the kinked part being in proximity to the bonding area outside the semiconductor or solid-state body

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H01L2224/48097

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48097the kinked part being in proximity to the bonding area outside the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 10,944,046
- Issue date Mar 9, 2021
- Rohm Co., Ltd.
- Yuya Hasegawa
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor chips and semiconductor packages including the same
- Patent number 10,622,312
- Issue date Apr 14, 2020
- Samsung Electronics Co., Ltd.
- Myoung-soo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated chip scale packages
- Patent number 10,553,511
- Issue date Feb 4, 2020
- Cubic Corporation
- J. Robert Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board, method, and semiconductor package
- Patent number 10,553,452
- Issue date Feb 4, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Suk-Chang Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,535,812
- Issue date Jan 14, 2020
- Rohm Co., Ltd.
- Yuya Hasegawa
- G01 - MEASURING TESTING
Information Patent Grant
Integrated chip scale packages
- Patent number 10,319,654
- Issue date Jun 11, 2019
- Cubic Corporation
- J. Robert Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation-emitting semiconductor device
- Patent number 10,312,416
- Issue date Jun 4, 2019
- Osram Opto Semiconductors GmbH
- Michael Wittmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making semiconductor device with lead frame made from to...
- Patent number 9,947,636
- Issue date Apr 17, 2018
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Articles including bonded metal structures and methods of preparing...
- Patent number 9,570,430
- Issue date Feb 14, 2017
- GLOBALFOUNDRIES, INC.
- Frank Kuechenmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfluidic delivery member with filter and method of forming same
- Patent number 9,561,657
- Issue date Feb 7, 2017
- STMicroelectronics S.r.l.
- Simon Dodd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation-emitting semiconductor device
- Patent number 9,337,397
- Issue date May 10, 2016
- Osram Opto Semiconductors GmbH
- Michael Wittmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterproof surface mount device package and method
- Patent number 9,240,395
- Issue date Jan 19, 2016
- Cree Huizhou Opto Limited
- Alex Chi Keung Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing conductive material, conductive material obtai...
- Patent number 9,011,728
- Issue date Apr 21, 2015
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with bonding wire and method for making the same
- Patent number 8,847,410
- Issue date Sep 30, 2014
- Rohm Co., Ltd.
- Kosuke Miyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system and method for use in mounting electronic elements
- Patent number 8,367,945
- Issue date Feb 5, 2013
- Cree Huizhou Opto Limited
- Siu Cheong Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor device encapsulated with silicone resin
- Patent number 8,164,202
- Issue date Apr 24, 2012
- Shin-Etsu Chemical Co., Ltd.
- Tsutomu Kashiwagi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor light emitting device
- Patent number 7,812,364
- Issue date Oct 12, 2010
- Sharp Kabushiki Kaisha
- Masahiro Seko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 7,709,854
- Issue date May 4, 2010
- Nichia Corporation
- Yoshitaka Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded package and semiconductor device using molded package
- Patent number 7,462,870
- Issue date Dec 9, 2008
- Nichia Corporation
- Shintaro Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,432,589
- Issue date Oct 7, 2008
- Nichia Corporation
- Saiki Yamamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molded package and semiconductor device using molded package
- Patent number 7,045,905
- Issue date May 16, 2006
- Nichia Corporation
- Shintaro Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED lamp
- Patent number 6,841,931
- Issue date Jan 11, 2005
- Toyoda Gosei Co., Ltd.
- Yuji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RIBBON SHIELD DEVICE AND METHOD
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- Publication date Oct 5, 2023
- Intel Corporation
- Prabhat Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230170324
- Publication date Jun 1, 2023
- Hamamatsu Photonics K.K.
- Ryousuke KOUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200091416
- Publication date Mar 19, 2020
- ROHM CO., LTD.
- Yuya Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP SCALE PACKAGES
- Publication number 20190287869
- Publication date Sep 19, 2019
- Cubic Corporation
- J. Robert Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP SCALE PACKAGES
- Publication number 20190172764
- Publication date Jun 6, 2019
- Nuvotronics, INC
- J. Robert Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190074431
- Publication date Mar 7, 2019
- ROHM CO., LTD.
- Yuya Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE BOND BETWEEN AT LEAST TWO ELECTRICAL COMPON...
- Publication number 20180166413
- Publication date Jun 14, 2018
- Fraunhofer-Gesellschaft zur foerderung der Angewandten Forschung e.V.
- Christoph Bayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION-EMITTING SEMICONDUCTOR DEVICE
- Publication number 20130099266
- Publication date Apr 25, 2013
- Osram Opto Semiconductors GmbH
- Michael Wittmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20130049231
- Publication date Feb 28, 2013
- ROHM CO., LTD.
- Kosuke MIYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Element Control Device and In-Vehicle Electrical System
- Publication number 20120153719
- Publication date Jun 21, 2012
- Hitachi Automotive Systems, Ltd.
- Masamitsu Inaba
- B60 - VEHICLES IN GENERAL
Information Patent Application
WATERPROOF SURFACE MOUNT DEVICE PACKAGE AND METHOD
- Publication number 20120132937
- Publication date May 31, 2012
- Cree Huizhou Opto, Ltd.
- ALEX CHI KEUNG CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING CONDUCTIVE MATERIAL, CONDUCTIVE MATERIAL OBTAI...
- Publication number 20110186340
- Publication date Aug 4, 2011
- NICHIA CORPORATION
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR DEVICE ENCAPSULATED WITH SILICONE RESIN
- Publication number 20100213502
- Publication date Aug 26, 2010
- Tsutomu KASHIWAGI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20080230790
- Publication date Sep 25, 2008
- SHARP KABUSHIKI KAISHA
- Masahiro SEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20080083931
- Publication date Apr 10, 2008
- Nichia Corporation.
- Yoshitaka Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus, system and method for use in mounting electronic elements
- Publication number 20080041625
- Publication date Feb 21, 2008
- COTCO HOLDINGS LIMITED, a Hong Kong corporation
- Cheng Siu Cheong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070246841
- Publication date Oct 25, 2007
- Nichia Corporation.
- Saiki Yamamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Molded package and semiconductor device using molded package
- Publication number 20060175716
- Publication date Aug 10, 2006
- Shintaro Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded package and semiconductor device using molded package
- Publication number 20040256706
- Publication date Dec 23, 2004
- Shintaro Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Led lamp
- Publication number 20020149314
- Publication date Oct 17, 2002
- Yuji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

the kinked part being in proximity to the bonding area outside the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor chips and semiconductor packages including the same

Integrated chip scale packages

Printed circuit board, method, and semiconductor package

Semiconductor device

Integrated chip scale packages

Radiation-emitting semiconductor device

Method for making semiconductor device with lead frame made from to...

Articles including bonded metal structures and methods of preparing...

Microfluidic delivery member with filter and method of forming same

Radiation-emitting semiconductor device

Waterproof surface mount device package and method

Method for producing conductive material, conductive material obtai...

Semiconductor chip with bonding wire and method for making the same

Apparatus, system and method for use in mounting electronic elements

Optical semiconductor device encapsulated with silicone resin

Semiconductor light emitting device

Light emitting device

Molded package and semiconductor device using molded package

Semiconductor device

Molded package and semiconductor device using molded package

LED lamp

Patents Applicationslast 30 patents

RIBBON SHIELD DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

INTEGRATED CHIP SCALE PACKAGES

INTEGRATED CHIP SCALE PACKAGES

SEMICONDUCTOR DEVICE

ELECTRICALLY CONDUCTIVE BOND BETWEEN AT LEAST TWO ELECTRICAL COMPON...

RADIATION-EMITTING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

Semiconductor Element Control Device and In-Vehicle Electrical System

WATERPROOF SURFACE MOUNT DEVICE PACKAGE AND METHOD

METHOD FOR PRODUCING CONDUCTIVE MATERIAL, CONDUCTIVE MATERIAL OBTAI...

OPTICAL SEMICONDUCTOR DEVICE ENCAPSULATED WITH SILICONE RESIN

SEMICONDUCTOR LIGHT EMITTING DEVICE

LIGHT EMITTING DEVICE

Apparatus, system and method for use in mounting electronic elements

Semiconductor device

Molded package and semiconductor device using molded package

Molded package and semiconductor device using molded package

Led lamp