS SURFACE...
- Publication number 20230369158
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR
- Publication number 20230178508
- Publication date Jun 8, 2023
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION
- Publication number 20230154897
- Publication date May 18, 2023
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20230133567
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Gyoyoung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20230111006
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE WITH CAVITY STRUCTURE FOR HETEROGENEOUS PACKAGING ARCHIT...
- Publication number 20230085411
- Publication date Mar 16, 2023
- Intel Corporation
- Sameer Paital
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230014450
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUTOR PACKAGE SUBSTRATE WITH DIE CAVITY AND REDISTRIBUTION L...
- Publication number 20220406673
- Publication date Dec 22, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacturing
- Publication number 20220359489
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Comprising at Least Two Components
- Publication number 20220287181
- Publication date Sep 8, 2022
- AT&S (Chongqing) Company Limited
- Dominik WILDING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING THICK PAD
- Publication number 20220262757
- Publication date Aug 18, 2022
- Samsung Electronics Co., LTD
- Taeho KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND CIRCUIT MODULE USING TH...
- Publication number 20220238474
- Publication date Jul 28, 2022
- TDK Corporation
- Toshiyuki ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220223490
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20220130786
- Publication date Apr 28, 2022
- Samsung Electronics Co., Ltd.
- Gyoyoung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, REDISTRIBUTION STRUCTURE AND METHOD FOR FORM...
- Publication number 20220068869
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiang-Hao Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
VIAS IN COMPOSITE IC CHIP STRUCTURES
- Publication number 20220037281
- Publication date Feb 3, 2022
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210398942
- Publication date Dec 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS

the item being non-metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of processing a semiconductor wafer, semiconductor die, and...

Semiconductor assembly comprising a 3D block and method of making t...

Multiple pixel package structure with buried chip and electronic de...

Semiconductor devices and methods of manufacturing

Sensing die encapsulated by an encapsulant with a roughness surface...

Package structure and method of forming the same

Component carrier comprising at least two components

Semiconductor device, endoscope, and method for manufacturing semic...

Package structure and method of fabricating the same

Integrated fan-out package and manufacturing method thereof

Semiconductor package structure and method of manufacturing the same

Semicondutor package substrate with die cavity and redistribution l...

Semiconductor package and method of manufacturing the semiconductor...

Sensing component encapsulated by an encapsulant with a roughness s...

Semiconductor package

Vias in composite IC chip structures

Semiconductor devices including thick pad

High bandwidth die to die interconnect with package area reduction

Package structure and method of fabricating the same

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor package structure and method of making the same

Embedded packaging module and manufacturing method for the same

Semiconductor package, redistribution structure and method for form...

Semiconductor devices and methods of manufacturing

Semiconductor device including glass substrate having improved reli...

Semiconductor devices including thick pad

Sensing component encapsulated by an encapsulation layer with a rou...

Image sensor packaging method, image sensor packaging structure, an...

Vias in composite IC chip structures

Semiconductor device and method of forming double-sided fan-out waf...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Inverted EWLB Package wi...

MANUFACTURING METHOD OF SENSING DIE ENCAPSULATED BY ENCAPSULANT WIT...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

EMBEDDED MAGNET FRAME, INTEGRATED STRUCTURE AND MANUFACTURING METHOD

PACKAGE STRUCTURE

SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING T...

METHOD OF EMBEDDING A BARE DIE IN A CARRIER LAMINATE

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRU...

CHIP HIGH-DENSITY INTERCONNECTION PACKAGE STRUCTURE AND MANUFACTURI...

PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...

MODULAR SEMICONDUCTOR DEVICES AND ELECTRONIC DEVICES INCORPORATING...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SENSING DIE ENCAPSULATED BY AN ENCAPSULANT WITH A ROUGHNESS SURFACE...

SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR

HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

GLASS CORE WITH CAVITY STRUCTURE FOR HETEROGENEOUS PACKAGING ARCHIT...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUTOR PACKAGE SUBSTRATE WITH DIE CAVITY AND REDISTRIBUTION L...

Semiconductor Devices and Methods of Manufacturing

Component Carrier Comprising at Least Two Components

SEMICONDUCTOR DEVICES INCLUDING THICK PAD

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND CIRCUIT MODULE USING TH...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE, REDISTRIBUTION STRUCTURE AND METHOD FOR FORM...

VIAS IN COMPOSITE IC CHIP STRUCTURES

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF