the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29117the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

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the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and apparatus for creating a bond between objects based on f...

Load sensing devices, packages, and systems

Solder joining

Solder alloy and bonded structure using the same

Wafer bonding methods and wafer-bonded structures

Method for applying a bonding layer

Low temperature high reliability alloy for solder hierarchy

Power-module substrate unit and power module

Apparatus for eutectic bonding

Electronic devices with semiconductor die attached with sintered me...

Method for applying a bonding layer

Electronic devices with semiconductor die coupled to a thermally co...

Package systems

Package systems and manufacturing methods thereof

Semiconductor composite apparatus, method for manufacturing the sem...

Method for manufacturing a component having an electrical through-c...

Package systems having an opening in a substrate thereof and manufa...

Bonding layer structure and method for wafer to wafer bonding

Package systems having a eutectic bonding material and manufacturin...

Micromechanical method and corresponding assembly for bonding semic...

Substrate bonding with metal germanium silicon material

Method and structure for wafer to wafer bonding in semiconductor pa...

Substrate bonding with metal germanium silicon material

Process for the laminar joining of silicon semiconductor slices

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

LOAD SENSING DEVICES, PACKAGES, AND SYSTEMS

SOLDER ALLOY AND BONDED STRUCTURE USING THE SAME

WAFER BONDING METHODS AND WAFER-BONDED STRUCTURES

METHOD FOR APPLYING A BONDING LAYER

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

BONDING LAYER STRUCTURE AND METHOD FOR WAFER TO WAFER BONDING

METHOD FOR MANUFACTURING A COMPONENT HAVING AN ELECTRICAL THROUGH-C...

METHOD OF BONDING SEMICONDUCTOR SUBSTRATE AND MEMS DEVICE

Micromechanical Method and Corresponding Assembly for Bonding Semic...

METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PA...

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

Semiconductor composite apparatus, method for manufacturing the sem...

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

Assembling Two Substrates by Molecular Adhesion, One of the Two Sup...

Semiconductor composite apparatus, method for manufacturing the sem...