the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

Industry

CPC
H01L2224/29117

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29117the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Load sensing devices, packages, and systems
- Patent number 10,910,500
- Issue date Feb 2, 2021
- STMicroelectronics S.r.l.
- Mohammad Abbasi Gavarti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joining
- Patent number 10,504,868
- Issue date Dec 10, 2019
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy and bonded structure using the same
- Patent number 10,493,567
- Issue date Dec 3, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuki Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer bonding methods and wafer-bonded structures
- Patent number 10,446,519
- Issue date Oct 15, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jin Guang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low temperature high reliability alloy for solder hierarchy
- Patent number 10,322,471
- Issue date Jun 18, 2019
- Alpha Assembly Solutions Inc.
- Pritha Choudhury
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power-module substrate unit and power module
- Patent number 10,068,829
- Issue date Sep 4, 2018
- Mitsubishi Materials Corporation
- Sotaro Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for eutectic bonding
- Patent number 9,935,077
- Issue date Apr 3, 2018
- Robert Bosch GmbH
- Ralf Hausner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 9,627,349
- Issue date Apr 18, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
- Patent number 9,589,860
- Issue date Mar 7, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package systems
- Patent number 9,355,896
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package systems and manufacturing methods thereof
- Patent number 9,112,001
- Issue date Aug 18, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor composite apparatus, method for manufacturing the sem...
- Patent number 9,093,562
- Issue date Jul 28, 2015
- Oki Data Corporation
- Mitsuhiko Ogihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for manufacturing a component having an electrical through-c...
- Patent number 9,034,757
- Issue date May 19, 2015
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package systems having an opening in a substrate thereof and manufa...
- Patent number 9,000,578
- Issue date Apr 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding layer structure and method for wafer to wafer bonding
- Patent number 8,686,571
- Issue date Apr 1, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Ting Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package systems having a eutectic bonding material and manufacturin...
- Patent number 8,674,495
- Issue date Mar 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical method and corresponding assembly for bonding semic...
- Patent number 8,638,000
- Issue date Jan 28, 2014
- Robert Bosch GmbH
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,592,926
- Issue date Nov 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure for wafer to wafer bonding in semiconductor pa...
- Patent number 8,377,798
- Issue date Feb 19, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,058,143
- Issue date Nov 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for the laminar joining of silicon semiconductor slices
- Patent number 5,693,574
- Issue date Dec 2, 1997
- Deutsche Aerospace AG
- Gunther Schuster
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240063074
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230298975
- Publication date Sep 21, 2023
- Kabushiki Kaisha Toshiba
- Satoru Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20230115598
- Publication date Apr 13, 2023
- Fuji Electric Co., Ltd.
- Yoshiaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOAD SENSING DEVICES, PACKAGES, AND SYSTEMS
- Publication number 20190252556
- Publication date Aug 15, 2019
- STMicroelectronics S.r.l
- Mohammad Abbasi Gavarti
- G01 - MEASURING TESTING
Information Patent Application
SOLDER ALLOY AND BONDED STRUCTURE USING THE SAME
- Publication number 20180326542
- Publication date Nov 15, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- KAZUKI SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER BONDING METHODS AND WAFER-BONDED STRUCTURES
- Publication number 20180269178
- Publication date Sep 20, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jin Guang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A BONDING LAYER
- Publication number 20160190092
- Publication date Jun 30, 2016
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF
- Publication number 20140170849
- Publication date Jun 19, 2014
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Chia-Pao SHU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING LAYER STRUCTURE AND METHOD FOR WAFER TO WAFER BONDING
- Publication number 20140042625
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Ting Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A COMPONENT HAVING AN ELECTRICAL THROUGH-C...
- Publication number 20140027927
- Publication date Jan 30, 2014
- ROBERT BOSCH GmbH
- Jochen REINMUTH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATE AND MEMS DEVICE
- Publication number 20120299128
- Publication date Nov 29, 2012
- PIONEER MICRO TECHNOLOGY CORPORATION
- Naoki Noda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Micromechanical Method and Corresponding Assembly for Bonding Semic...
- Publication number 20120280409
- Publication date Nov 8, 2012
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PA...
- Publication number 20120115305
- Publication date May 10, 2012
- Taiwan Semiconductor Manufacturing Co., LTD
- Jung-Huei PENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF
- Publication number 20120086126
- Publication date Apr 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao SHU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF
- Publication number 20120086127
- Publication date Apr 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao SHU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20120068325
- Publication date Mar 22, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor composite apparatus, method for manufacturing the sem...
- Publication number 20110081738
- Publication date Apr 7, 2011
- Oki Data Corporation
- Mitsuhiko Ogihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20100181676
- Publication date Jul 22, 2010
- RUBEN B. MONTEZ
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Assembling Two Substrates by Molecular Adhesion, One of the Two Sup...
- Publication number 20080041517
- Publication date Feb 21, 2008
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Hubert Moriceau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor composite apparatus, method for manufacturing the sem...
- Publication number 20060097354
- Publication date May 11, 2006
- Mitsuhiko Ogihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and apparatus for creating a bond between objects based on f...

Load sensing devices, packages, and systems

Solder joining

Solder alloy and bonded structure using the same

Wafer bonding methods and wafer-bonded structures

Method for applying a bonding layer

Low temperature high reliability alloy for solder hierarchy

Power-module substrate unit and power module

Apparatus for eutectic bonding

Electronic devices with semiconductor die attached with sintered me...

Method for applying a bonding layer

Electronic devices with semiconductor die coupled to a thermally co...

Package systems

Package systems and manufacturing methods thereof

Semiconductor composite apparatus, method for manufacturing the sem...

Method for manufacturing a component having an electrical through-c...

Package systems having an opening in a substrate thereof and manufa...

Bonding layer structure and method for wafer to wafer bonding

Package systems having a eutectic bonding material and manufacturin...

Micromechanical method and corresponding assembly for bonding semic...

Substrate bonding with metal germanium silicon material

Method and structure for wafer to wafer bonding in semiconductor pa...

Substrate bonding with metal germanium silicon material

Process for the laminar joining of silicon semiconductor slices

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

LOAD SENSING DEVICES, PACKAGES, AND SYSTEMS

SOLDER ALLOY AND BONDED STRUCTURE USING THE SAME

WAFER BONDING METHODS AND WAFER-BONDED STRUCTURES

METHOD FOR APPLYING A BONDING LAYER

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

BONDING LAYER STRUCTURE AND METHOD FOR WAFER TO WAFER BONDING

METHOD FOR MANUFACTURING A COMPONENT HAVING AN ELECTRICAL THROUGH-C...

METHOD OF BONDING SEMICONDUCTOR SUBSTRATE AND MEMS DEVICE

Micromechanical Method and Corresponding Assembly for Bonding Semic...

METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PA...

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

Semiconductor composite apparatus, method for manufacturing the sem...

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

Assembling Two Substrates by Molecular Adhesion, One of the Two Sup...

Semiconductor composite apparatus, method for manufacturing the sem...