the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

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H01L2224/45117

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45117the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

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Patents Grantslast 30 patents

Information Patent Grant
Palladium-coated copper bonding wire and method for manufacturing same
- Patent number 12,087,724
- Issue date Sep 10, 2024
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,929,343
- Issue date Mar 12, 2024
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag alloy bonding wire for semiconductor device
- Patent number 11,612,966
- Issue date Mar 28, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silver bonding wire for semiconductor device containing indium, gal...
- Patent number 10,381,320
- Issue date Aug 13, 2019
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 7,723,753
- Issue date May 25, 2010
- Renesas Technology Corp.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures and methods for making same
- Patent number 7,082,682
- Issue date Aug 1, 2006
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component of a high frequency current suppression type a...
- Patent number 6,903,440
- Issue date Jun 7, 2005
- NEC Tokin Corp.
- Shigeyoshi Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing raised electrical contact pattern of contr...
- Patent number 6,818,840
- Issue date Nov 16, 2004
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compound semiconductor device
- Patent number 6,727,559
- Issue date Apr 27, 2004
- Sanyo Electric Co., LTD
- Tetsuro Asano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component of a high frequency current suppression type a...
- Patent number 6,635,961
- Issue date Oct 21, 2003
- NEC Tokin Corp.
- Shigeyoshi Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing raised electrical contact pattern of contr...
- Patent number 6,538,214
- Issue date Mar 25, 2003
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly comprising a substrate and a plurality of sprin...
- Patent number 6,252,175
- Issue date Jun 26, 2001
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing raised electrical contact pattern of contr...
- Patent number 6,215,670
- Issue date Apr 10, 2001
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting free-standing resilient electrical contact struc...
- Patent number 6,049,976
- Issue date Apr 18, 2000
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making raised contacts on electronic components
- Patent number 5,852,871
- Issue date Dec 29, 1998
- Form Factor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electrical contacts, using a sacrificial me...
- Patent number 5,476,211
- Issue date Dec 19, 1995
- Form Factor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230387066
- Publication date Nov 30, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230245995
- Publication date Aug 3, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20220266396
- Publication date Aug 25, 2022
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya OYAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20210280553
- Publication date Sep 9, 2021
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170110430
- Publication date Apr 20, 2017
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Tetsuya OYAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20080224174
- Publication date Sep 18, 2008
- Kenji SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structures Comprising A Core Structure And An Overcoat
- Publication number 20060286828
- Publication date Dec 21, 2006
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Contact structures and methods for making same
- Publication number 20050028363
- Publication date Feb 10, 2005
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component of a high frequency current suppression type a...
- Publication number 20040188833
- Publication date Sep 30, 2004
- Shigeyoshi Yoshida
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for manufacturing raised electrical contact pattern of contr...
- Publication number 20030062398
- Publication date Apr 3, 2003
- FormFactor, Inc.
- Igor Y. Khandros
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Compound semiconductor device
- Publication number 20030013276
- Publication date Jan 16, 2003
- Sanyo Electric Co., Ltd.
- Tetsuro Asano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing raised electrical contact patten of contro...
- Publication number 20020023773
- Publication date Feb 28, 2002
- FormFactor, Inc.
- Igor Yan Khandros
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electronic component of a high frequency current suppression type a...
- Publication number 20010026016
- Publication date Oct 4, 2001
- Shigeyoshi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS

the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Palladium-coated copper bonding wire and method for manufacturing same

Bonding wire for semiconductor devices

Ag alloy bonding wire for semiconductor device

Silver bonding wire for semiconductor device containing indium, gal...

Semiconductor device and manufacturing method of the same

Contact structures and methods for making same

Electronic component of a high frequency current suppression type a...

Method for manufacturing raised electrical contact pattern of contr...

Compound semiconductor device

Electronic component of a high frequency current suppression type a...

Method for manufacturing raised electrical contact pattern of contr...

Electronic assembly comprising a substrate and a plurality of sprin...

Method for manufacturing raised electrical contact pattern of contr...

Method of mounting free-standing resilient electrical contact struc...

Method of making raised contacts on electronic components

Method of manufacturing electrical contacts, using a sacrificial me...

Patents Applicationslast 30 patents

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE

PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME

BONDING WIRE FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Contact Structures Comprising A Core Structure And An Overcoat

Contact structures and methods for making same

Electronic component of a high frequency current suppression type a...

Method for manufacturing raised electrical contact pattern of contr...

Compound semiconductor device

Method for manufacturing raised electrical contact patten of contro...

Electronic component of a high frequency current suppression type a...