the layer connector connecting to a bonding area disposed in a recess of the surface

Industry

CPC
H01L2224/32147

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32147the layer connector connecting to a bonding area disposed in a recess of the surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for forming a three-dimensional (3D) memory device having bo...
- Patent number 12,080,697
- Issue date Sep 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device
- Patent number 12,021,049
- Issue date Jun 25, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,874,705
- Issue date Jan 16, 2024
- LG Display Co., Ltd.
- Mose Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-chip semiconductor package
- Patent number 11,848,319
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 11,837,568
- Issue date Dec 5, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structures and semiconductor devices including the same
- Patent number 11,804,462
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with connection structure and method for fabri...
- Patent number 11,631,655
- Issue date Apr 18, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution structure and method for f...
- Patent number 11,587,901
- Issue date Feb 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package
- Patent number 11,495,590
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded three-dimensional memory devices having bonding layers
- Patent number 11,450,653
- Issue date Sep 20, 2022
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with connection structure and method for fabri...
- Patent number 11,393,792
- Issue date Jul 19, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded three-dimensional memory devices and methods for forming the...
- Patent number 11,233,041
- Issue date Jan 25, 2022
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct C4 to C4 bonding without substrate
- Patent number 10,957,665
- Issue date Mar 23, 2021
- International Business Machines Corporation
- Effendi Leobandung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package
- Patent number 10,847,505
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit module and method of forming same
- Patent number 10,636,768
- Issue date Apr 28, 2020
- Starkey Laboratories, Inc.
- Sayed Kaysarbin Rahim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Stack type sensor package structure
- Patent number 10,340,250
- Issue date Jul 2, 2019
- KINGPAK TECHNOLOGY INC.
- Jian-Ru Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Edge interconnect packaging of integrated circuits for power systems
- Patent number 10,325,875
- Issue date Jun 18, 2019
- North Carolina State University
- Jason M. Kulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-pillar assisted semiconductor bonding
- Patent number 10,319,693
- Issue date Jun 11, 2019
- Skorpios Technologies, Inc.
- Damien Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 9,917,071
- Issue date Mar 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Ying-Ta Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically integrated wafers with thermal dissipation
- Patent number 9,812,428
- Issue date Nov 7, 2017
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Zhijiong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device
- Patent number 9,653,623
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Yi-Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding process and structures
- Patent number 9,613,926
- Issue date Apr 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked synchronous buck converter having chip embedded in outside...
- Patent number 9,425,132
- Issue date Aug 23, 2016
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic components assembly
- Patent number 9,204,530
- Issue date Dec 1, 2015
- Panasonic Corporation
- Hiromitsu Takashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked synchronous buck converter having chip embedded in outside...
- Patent number 9,184,121
- Issue date Nov 10, 2015
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with stacked semiconductor chips
- Patent number 8,476,738
- Issue date Jul 2, 2013
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240312934
- Publication date Sep 19, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240222327
- Publication date Jul 4, 2024
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240071964
- Publication date Feb 29, 2024
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND DISPLAY APPARATUS HAVING THE SAME
- Publication number 20230387095
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Jaeseok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Protective Layer
- Publication number 20230260949
- Publication date Aug 17, 2023
- Western Digital Technologies, Inc.
- Joyce Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230074933
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Youngkun JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME
- Publication number 20230039914
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Juyoun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Semiconductor Package
- Publication number 20220384411
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20220344298
- Publication date Oct 27, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR F...
- Publication number 20220310545
- Publication date Sep 29, 2022
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME
- Publication number 20220077100
- Publication date Mar 10, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTION STRUCTURE AND METHOD FOR FABRI...
- Publication number 20220077118
- Publication date Mar 10, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...
- Publication number 20220068905
- Publication date Mar 3, 2022
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTION STRUCTURE AND METHOD FOR FABRI...
- Publication number 20210305208
- Publication date Sep 30, 2021
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...
- Publication number 20210134778
- Publication date May 6, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...
- Publication number 20210134779
- Publication date May 6, 2021
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Semiconductor Package
- Publication number 20210091059
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device for Attaching Two Elements Such as a Chip, an Interposer and...
- Publication number 20200198962
- Publication date Jun 25, 2020
- TRONIC'S MICROSYSTEMS
- Valérie Volant
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRIC MODULE, ENDOSCOPE, AND METHOD FOR MANUFACTURING ELECTRIC M...
- Publication number 20200052029
- Publication date Feb 13, 2020
- OLYMPUS CORPORATION
- Shoichiro KAWAYOKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Semiconductor Package
- Publication number 20190312018
- Publication date Oct 10, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK TYPE SENSOR PACKAGE STRUCTURE
- Publication number 20190057952
- Publication date Feb 21, 2019
- Kingpak Technology Inc.
- Jian-Ru Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Edge Interconnect Packaging of Integrated Circuits for Power Systems
- Publication number 20170162532
- Publication date Jun 8, 2017
- Jason M. Kulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENTS ASSEMBLY
- Publication number 20130265729
- Publication date Oct 10, 2013
- PANASONIC CORPORATION
- Hiromitsu TAKASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDISTRIBUTING FUNCTIONAL ELEMENT
- Publication number 20130237055
- Publication date Sep 12, 2013
- IMEC
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20110317371
- Publication date Dec 29, 2011
- Chien-Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector connecting to a bonding area disposed in a recess of the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming a three-dimensional (3D) memory device having bo...

Display panel and display device

Display device

Multi-chip semiconductor package

Bonding structures and methods for forming the same

Hybrid bonding structures and semiconductor devices including the same

Semiconductor device with connection structure and method for fabri...

Semiconductor device with redistribution structure and method for f...

Multi-chip semiconductor package

Bonded three-dimensional memory devices having bonding layers

Semiconductor device with connection structure and method for fabri...

Bonded three-dimensional memory devices and methods for forming the...

Direct C4 to C4 bonding without substrate

Multi-chip semiconductor package

Integrated circuit module and method of forming same

Stack type sensor package structure

Edge interconnect packaging of integrated circuits for power systems

Micro-pillar assisted semiconductor bonding

Semiconductor packages

Vertically integrated wafers with thermal dissipation

Methods of manufacturing a semiconductor device

Wafer to wafer bonding process and structures

Stacked synchronous buck converter having chip embedded in outside...

Electronic components assembly

Stacked synchronous buck converter having chip embedded in outside...

Electronic package with stacked semiconductor chips

Patents Applicationslast 30 patents

DISPLAY PANEL AND DISPLAY DEVICE

ELECTRONIC DEVICE

DISPLAY PANEL AND DISPLAY DEVICE

DISPLAY MODULE AND DISPLAY APPARATUS HAVING THE SAME

Semiconductor Device with Protective Layer

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME

Multi-Chip Semiconductor Package

BONDING STRUCTURES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR F...

HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME

SEMICONDUCTOR DEVICE WITH CONNECTION STRUCTURE AND METHOD FOR FABRI...

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...

SEMICONDUCTOR DEVICE WITH CONNECTION STRUCTURE AND METHOD FOR FABRI...

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...

Multi-Chip Semiconductor Package

Device for Attaching Two Elements Such as a Chip, an Interposer and...

ELECTRIC MODULE, ENDOSCOPE, AND METHOD FOR MANUFACTURING ELECTRIC M...

Multi-Chip Semiconductor Package

STACK TYPE SENSOR PACKAGE STRUCTURE

Edge Interconnect Packaging of Integrated Circuits for Power Systems

ELECTRONIC COMPONENTS ASSEMBLY

METHOD OF REDISTRIBUTING FUNCTIONAL ELEMENT

ELECTRONIC COMPONENT PACKAGE AND FABRICATION METHOD THEREOF