the layer connector connecting to a bonding area protruding from the surface of the item

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H01L2224/32188

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/32188the layer connector connecting to a bonding area protruding from the surface of the item

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Patents Grantslast 30 patents

Information Patent Grant
Package carrier, semiconductor package, and process for fabricating...
- Patent number 9,564,346
- Issue date Feb 7, 2017
- Advanced Semiconductor Engineering, Inc.
- Yuan-Chang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly having a housing
- Patent number 9,373,563
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Thilo Stolze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced stacked microelectronic assemblies with central contacts a...
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- Issue date Apr 12, 2016
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and process for fabricating same
- Patent number 9,165,900
- Issue date Oct 20, 2015
- Advanced Semiconductor Engineering, Inc.
- Yuan-Chang Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip assembly with post/base heat spreader and dual a...
- Patent number 9,018,667
- Issue date Apr 28, 2015
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced stacked microelectronic assemblies with central contacts a...
- Patent number 8,941,999
- Issue date Jan 27, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Holder for electrical component and electrical device including the...
- Patent number 8,742,259
- Issue date Jun 3, 2014
- Valeo Etudes Electroniques
- Jean-Michel Morelle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally and electrically enhanced ball grid array package
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- Issue date Apr 1, 2014
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal-integrated metal base package module and terminal-integrat...
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- Kyoung-Min Kim
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
LED package structure and manufacturing method, and LED array module
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- Issue date Nov 26, 2013
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- Su-ho Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced stacked microelectronic assemblies with central contacts a...
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- Issue date Oct 8, 2013
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Information Patent Grant
Semiconductor chip assembly with post/base heat spreader and multil...
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- Issue date Sep 10, 2013
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- Charles W. C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip assembly with post/base heat spreader with therm...
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- Issue date Sep 3, 2013
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Suspended-membrane/suspended-substrate monolithic microwave integra...
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- Issue date Apr 23, 2013
- HRL Laboratories, LLC
- Debabani Choudhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Illumination device with semiconductor light-emitting elements
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- Issue date Mar 19, 2013
- Toshiba Lighting & Technology Corporation
- Tomohiro Sanpei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip assembly with post/base heat spreader and horizo...
- Patent number 8,378,372
- Issue date Feb 19, 2013
- Bridge Semiconductor Corporation
- Chia-Chung Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a semiconductor chip assembly with a post/base hea...
- Patent number 8,329,510
- Issue date Dec 11, 2012
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assembly with post/base heat spreader with ESD p...
- Patent number 8,310,043
- Issue date Nov 13, 2012
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array package enhanced with a thermal and electrical conn...
- Patent number 8,310,067
- Issue date Nov 13, 2012
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- Sam Ziqun Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a semiconductor chip assembly with a post/base hea...
- Patent number 8,298,868
- Issue date Oct 30, 2012
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- Charles W. C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip assembly with post/base/post heat spreader
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- Issue date Oct 16, 2012
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- Charles W. C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a power semiconductor module, and power semico...
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- Peter Beckedahl
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Information Patent Grant
Soldering method and method of manufacturing semiconductor device i...
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- Issue date Sep 25, 2012
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- Kazunaga Onishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip assembly with post/base heat spreader and signal...
- Patent number 8,269,336
- Issue date Sep 18, 2012
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure including hybrid frame panel
- Patent number 8,259,454
- Issue date Sep 4, 2012
- General Electric Company
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor chip assembly with a post/base hea...
- Patent number 8,236,619
- Issue date Aug 7, 2012
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a semiconductor chip assembly with a post/base/pos...
- Patent number 8,236,618
- Issue date Aug 7, 2012
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip assembly with post/base heat spreader and cerami...
- Patent number 8,232,576
- Issue date Jul 31, 2012
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip assembly with aluminum post/base heat spreader a...
- Patent number 8,232,573
- Issue date Jul 31, 2012
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- F21 - LIGHTING
Information Patent Grant
Radio frequency unit analog level detector and feedback control system
- Patent number 8,208,863
- Issue date Jun 26, 2012
- Broadcom Corporation
- Arya Reza Behzad
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
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TRANSFORMER GUARD TRACE
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ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS A...
- Publication number 20140035121
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TERMINAL-INTEGRATED METAL BASE PACKAGE MODULE AND TERMINAL-INTEGRAT...
- Publication number 20130037309
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- WAVENICS INC.
- Kyoung-Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
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ILLUMINATION DEVICE WITH SEMICONDUCTOR LIGHT-EMITTING ELEMENTS
- Publication number 20120201028
- Publication date Aug 9, 2012
- Toshiba Lighting & Technology Corporation
- Tomohiro Sanpei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS A...
- Publication number 20120092832
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- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEA...
- Publication number 20120064672
- Publication date Mar 15, 2012
- Charles W.C. Lin
- F21 - LIGHTING
Information Patent Application
Thermally and Electrically Enhanced Ball Grid Array Package
- Publication number 20110318885
- Publication date Dec 29, 2011
- BROADCOM CORPORATION
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METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKA...
- Publication number 20110311831
- Publication date Dec 22, 2011
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Motohiro Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/DIELECTR...
- Publication number 20110287563
- Publication date Nov 24, 2011
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP ASSEMBLY WITH POST/DIELECTRIC/POST HEAT SPREADER
- Publication number 20110278638
- Publication date Nov 17, 2011
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEA...
- Publication number 20110275180
- Publication date Nov 10, 2011
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER WITH THERM...
- Publication number 20110227122
- Publication date Sep 22, 2011
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEA...
- Publication number 20110201157
- Publication date Aug 18, 2011
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND MULTIL...
- Publication number 20110198662
- Publication date Aug 18, 2011
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEA...
- Publication number 20110183472
- Publication date Jul 28, 2011
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ILLUMINATION DEVICE WITH SEMICONDUCTOR LIGHT-EMITTING ELEMENTS
- Publication number 20110182073
- Publication date Jul 28, 2011
- TOSHIBA LIGHTING & TECHNOLOGY CORPORATION
- TOMOHIRO SANPEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND PLATED...
- Publication number 20110175136
- Publication date Jul 21, 2011
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACK PACKAGE
- Publication number 20110156233
- Publication date Jun 30, 2011
- Hynix Semiconductor Inc.
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/POST HEAT SPREADER AND A...
- Publication number 20110156090
- Publication date Jun 30, 2011
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/POS...
- Publication number 20110151626
- Publication date Jun 23, 2011
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ball Grid Array Package Enhanced With a Thermal and Electrical Conn...
- Publication number 20110140272
- Publication date Jun 16, 2011
- BROADCOM CORPORATION
- Sam Ziqun ZHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making a semiconductor chip assembly with a post/base hea...
- Publication number 20110104855
- Publication date May 5, 2011
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/POST HEAT SPREADER
- Publication number 20110101410
- Publication date May 5, 2011
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/POS...
- Publication number 20110104856
- Publication date May 5, 2011
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Open Cavity Leadless Surface Mountable Package for High Power RF Ap...
- Publication number 20110089529
- Publication date Apr 21, 2011
- Infineon Technologies North America Corp.
- Donald Fowlkes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER WITH ESD P...
- Publication number 20110089465
- Publication date Apr 21, 2011
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTO-ELECTRICAL ASSEMBLIES AND ASSOCIATED APPARATUS AND METHODS
- Publication number 20110089438
- Publication date Apr 21, 2011
- Zarlink Semiconductor AB
- Odd Robert Steijer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE CARRIER, SEMICONDUCTOR PACKAGE, AND PROCESS FOR FABRICATING...
- Publication number 20110084372
- Publication date Apr 14, 2011
- Advanced Semiconductor Engineering, Inc.
- YUAN-CHANG SU
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector connecting to a bonding area protruding from the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package carrier, semiconductor package, and process for fabricating...

Semiconductor assembly having a housing

Enhanced stacked microelectronic assemblies with central contacts a...

Semiconductor package and process for fabricating same

Semiconductor chip assembly with post/base heat spreader and dual a...

Enhanced stacked microelectronic assemblies with central contacts a...

Holder for electrical component and electrical device including the...

Thermally and electrically enhanced ball grid array package

Terminal-integrated metal base package module and terminal-integrat...

LED package structure and manufacturing method, and LED array module

Enhanced stacked microelectronic assemblies with central contacts a...

Semiconductor chip assembly with post/base heat spreader and multil...

Semiconductor chip assembly with post/base heat spreader with therm...

Suspended-membrane/suspended-substrate monolithic microwave integra...

Illumination device with semiconductor light-emitting elements

Semiconductor chip assembly with post/base heat spreader and horizo...

Method of making a semiconductor chip assembly with a post/base hea...

Semiconductor chip assembly with post/base heat spreader with ESD p...

Ball grid array package enhanced with a thermal and electrical conn...

Method of making a semiconductor chip assembly with a post/base hea...

Semiconductor chip assembly with post/base/post heat spreader

Method for producing a power semiconductor module, and power semico...

Soldering method and method of manufacturing semiconductor device i...

Semiconductor chip assembly with post/base heat spreader and signal...

Interconnect structure including hybrid frame panel

Method of making a semiconductor chip assembly with a post/base hea...

Method of making a semiconductor chip assembly with a post/base/pos...

Semiconductor chip assembly with post/base heat spreader and cerami...

Semiconductor chip assembly with aluminum post/base heat spreader a...

Radio frequency unit analog level detector and feedback control system

Patents Applicationslast 30 patents

SENSOR FOR MEASURING A GAS PROPERTY

TRANSFORMER GUARD TRACE

SEMICONDUCTOR PACKAGE AND PROCESS FOR FABRICATING SAME

ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS A...

TERMINAL-INTEGRATED METAL BASE PACKAGE MODULE AND TERMINAL-INTEGRAT...

ILLUMINATION DEVICE WITH SEMICONDUCTOR LIGHT-EMITTING ELEMENTS

ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS A...

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEA...

Thermally and Electrically Enhanced Ball Grid Array Package

METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKA...

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/DIELECTR...

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/DIELECTRIC/POST HEAT SPREADER

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEA...

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER WITH THERM...

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEA...

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND MULTIL...

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEA...

ILLUMINATION DEVICE WITH SEMICONDUCTOR LIGHT-EMITTING ELEMENTS

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND PLATED...

STACK PACKAGE

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/POST HEAT SPREADER AND A...

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/POS...

Ball Grid Array Package Enhanced With a Thermal and Electrical Conn...

Method of making a semiconductor chip assembly with a post/base hea...

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/POST HEAT SPREADER

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/POS...

Open Cavity Leadless Surface Mountable Package for High Power RF Ap...

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER WITH ESD P...

OPTO-ELECTRICAL ASSEMBLIES AND ASSOCIATED APPARATUS AND METHODS

PACKAGE CARRIER, SEMICONDUCTOR PACKAGE, AND PROCESS FOR FABRICATING...