the other leads being perpendicular to the base

Industry

CPC
H01L23/049

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/049the other leads being perpendicular to the base

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module arrangement
- Patent number 11,942,452
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Christian Robert Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer chips and enclosures for quantum circuits
- Patent number 11,908,756
- Issue date Feb 20, 2024
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,887,902
- Issue date Jan 30, 2024
- Fuji Electric Co., Ltd.
- Satoshi Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrally bonded semiconductor device and power converter includin...
- Patent number 11,887,904
- Issue date Jan 30, 2024
- Mitsubishi Electric Corporation
- Daisuke Oya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed housing with a semiconductor component and meth...
- Patent number 11,876,007
- Issue date Jan 16, 2024
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of housing for semiconductor device
- Patent number 11,806,903
- Issue date Nov 7, 2023
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 11,784,156
- Issue date Oct 10, 2023
- Mitsubishi Electric Corporation
- Takuya Kitabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compartment shielding with metal frame and cap
- Patent number 11,776,861
- Issue date Oct 3, 2023
- STATS ChipPAC Pte. Ltd.
- Bokyeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,776,936
- Issue date Oct 3, 2023
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device including press-fit connection terminal
- Patent number 11,742,251
- Issue date Aug 29, 2023
- Mitsubishi Electric Corporation
- Hidetoshi Ishibashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,710,671
- Issue date Jul 25, 2023
- Mitsubishi Electric Corporation
- Ryo Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,705,438
- Issue date Jul 18, 2023
- Kabushiki Kaisha Toshiba
- Tatsuya Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 11,631,622
- Issue date Apr 18, 2023
- Fuji Electric Co., Ltd.
- Makoto Isozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,626,333
- Issue date Apr 11, 2023
- Fuji Electric Co., Ltd.
- Nobuhiro Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and manufacturing method of semiconductor a...
- Patent number 11,605,568
- Issue date Mar 14, 2023
- Mitsubishi Electric Corporation
- Takuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,600,541
- Issue date Mar 7, 2023
- Fuji Electric Co., Ltd.
- Yoshinori Uezato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package, method for forming a package, carrier tape, chip card and...
- Patent number 11,594,481
- Issue date Feb 28, 2023
- Infineon Technologies AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module arrangement
- Patent number 11,538,725
- Issue date Dec 27, 2022
- Infineon Technologies AG
- Daniel Domes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,532,590
- Issue date Dec 20, 2022
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and power conversion apparatus
- Patent number 11,476,170
- Issue date Oct 18, 2022
- Mitsubishi Electric Corporation
- Yusuke Kaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module arrangement with fast switching, reduced losse...
- Patent number 11,398,768
- Issue date Jul 26, 2022
- Infineon Technologies AG
- Michael Schlueter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component housing package, electronic apparatus, and ele...
- Patent number 11,394,362
- Issue date Jul 19, 2022
- Kyocera Corporation
- Takuo Kisaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,393,733
- Issue date Jul 19, 2022
- Sumitomo Electric Industries, Ltd.
- Tatsushi Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stem for semiconductor package
- Patent number 11,373,961
- Issue date Jun 28, 2022
- Shinko Electric Industries Co., Ltd.
- Wataru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicle power conversion device
- Patent number 11,348,850
- Issue date May 31, 2022
- Mitsubishi Electric Corporation
- Hirokazu Takabayashi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Case with a plurality of pair case components for a semiconductor d...
- Patent number 11,348,851
- Issue date May 31, 2022
- Mitsubishi Electric Corporation
- Yasutaka Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetically sealed housing with a semiconductor component and meth...
- Patent number 11,289,353
- Issue date Mar 29, 2022
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 11,233,037
- Issue date Jan 25, 2022
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package having a cover with window
- Patent number 11,201,095
- Issue date Dec 14, 2021
- Xilinx, Inc.
- Ronilo Boja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, intelligent power module and power conversion...
- Patent number 11,114,836
- Issue date Sep 7, 2021
- Mitsubishi Electric Corporation
- Rei Yoneyama
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411229
- Publication date Dec 21, 2023
- Fuji Electric Co., Ltd.
- Yuko NAKAMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230402432
- Publication date Dec 14, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compartment Shielding With Metal Frame and Cap
- Publication number 20230402332
- Publication date Dec 14, 2023
- STATS ChipPAC Pte Ltd.
- Bokyeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR DETERMINING DETERIORATION OF SE...
- Publication number 20230369142
- Publication date Nov 16, 2023
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...
- Publication number 20230369175
- Publication date Nov 16, 2023
- INFINEON TECHNOLOGIES AG
- Arthur Unrau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE, SYSTEM INCLUDING A POWER SEMICONDUCTOR...
- Publication number 20230317560
- Publication date Oct 5, 2023
- INFINEON TECHNOLOGIES AG
- Andre Uhlemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20230317534
- Publication date Oct 5, 2023
- Sumitomo Electric Industries, Ltd.
- Masaki TANIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERTER, AND MOVING VEHICLE
- Publication number 20230268239
- Publication date Aug 24, 2023
- Mitsubishi Electric Corporation
- Yoichi HIRONAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND VEHICLE
- Publication number 20230260951
- Publication date Aug 17, 2023
- Fuji Electric Co., Ltd.
- Hitoshi NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, BUSBAR, AND POWER CONVERTER
- Publication number 20230231487
- Publication date Jul 20, 2023
- Hitachi Astemo, Ltd.
- Junpei KUSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20230197691
- Publication date Jun 22, 2023
- Mitsubishi Electric Corporation
- Ren KUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER CHIPS AND ENCLOSURES FOR QUANTUM CIRCUITS
- Publication number 20230197539
- Publication date Jun 22, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR CHIP
- Publication number 20230188074
- Publication date Jun 15, 2023
- Fuji Electric Co., Ltd.
- Ryu ARAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20230146272
- Publication date May 11, 2023
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230140664
- Publication date May 4, 2023
- Mitsubishi Electric Corporation
- Yusuke KAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230098854
- Publication date Mar 30, 2023
- Fuji Electric Co., Ltd.
- Akira ISO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230092403
- Publication date Mar 23, 2023
- Kabushiki Kaisha Toshiba
- Hisashi TOMITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compartment Shielding With Metal Frame and Cap
- Publication number 20230071960
- Publication date Mar 9, 2023
- STATS ChipPAC Pte Ltd.
- Bokyeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230058727
- Publication date Feb 23, 2023
- Fuji Electric Co., Ltd.
- Yuko NAKAMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20220415729
- Publication date Dec 29, 2022
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES
- Publication number 20220359342
- Publication date Nov 10, 2022
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Markus Lasch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220301955
- Publication date Sep 22, 2022
- Fuji Electric Co., Ltd.
- Satoshi KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20220302075
- Publication date Sep 22, 2022
- Hitachi Power Semiconductor Device, Ltd.
- Toru Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE AND MOVING BODY
- Publication number 20220238459
- Publication date Jul 28, 2022
- Mitsubishi Electric Corporation
- Yukimasa HAYASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20220230929
- Publication date Jul 21, 2022
- Mitsubishi Electric Corporation
- Ryo Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTER
- Publication number 20220223546
- Publication date Jul 14, 2022
- Mitsubishi Electric Corporation
- Yusuke KAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETICALLY SEALED HOUSING WITH A SEMICONDUCTOR COMPONENT AND METH...
- Publication number 20220172971
- Publication date Jun 2, 2022
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTER
- Publication number 20220165631
- Publication date May 26, 2022
- Mitsubishi Electric Corporation
- Daisuke OYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR A...
- Publication number 20220157672
- Publication date May 19, 2022
- Mitsubishi Electric Corporation
- Takuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF HOUSING FOR SEMICONDUCTOR DEVICE
- Publication number 20220134616
- Publication date May 5, 2022
- Mitsubishi Electric Corporation
- Hiroyuki MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS

the other leads being perpendicular to the base

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module arrangement

Interposer chips and enclosures for quantum circuits

Semiconductor device

Integrally bonded semiconductor device and power converter includin...

Hermetically sealed housing with a semiconductor component and meth...

Manufacturing method of housing for semiconductor device

Semiconductor device

Compartment shielding with metal frame and cap

Semiconductor device

Power semiconductor device including press-fit connection terminal

Semiconductor module

Semiconductor device

Semiconductor device and semiconductor device manufacturing method

Semiconductor device

Semiconductor apparatus and manufacturing method of semiconductor a...

Semiconductor module

Package, method for forming a package, carrier tape, chip card and...

Semiconductor module arrangement

Semiconductor device and method for manufacturing semiconductor device

Power semiconductor module and power conversion apparatus

Semiconductor module arrangement with fast switching, reduced losse...

Electronic component housing package, electronic apparatus, and ele...

Semiconductor device

Stem for semiconductor package

Vehicle power conversion device

Case with a plurality of pair case components for a semiconductor d...

Hermetically sealed housing with a semiconductor component and meth...

Semiconductor device

Chip package having a cover with window

Semiconductor device, intelligent power module and power conversion...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Compartment Shielding With Metal Frame and Cap

SEMICONDUCTOR DEVICE AND METHOD FOR DETERMINING DETERIORATION OF SE...

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...

POWER SEMICONDUCTOR MODULE, SYSTEM INCLUDING A POWER SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, POWER CONVERTER, AND MOVING VEHICLE

SEMICONDUCTOR APPARATUS AND VEHICLE

SEMICONDUCTOR DEVICE, BUSBAR, AND POWER CONVERTER

SEMICONDUCTOR POWER MODULE AND POWER CONVERSION APPARATUS

INTERPOSER CHIPS AND ENCLOSURES FOR QUANTUM CIRCUITS

SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR CHIP

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Compartment Shielding With Metal Frame and Cap

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE AND MOVING BODY

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND POWER CONVERTER

HERMETICALLY SEALED HOUSING WITH A SEMICONDUCTOR COMPONENT AND METH...

SEMICONDUCTOR DEVICE AND POWER CONVERTER

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR A...

MANUFACTURING METHOD OF HOUSING FOR SEMICONDUCTOR DEVICE