the layer connector connecting to a via metallisation of the item

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32235the layer connector connecting to a via metallisation of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,033,973
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Soohyun Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming electrical interconnections using capillary microfluidics
- Patent number 11,937,381
- Issue date Mar 19, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,756,934
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device integration into system substrate
- Patent number 11,735,623
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,682,613
- Issue date Jun 20, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip backside mechanical die grounding techniques
- Patent number 11,574,887
- Issue date Feb 7, 2023
- Texas Instruments Incorporated
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor design for integrated magnetic devices
- Patent number 11,393,787
- Issue date Jul 19, 2022
- Texas Instruments Incorporated
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiled light emitting diode display panel having different resistanc...
- Patent number 11,355,473
- Issue date Jun 7, 2022
- A.U. VISTA, INC.
- Fang-Chen Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser component and method of producing a semiconduct...
- Patent number 11,189,990
- Issue date Nov 30, 2021
- OSRAM OLED GmbH
- Andreas Wojcik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,081,434
- Issue date Aug 3, 2021
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging method and integrated packaged circuit
- Patent number 10,867,959
- Issue date Dec 15, 2020
- Shenzhen Xiuyuan Electronic Technology Co., Ltd
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device integration into system substrate
- Patent number 10,847,571
- Issue date Nov 24, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip wiring method and structure
- Patent number 10,847,496
- Issue date Nov 24, 2020
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Chuan Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro device integration into system substrate
- Patent number 10,700,120
- Issue date Jun 30, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 10,622,327
- Issue date Apr 14, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit multichip stacked packaging structure and method
- Patent number 10,615,151
- Issue date Apr 7, 2020
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip backside mechanical die grounding techniques
- Patent number 10,600,753
- Issue date Mar 24, 2020
- Texas Instruments Incorporated
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible micro-module
- Patent number 10,438,895
- Issue date Oct 8, 2019
- American Semiconductor, Inc.
- Douglas R. Hackler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,383,572
- Issue date Aug 20, 2019
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,258,279
- Issue date Apr 16, 2019
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit device and method for manufacturin...
- Patent number 10,217,689
- Issue date Feb 26, 2019
- Rohm Co., Ltd.
- Ippei Yasutake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,130,302
- Issue date Nov 20, 2018
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro device integration into system substrate
- Patent number 10,134,803
- Issue date Nov 20, 2018
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealed semiconductor light emitting device
- Patent number 10,020,431
- Issue date Jul 10, 2018
- Lumileds LLC
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 10,014,271
- Issue date Jul 3, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 9,773,751
- Issue date Sep 26, 2017
- International Business Machines Corporation
- John U. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, method of manufacturing the same, metal particle...
- Patent number 9,515,044
- Issue date Dec 6, 2016
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, fabrication method therefor, and package-on...
- Patent number 9,502,391
- Issue date Nov 22, 2016
- NEPES CO., LTD.
- Yong-Tae Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 9,455,219
- Issue date Sep 27, 2016
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (POP) structure including multiple dies
- Patent number 9,401,350
- Issue date Jul 26, 2016
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS
- Publication number 20240347497
- Publication date Oct 17, 2024
- International Business Machines Corporation
- SHIDONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE DEVICE, FABRICATION METHOD THEREOF AND MEMORY SY...
- Publication number 20240332152
- Publication date Oct 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xinru Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321815
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Soohyun NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240313043
- Publication date Sep 19, 2024
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234281
- Publication date Jul 11, 2024
- LG Innotek Co., Ltd.
- Hyun Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240222327
- Publication date Jul 4, 2024
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, PACKAGE FORMING METHOD, AND POWER SUPPLY MODULE
- Publication number 20240203843
- Publication date Jun 20, 2024
- Shenzhen STS Microelectronics Co., Ltd.
- Lin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240203854
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Hyeon Jeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME
- Publication number 20240203855
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Jaemok JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178082
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240178114
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- KYOUNG LIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178083
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240170361
- Publication date May 23, 2024
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136267
- Publication date Apr 25, 2024
- LG Innotek Co., Ltd.
- Hyun Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240088006
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Sangcheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055339
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Hwanjoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055338
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Byungho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTERING STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20240047385
- Publication date Feb 8, 2024
- Huawei Technologies Co., Ltd
- Kehan Sui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL 3D STACKED PACKAGE AND METHODS OF FORMING THE SAME
- Publication number 20240030117
- Publication date Jan 25, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411274
- Publication date Dec 21, 2023
- Yoichi NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230387081
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20230207611
- Publication date Jun 29, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220336418
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220189907
- Publication date Jun 16, 2022
- Samsung Electronics Co., Ltd.
- Soohyun NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING ELECTRICAL INTERCONNECTIONS USING CAPILLARY MICROFLUIDICS
- Publication number 20220078918
- Publication date Mar 10, 2022
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20200328249
- Publication date Oct 15, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Multichip Stacked Packaging Structure and Method
- Publication number 20190326261
- Publication date Oct 24, 2019
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packaging Method and Integrated Packaged Circuit
- Publication number 20190326207
- Publication date Oct 24, 2019
- Shenzhen Xiuyuan Electronic Technology Co., Ltd.
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR DESIGN FOR INTEGRATED MAGNETIC DEVICES
- Publication number 20190164934
- Publication date May 30, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20180358405
- Publication date Dec 13, 2018
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector connecting to a via metallisation of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Forming electrical interconnections using capillary microfluidics

Semiconductor structure and manufacturing method thereof

Micro device integration into system substrate

Package substrates with magnetic build-up layers

Flip chip backside mechanical die grounding techniques

Conductor design for integrated magnetic devices

Tiled light emitting diode display panel having different resistanc...

Semiconductor laser component and method of producing a semiconduct...

Package substrates with magnetic build-up layers

Integrated circuit packaging method and integrated packaged circuit

Micro device integration into system substrate

Chip wiring method and structure

Micro device integration into system substrate

Method for manufacturing semiconductor structure

Integrated circuit multichip stacked packaging structure and method

Flip chip backside mechanical die grounding techniques

Flexible micro-module

Via and trench filling using injection molded soldering

Via and trench filling using injection molded soldering

Semiconductor integrated circuit device and method for manufacturin...

Via and trench filling using injection molded soldering

Micro device integration into system substrate

Sealed semiconductor light emitting device

Semiconductor structure and method of manufacturing the same

Via and trench filling using injection molded soldering

Electronic device, method of manufacturing the same, metal particle...

Semiconductor package, fabrication method therefor, and package-on...

Wiring substrate and method of manufacturing the same

Package-on-package (POP) structure including multiple dies

Patents Applicationslast 30 patents

THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS

INTEGRATED PACKAGE DEVICE, FABRICATION METHOD THEREOF AND MEMORY SY...

SEMICONDUCTOR PACKAGE

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE, PACKAGE FORMING METHOD, AND POWER SUPPLY MODULE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

FILTERING STRUCTURE AND ELECTRONIC DEVICE

MULTI-LEVEL 3D STACKED PACKAGE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

FORMING ELECTRICAL INTERCONNECTIONS USING CAPILLARY MICROFLUIDICS

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

Integrated Circuit Multichip Stacked Packaging Structure and Method

Integrated Circuit Packaging Method and Integrated Packaged Circuit

CONDUCTOR DESIGN FOR INTEGRATED MAGNETIC DEVICES

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE