the other connecting portion not on the bonding area being a ball bond

Industry

CPC
H01L2224/48471

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48471the other connecting portion not on the bonding area being a ball bond

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 12,142,348
- Issue date Nov 12, 2024
- RAMBUS INC.
- Ian Shaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circular bond finger pad
- Patent number 12,021,063
- Issue date Jun 25, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba Buot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,887,970
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light-emitting device
- Patent number 11,799,266
- Issue date Oct 24, 2023
- Rohm Co., Ltd.
- Yuki Tanuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 11,783,879
- Issue date Oct 10, 2023
- RAMBUS INC.
- Ian Shaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,699,641
- Issue date Jul 11, 2023
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted leads for packaged isolation devices
- Patent number 11,658,243
- Issue date May 23, 2023
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,626,352
- Issue date Apr 11, 2023
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding between isolation capacitors for multichip modules
- Patent number 11,495,553
- Issue date Nov 8, 2022
- Texas Instruments Incorporated
- Thomas Dyer Bonifield
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,373,979
- Issue date Jun 28, 2022
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the light emittin...
- Patent number 11,315,913
- Issue date Apr 26, 2022
- Nichia Corporation
- Hiroaki Ukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 11,211,105
- Issue date Dec 28, 2021
- RAMBUS INC.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Grant
Plurality of lead frames electrically connected to inductor chip
- Patent number 11,177,198
- Issue date Nov 16, 2021
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Receiver optical module and process of assembling the same
- Patent number 11,152,342
- Issue date Oct 19, 2021
- Sumitomo Electric Device Innovations, Inc.
- Kyohei Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip modules including stacked semiconductor dice
- Patent number 11,101,245
- Issue date Aug 24, 2021
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scribe seals and methods of making
- Patent number 11,069,627
- Issue date Jul 20, 2021
- Texas Instruments Incorporated
- Thomas D. Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED lighting apparatus
- Patent number 10,976,011
- Issue date Apr 13, 2021
- Rohm Co., Ltd.
- Tomoharu Horio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,944,046
- Issue date Mar 9, 2021
- Rohm Co., Ltd.
- Yuya Hasegawa
- G01 - MEASURING TESTING
Information Patent Grant
Production of optoelectronic components
- Patent number 10,847,686
- Issue date Nov 24, 2020
- OSRAM OLED GmbH
- Martin Brandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact wirebonding in stacked-chip system in package, and methods...
- Patent number 10,847,450
- Issue date Nov 24, 2020
- Intel Corporation
- Saeed Shojaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip packaging including a heat sink topped cavity
- Patent number 10,818,572
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device comprising programmable command-and-address and/or da...
- Patent number 10,770,124
- Issue date Sep 8, 2020
- RAMBUS INC.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Grant
Receiver optical module and process of assembling the same
- Patent number 10,734,369
- Issue date Aug 4, 2020
- Sumitomo Electric Device Innovations, Inc.
- Kyohei Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic unit
- Patent number 10,714,461
- Issue date Jul 14, 2020
- Vishay Semiconductor GmbH
- Christoph Paul Gebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package including microelectronic elements having s...
- Patent number 10,692,842
- Issue date Jun 23, 2020
- Invensas Corporation
- Richard Dewitt Crisp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor package structure
- Patent number 10,692,917
- Issue date Jun 23, 2020
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire having a silver alloy core, wire bonding method using...
- Patent number 10,658,326
- Issue date May 19, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED lighting apparatus
- Patent number 10,655,793
- Issue date May 19, 2020
- Rohm Co., Ltd.
- Tomoharu Horio
- F21 - LIGHTING

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDS FOR GALVANIC ISOLATION DEVICE
- Publication number 20240113155
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20240096387
- Publication date Mar 21, 2024
- Rambus Inc.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR P...
- Publication number 20240038720
- Publication date Feb 1, 2024
- SK HYNIX INC.
- Su Ji UM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...
- Publication number 20230420404
- Publication date Dec 28, 2023
- Sony Semiconductor Solutions Corporation
- Yuji HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230411354
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Chihong SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230395568
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Buwon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230207432
- Publication date Jun 29, 2023
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCULAR BOND FINGER PAD
- Publication number 20220238488
- Publication date Jul 28, 2022
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20220172760
- Publication date Jun 2, 2022
- Rambus Inc.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220028763
- Publication date Jan 27, 2022
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20210050043
- Publication date Feb 18, 2021
- Rambus Inc.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Application
RECEIVER OPTICAL MODULE AND PROCESS OF ASSEMBLING THE SAME
- Publication number 20200328199
- Publication date Oct 15, 2020
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kyohei MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGING
- Publication number 20200168524
- Publication date May 28, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGING
- Publication number 20200168525
- Publication date May 28, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200091416
- Publication date Mar 19, 2020
- ROHM CO., LTD.
- Yuya Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200066619
- Publication date Feb 27, 2020
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING BETWEEN ISOLATION CAPACITORS FOR MULTICHIP MODULES
- Publication number 20200027848
- Publication date Jan 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- THOMAS DYER BONIFIELD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED RF FRONT END SYSTEM
- Publication number 20190319093
- Publication date Oct 17, 2019
- SKYWORKS SOLUTIONS, INC.
- Michael Joseph McPartlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...
- Publication number 20190206458
- Publication date Jul 4, 2019
- RAMBUS INC.
- Ian Shaeffer
- G11 - INFORMATION STORAGE
Information Patent Application
BIPOLAR TRANSISTOR ON HIGH-RESISTIVITY SUBSTRATE
- Publication number 20190131438
- Publication date May 2, 2019
- SKYWORKS SOLUTIONS, INC.
- Michael Joseph McPartlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic Package Including Microelectronic Elements Having S...
- Publication number 20190035769
- Publication date Jan 31, 2019
- Invensas Corporation
- Richard Dewitt Crisp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20190006566
- Publication date Jan 3, 2019
- Nichia Corporation.
- Hiroaki UKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
- Publication number 20180358331
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Mung Suan Heng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
3-D STACKING OF ACTIVE DEVICES OVER PASSIVE DEVICES
- Publication number 20180242455
- Publication date Aug 23, 2018
- SKYWORKS SOLUTIONS, INC.
- Mark A. KUHLMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20180165495
- Publication date Jun 14, 2018
- Fingerprint Cards AB
- Martin GRIP
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED RF FRONT END SYSTEM
- Publication number 20180130876
- Publication date May 10, 2018
- SKYWORKS SOLUTIONS, INC.
- Michael Joseph McPartlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED LIGHTING APPARATUS
- Publication number 20180119890
- Publication date May 3, 2018
- Rohm Co., Ltd.
- Tomoharu Horio
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180096908
- Publication date Apr 5, 2018
- ROHM CO., LTD.
- Kensuke MIKADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE
- Publication number 20180076188
- Publication date Mar 15, 2018
- VALLEY DEVICE MANAGEMENT
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20180068972
- Publication date Mar 8, 2018
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS

the other connecting portion not on the bonding area being a ball bond

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Memory device comprising programmable command-and-address and/or da...

Circular bond finger pad

Stacked microfeature devices and associated methods

Semiconductor light-emitting device

Memory device comprising programmable command-and-address and/or da...

Semiconductor device

Inverted leads for packaged isolation devices

Semiconductor device and method for manufacturing the same

Wire bonding between isolation capacitors for multichip modules

Stacked microfeature devices and associated methods

Light emitting device and method of manufacturing the light emittin...

Memory device comprising programmable command-and-address and/or da...

Plurality of lead frames electrically connected to inductor chip

Receiver optical module and process of assembling the same

Multi-chip modules including stacked semiconductor dice

Scribe seals and methods of making

LED lighting apparatus

Semiconductor device

Production of optoelectronic components

Compact wirebonding in stacked-chip system in package, and methods...

Integrated circuit chip packaging including a heat sink topped cavity

Semiconductor integrated circuit device

Memory device comprising programmable command-and-address and/or da...

Receiver optical module and process of assembling the same

Electronic unit

Microelectronic package including microelectronic elements having s...

Sensor package structure

Bonding wire having a silver alloy core, wire bonding method using...

LED lighting apparatus

Patents Applicationslast 30 patents

WIRE BONDS FOR GALVANIC ISOLATION DEVICE

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR P...

IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

CIRCULAR BOND FINGER PAD

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

SEMICONDUCTOR DEVICE

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

RECEIVER OPTICAL MODULE AND PROCESS OF ASSEMBLING THE SAME

INTEGRATED CIRCUIT CHIP PACKAGING

INTEGRATED CIRCUIT CHIP PACKAGING

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

WIRE BONDING BETWEEN ISOLATION CAPACITORS FOR MULTICHIP MODULES

INTEGRATED RF FRONT END SYSTEM

MEMORY DEVICE COMPRISING PROGRAMMABLE COMMAND-AND-ADDRESS AND/OR DA...

BIPOLAR TRANSISTOR ON HIGH-RESISTIVITY SUBSTRATE

Microelectronic Package Including Microelectronic Elements Having S...

LIGHT EMITTING DEVICE

STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS

3-D STACKING OF ACTIVE DEVICES OVER PASSIVE DEVICES

ELECTRONIC DEVICE

INTEGRATED RF FRONT END SYSTEM

LED LIGHTING APPARATUS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR