the other connecting portion not on the bonding area also being a ball bond

Industry

CPC
H01L2224/48464

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48464the other connecting portion not on the bonding area also being a ball bond

Industries

Patents Grantslast 30 patents

Information Patent Grant
LED assembly
- Patent number 11,949,050
- Issue date Apr 2, 2024
- Epistar Corporation
- Tzer-Perng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, solid-state image pickup element, image picku...
- Patent number 11,923,395
- Issue date Mar 5, 2024
- Sony Group Corporation
- Yoshiaki Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,916,028
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,887,970
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level configurability
- Patent number 11,848,323
- Issue date Dec 19, 2023
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with heat sink and method preparing...
- Patent number 11,842,976
- Issue date Dec 12, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,664,343
- Issue date May 30, 2023
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication and use of through silicon vias on double sided interco...
- Patent number 11,594,524
- Issue date Feb 28, 2023
- Intel Corporation
- Brennen K. Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED assembly with omnidirectional light field
- Patent number 11,543,081
- Issue date Jan 3, 2023
- Epistar Corporation
- Hong-Zhi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with heat sink and method preparing...
- Patent number 11,488,925
- Issue date Nov 1, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light source circuit unit, illuminator, and display
- Patent number 11,476,396
- Issue date Oct 18, 2022
- Saturn Licensing LLC
- Koichi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal surface-mount semiconductor package
- Patent number 11,469,205
- Issue date Oct 11, 2022
- Adventive International Ltd.
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noble metal-coated silver wire for ball bonding and method for prod...
- Patent number 11,456,271
- Issue date Sep 27, 2022
- TANAKA DENSHI KOGYO K.K.
- Jun Chiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED assembly for omnidirectional light applications
- Patent number 11,450,791
- Issue date Sep 20, 2022
- Epistar Corporation
- Tzer-Perng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,424,211
- Issue date Aug 23, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices for high voltage with die edge prote...
- Patent number 11,417,579
- Issue date Aug 16, 2022
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation of circuit elements using front side deep trench etch
- Patent number 11,417,725
- Issue date Aug 16, 2022
- Texas Instruments Incorporated
- Dan Carothers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,373,979
- Issue date Jun 28, 2022
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting module for automotive vehicle comprising two types of ligh...
- Patent number 11,339,940
- Issue date May 24, 2022
- Valeo Iluminacion
- Jose-Ramon Martinez-Perez
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Wire bonding structure
- Patent number 11,335,661
- Issue date May 17, 2022
- Nippon Telegraph and Telephone Corporation
- Miwa Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including processor chip and memory chip
- Patent number 11,309,300
- Issue date Apr 19, 2022
- Samsung Electronics Co., Ltd.
- Kil-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication and use of through silicon vias on double sided interco...
- Patent number 11,251,156
- Issue date Feb 15, 2022
- Intel Corporation
- Brennen K. Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light source circuit unit, illuminator, and display
- Patent number 11,201,268
- Issue date Dec 14, 2021
- Saturn Licensing LLC
- Koichi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package assembly
- Patent number 11,171,120
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 11,158,591
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Chan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and methods of forming same
- Patent number 11,152,344
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming leadless semiconductor packages with plated lead...
- Patent number 11,145,581
- Issue date Oct 12, 2021
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,069,636
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIP...
- Publication number 20240096802
- Publication date Mar 21, 2024
- NVIDIA Corporation
- Shawn Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE WITH PRESS-FIT CONDUCTIVE PINS
- Publication number 20240071892
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL OUTLINE TRANSISTOR WITH THERMAL FLAT LEAD
- Publication number 20240055331
- Publication date Feb 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Hau Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
- Publication number 20240047415
- Publication date Feb 8, 2024
- NANO-X IMAGING LTD
- Ukyo JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...
- Publication number 20240047331
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...
- Publication number 20240047333
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240047443
- Publication date Feb 8, 2024
- Kabushiki Kaisha Toshiba
- Jia LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240021550
- Publication date Jan 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240021551
- Publication date Jan 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING
- Publication number 20230395538
- Publication date Dec 7, 2023
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP OF CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING
- Publication number 20230395537
- Publication date Dec 7, 2023
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE
- Publication number 20230361073
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH HIGH DRAFT ANGLE PACKAGE STRUCTURE
- Publication number 20230361008
- Publication date Nov 9, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Wei Fen Sueann Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADED SEMICONDUCTOR PACKAGE WITH LEAD MOLD FLASH REDUCTION
- Publication number 20230275060
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Xiaoling Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20230253360
- Publication date Aug 10, 2023
- SK HYNIX INC.
- Jong Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230170324
- Publication date Jun 1, 2023
- Hamamatsu Photonics K.K.
- Ryousuke KOUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY
- Publication number 20230092132
- Publication date Mar 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Hau Nguyen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LED ASSEMBLY
- Publication number 20230012204
- Publication date Jan 12, 2023
- EPISTAR CORPORATION
- TZER-PERNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal Surface-Mount Semiconductor Package
- Publication number 20220415849
- Publication date Dec 29, 2022
- Adventive International Ltd.
- Richard K Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20220375891
- Publication date Nov 24, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING PRINTED CIRCUIT BOARD
- Publication number 20220225502
- Publication date Jul 14, 2022
- DENSO CORPORATION
- Hirokazu SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PROCESSOR CHIP AND MEMORY CHIP
- Publication number 20220216193
- Publication date Jul 7, 2022
- Samsung Electronics Co., Ltd.
- Kil-Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20220189906
- Publication date Jun 16, 2022
- SK HYNIX INC.
- Jong Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION AND USE OF THROUGH SILICON VIAS ON DOUBLE SIDED INTERCO...
- Publication number 20220130803
- Publication date Apr 28, 2022
- Intel Corporation
- Brennen K. MUELLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20220013460
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20210343666
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SOLID-STATE IMAGE PICKUP ELEMENT, IMAGE PICKU...
- Publication number 20210313375
- Publication date Oct 7, 2021
- SONY GROUP CORPORATION
- Yoshiaki MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH HEAT SINK AND METHOD PREPARING...
- Publication number 20210280552
- Publication date Sep 9, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY
- Publication number 20210175228
- Publication date Jun 10, 2021
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED ASSEMBLY
- Publication number 20210151640
- Publication date May 20, 2021
- EPISTAR CORPORATION
- TZER-PERNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS

the other connecting portion not on the bonding area also being a ball bond

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

LED assembly

Semiconductor device, solid-state image pickup element, image picku...

Package structure and method of forming the same

Stacked microfeature devices and associated methods

Semiconductor devices with package-level configurability

Semiconductor package structure with heat sink and method preparing...

Package-on-package assembly with wire bonds to encapsulation surface

Semiconductor package including stacked semiconductor chips

Fabrication and use of through silicon vias on double sided interco...

LED assembly with omnidirectional light field

Semiconductor package structure with heat sink and method preparing...

Multi-die package with bridge layer

Light source circuit unit, illuminator, and display

Universal surface-mount semiconductor package

Noble metal-coated silver wire for ball bonding and method for prod...

LED assembly for omnidirectional light applications

Package-on-package assembly with wire bonds to encapsulation surface

Packaged semiconductor devices for high voltage with die edge prote...

Isolation of circuit elements using front side deep trench etch

Stacked microfeature devices and associated methods

Lighting module for automotive vehicle comprising two types of ligh...

Wire bonding structure

Semiconductor package including processor chip and memory chip

Fabrication and use of through silicon vias on double sided interco...

Light source circuit unit, illuminator, and display

Integrated circuit package assembly

Bond pad structure for bonding improvement

Integrated circuit package and methods of forming same

Methods of forming leadless semiconductor packages with plated lead...

Package structure and method of forming the same

Patents Applicationslast 30 patents

REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIP...

MOLDED PACKAGE WITH PRESS-FIT CONDUCTIVE PINS

SMALL OUTLINE TRANSISTOR WITH THERMAL FLAT LEAD

SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...

WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...

WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR DEVICE

BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING

BUMP OF CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING

METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE

ELECTRONIC DEVICE WITH HIGH DRAFT ANGLE PACKAGE STRUCTURE

LEADED SEMICONDUCTOR PACKAGE WITH LEAD MOLD FLASH REDUCTION

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY

LED ASSEMBLY

Universal Surface-Mount Semiconductor Package

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING PRINTED CIRCUIT BOARD

SEMICONDUCTOR PACKAGE INCLUDING PROCESSOR CHIP AND MEMORY CHIP

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

FABRICATION AND USE OF THROUGH SILICON VIAS ON DOUBLE SIDED INTERCO...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE, SOLID-STATE IMAGE PICKUP ELEMENT, IMAGE PICKU...

SEMICONDUCTOR PACKAGE STRUCTURE WITH HEAT SINK AND METHOD PREPARING...

SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY

LED ASSEMBLY