the item being non-metallic

Industry

CPC
H01L2224/08155

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/08155the item being non-metallic

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Light emitting diode and display apparatus having the same
- Patent number 12,159,861
- Issue date Dec 3, 2024
- SEOUL VIOSYS CO., LTD.
- Seong Kyu Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure with interconnect structure
- Patent number 11,728,273
- Issue date Aug 15, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor package in a wiring board...
- Patent number 10,679,920
- Issue date Jun 9, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideki Niimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for temporary fixing, film sheet for temporary fixing and semi...
- Patent number 10,550,295
- Issue date Feb 4, 2020
- Hitachi Chemical Company, Ltd.
- Takahiro Tokuyasu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electronic component embedded substrate
- Patent number 10,278,290
- Issue date Apr 30, 2019
- TDK Corporation
- Kenichi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421122
- Publication date Dec 19, 2024
- KIOXIA Corporation
- Masayuki MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240404921
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Die Substrate with Edge-Mounted Capacitors
- Publication number 20240332223
- Publication date Oct 3, 2024
- NVIDIA Corporation
- Tracy Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE DEVICE, FABRICATION METHOD THEREOF AND MEMORY SY...
- Publication number 20240332152
- Publication date Oct 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xinru Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240319454
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL CHIP WITH VARIABLE PACKAGING
- Publication number 20240312892
- Publication date Sep 19, 2024
- Meta Platforms Technologies, LLC
- Rajendra D. PENDSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A TEST BUMP
- Publication number 20240304504
- Publication date Sep 12, 2024
- Samsung Electronics Co., Ltd.
- Boin NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240304525
- Publication date Sep 12, 2024
- Fuji Electric Co., Ltd.
- Tatsuya KARASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240266271
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Eun Ho CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING CAPACITORS
- Publication number 20240213143
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE INTEGRATION WITH HYBRID BONDED BRIDGE DIE
- Publication number 20240203968
- Publication date Jun 20, 2024
- Xilinx, Inc.
- Jaspreet Singh GANDHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME
- Publication number 20240203855
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Jaemok JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240194641
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Chi Woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE WITH INTERCONNECT STRUCTURE
- Publication number 20240170406
- Publication date May 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240112988
- Publication date Apr 4, 2024
- ROHM CO., LTD.
- Kaori UEBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105578
- Publication date Mar 28, 2024
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE FOR MILLIMETRE WAVE AND THZ SIGNALS
- Publication number 20230387045
- Publication date Nov 30, 2023
- Teknologian Tutkimuskeskus VTT Oy
- Pekka Pursula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME, AND TILED DISPLAY...
- Publication number 20230282650
- Publication date Sep 7, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dae Hwan JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ELEMENT ARRAY, OPTICAL PRINTER HEAD INCLUDING LIGHT-...
- Publication number 20230113637
- Publication date Apr 13, 2023
- KYOCERA CORPORATION
- Takanori WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE WITH INTERCONNECT STRUCTURE
- Publication number 20220077063
- Publication date Mar 10, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190229029
- Publication date Jul 25, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- HIDEKI NIIMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
- Publication number 20180027660
- Publication date Jan 25, 2018
- TDK Corporation
- Kenichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR CHIP PACKAGE
- Publication number 20120315726
- Publication date Dec 13, 2012
- HAK-KYOON BYUN
- H01 - BASIC ELECTRIC ELEMENTS

the item being non-metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light emitting diode and display apparatus having the same

Bonded structure with interconnect structure

Semiconductor device having semiconductor package in a wiring board...

Film for temporary fixing, film sheet for temporary fixing and semi...

Electronic component embedded substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Chip Die Substrate with Edge-Mounted Capacitors

INTEGRATED PACKAGE DEVICE, FABRICATION METHOD THEREOF AND MEMORY SY...

SEMICONDUCTOR PACKAGE

UNIVERSAL CHIP WITH VARIABLE PACKAGING

SEMICONDUCTOR PACKAGE INCLUDING A TEST BUMP

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES HAVING CAPACITORS

CHIP PACKAGE INTEGRATION WITH HYBRID BONDED BRIDGE DIE

SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

BONDED STRUCTURE WITH INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

WAFER-LEVEL PACKAGE FOR MILLIMETRE WAVE AND THZ SIGNALS

DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME, AND TILED DISPLAY...

LIGHT-EMITTING ELEMENT ARRAY, OPTICAL PRINTER HEAD INCLUDING LIGHT-...

BONDED STRUCTURE WITH INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE

METHOD OF MANUFACTURING A SEMICONDUCTOR CHIP PACKAGE