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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48155the item being non-metallic

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for processing memory device
- Patent number 12,174,737
- Issue date Dec 24, 2024
- ESSENCORE LIMITED
- Chan Ho Sohn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat sink, semiconductor package and semiconductor module
- Patent number 12,130,096
- Issue date Oct 29, 2024
- JFE PRECISION CORPORATION
- Hoshiaki Terao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 12,100,631
- Issue date Sep 24, 2024
- Fuji Electric Co., Ltd.
- Taichi Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 11,984,437
- Issue date May 14, 2024
- Nichia Corporation
- Takeshi Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power laminate RF package
- Patent number 11,791,251
- Issue date Oct 17, 2023
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, power semiconductor module, and power electro...
- Patent number 11,749,578
- Issue date Sep 5, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,626,358
- Issue date Apr 11, 2023
- Fuji Electric Co., Ltd.
- Rikihiro Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and power conversion apparatus
- Patent number 11,476,170
- Issue date Oct 18, 2022
- Mitsubishi Electric Corporation
- Yusuke Kaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded copper structure for microelectronics package
- Patent number 11,270,974
- Issue date Mar 8, 2022
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics module
- Patent number 11,183,489
- Issue date Nov 23, 2021
- Audi AG
- Andreas Apelsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,031,355
- Issue date Jun 8, 2021
- Mitsubishi Electric Corporation
- Yusuke Kaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera device and mobile terminal having same
- Patent number 10,965,851
- Issue date Mar 30, 2021
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Shin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Load sensing devices, packages, and systems
- Patent number 10,910,500
- Issue date Feb 2, 2021
- STMicroelectronics S.r.l.
- Mohammad Abbasi Gavarti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal assembly structure of MEMS microphone
- Patent number 10,827,282
- Issue date Nov 3, 2020
- AAC Acoustic Technologies (Shenzhen) Co., Ltd.
- Kai Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 10,763,183
- Issue date Sep 1, 2020
- Mitsubishi Electric Corporation
- Naohiro Ogushi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave module
- Patent number 10,707,910
- Issue date Jul 7, 2020
- Mitsubishi Electric Corporation
- Yukinobu Tarui
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Mold release film, process for its production, and process for prod...
- Patent number 10,699,916
- Issue date Jun 30, 2020
- AGC Inc.
- Wataru Kasai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 10,573,604
- Issue date Feb 25, 2020
- Renesas Electronics Corporation
- Kuniharu Muto
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Fingerprint sensing chip packaging method and fingerprint sensing c...
- Patent number 10,497,728
- Issue date Dec 3, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power semiconductor device
- Patent number 10,461,045
- Issue date Oct 29, 2019
- Mitsubishi Electric Corporation
- Yasumichi Hatanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor packages having a substrate with two or more me...
- Patent number 10,410,952
- Issue date Sep 10, 2019
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,128,200
- Issue date Nov 13, 2018
- Renesas Electronics Corporation
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,972,588
- Issue date May 15, 2018
- Mitsubishi Electric Corporation
- Katsuya Kato
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor packaging structure and package having stress release...
- Patent number 9,859,185
- Issue date Jan 2, 2018
- Kyocera International, Inc.
- Satoru Tomie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 9,443,760
- Issue date Sep 13, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 8,916,968
- Issue date Dec 23, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with stack interconnect and met...
- Patent number 8,466,567
- Issue date Jun 18, 2013
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118621
- Publication date Apr 10, 2025
- DENSO CORPORATION
- MOTOMI MUROZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118623
- Publication date Apr 10, 2025
- DENSO CORPORATION
- Ryo KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR
- Publication number 20250105125
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Daisuke Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096049
- Publication date Mar 20, 2025
- Mitsubishi Electric Corporation
- Tatsuya UDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079413
- Publication date Mar 6, 2025
- Fuji Electric Co., Ltd.
- Akira HIRAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250029909
- Publication date Jan 23, 2025
- Mitsubishi Electric Corporation
- Takuma NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429152
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Takashi KATSUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240421018
- Publication date Dec 19, 2024
- Fuji Electric Co., Ltd.
- Kazuma KAWAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395681
- Publication date Nov 28, 2024
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240395690
- Publication date Nov 28, 2024
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH BALANCED CURRENT FLOW
- Publication number 20240379526
- Publication date Nov 14, 2024
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE ARRANGEMENTS
- Publication number 20240363497
- Publication date Oct 31, 2024
- INFINEON TECHNOLOGIES AG
- Andressa COLVERO SCHITTLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240355774
- Publication date Oct 24, 2024
- Mitsubishi Electric Corporation
- Nozomi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240321692
- Publication date Sep 26, 2024
- AMOSENSE CO., LTD.
- Jinhyuck BIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20240297100
- Publication date Sep 5, 2024
- Fuji Electric Co., Ltd.
- Ryusuke KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC MODULE AND METHOD FOR MANUFACTURING IC MODULE
- Publication number 20240290747
- Publication date Aug 29, 2024
- TOPPAN Holdings Inc.
- Shinji KANEKO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282749
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282650
- Publication date Aug 22, 2024
- Mitsubishi Electric Corporation
- Yuji IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240266274
- Publication date Aug 8, 2024
- Sumitomo Electric Industries, Ltd.
- Noriyoshi SUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING RIBBON...
- Publication number 20240250058
- Publication date Jul 25, 2024
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20240250081
- Publication date Jul 25, 2024
- Nichia Corporation.
- Takeshi IMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE STRUCTURE
- Publication number 20240243097
- Publication date Jul 18, 2024
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-SIDED COOLING POWER MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240222214
- Publication date Jul 4, 2024
- HYUNDAI MOBIS CO., LTD.
- Yoon Ju KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER APPARATUS
- Publication number 20240203852
- Publication date Jun 20, 2024
- SENTEC E&E CO., LTD.
- Jason HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND POWER DEVICE
- Publication number 20240145426
- Publication date May 2, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Fenglong LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145350
- Publication date May 2, 2024
- MEDIATEK INC.
- Pu-Shan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PACKAGE WITH IMPROVED THERMAL MANAGEMENT
- Publication number 20240055319
- Publication date Feb 15, 2024
- Qorvo US, Inc.
- Matthew Irvine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240047419
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-out Wafer Level Package having Small Interposers
- Publication number 20240014140
- Publication date Jan 11, 2024
- Wei Hu Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230402336
- Publication date Dec 14, 2023
- Fuji Electric Co., Ltd.
- Hiroyuki NOGAWA
- H01 - BASIC ELECTRIC ELEMENTS

the item being non-metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for processing memory device

Heat sink, semiconductor package and semiconductor module

Semiconductor device

Light-emitting device

High power laminate RF package

Semiconductor module, power semiconductor module, and power electro...

Semiconductor device

Power semiconductor module and power conversion apparatus

Embedded copper structure for microelectronics package

Power electronics module

Semiconductor device

Camera device and mobile terminal having same

Load sensing devices, packages, and systems

Terminal assembly structure of MEMS microphone

Semiconductor device

Microwave module

Mold release film, process for its production, and process for prod...

Semiconductor device

Fingerprint sensing chip packaging method and fingerprint sensing c...

Power semiconductor device

Power semiconductor packages having a substrate with two or more me...

Semiconductor device

Semiconductor device

Semiconductor packaging structure and package having stress release...

Multichip power semiconductor device

Multichip power semiconductor device

Integrated circuit packaging system with stack interconnect and met...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ISOLATOR

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

POWER MODULE WITH BALANCED CURRENT FLOW

SEMICONDUCTOR MODULE ARRANGEMENTS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

POWER MODULE

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

IC MODULE AND METHOD FOR MANUFACTURING IC MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING RIBBON...

LIGHT-EMITTING DEVICE

POWER MODULE PACKAGE STRUCTURE

SINGLE-SIDED COOLING POWER MODULE AND METHOD OF MANUFACTURING THE SAME

POWER APPARATUS

BONDING STRUCTURE AND POWER DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CIRCUIT PACKAGE WITH IMPROVED THERMAL MANAGEMENT

SEMICONDUCTOR PACKAGE

Fan-out Wafer Level Package having Small Interposers

SEMICONDUCTOR MODULE