the principal metal being a noble metal

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/53242the principal metal being a noble metal

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Patents Grantslast 30 patents

Information Patent Grant
Methods of performing selective low resistivity Ru atomic layer dep...
- Patent number 12,154,787
- Issue date Nov 26, 2024
- The Regents of the University of California
- Michael Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell in wafer backside
- Patent number 12,148,682
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Biswanath Senapati
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of fabricating pedestal based memory devices using pocket in...
- Patent number 12,142,310
- Issue date Nov 12, 2024
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase structure for memory device
- Patent number 12,137,558
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with a contact to source/drain layers and f...
- Patent number 12,131,990
- Issue date Oct 29, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon buried power rail implemented backside power distri...
- Patent number 12,125,788
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pocket integration process for embedded memory
- Patent number 12,069,866
- Issue date Aug 20, 2024
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for barrier-less plug
- Patent number 12,051,592
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer feature fill
- Patent number 12,014,928
- Issue date Jun 18, 2024
- Lam Research Corporation
- Xiaolan Ba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,009,305
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase structure for memory device
- Patent number 12,010,838
- Issue date Jun 11, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device
- Patent number 12,002,867
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase formation in three-dimensional memory device
- Patent number 11,997,851
- Issue date May 28, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xiang Hui Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method for manufacturing of a semicondu...
- Patent number 11,990,394
- Issue date May 21, 2024
- Nexperia B.V.
- Kim Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for making the same
- Patent number 11,990,416
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsinhsiang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated substrate structure, redistribution structure, and manuf...
- Patent number 11,984,403
- Issue date May 14, 2024
- Dyi-Chung Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic devices with slit structures including metal plugs...
- Patent number 11,985,823
- Issue date May 14, 2024
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including a via and methods of forming t...
- Patent number 11,978,668
- Issue date May 7, 2024
- Samsung Electronics Co., Ltd.
- Ming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and heat dissipation structure thereof, comprisi...
- Patent number 11,955,404
- Issue date Apr 9, 2024
- AURAS TECHNOLOGY CO., LTD.
- Jian-Dih Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pedestal-based pocket integration process for embedded memory
- Patent number 11,942,133
- Issue date Mar 26, 2024
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching platinum-containing thin film using protective cap layer
- Patent number 11,929,423
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Sebastian Meier
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Semiconductor device, solid-state image pickup element, image picku...
- Patent number 11,923,395
- Issue date Mar 5, 2024
- Sony Group Corporation
- Yoshiaki Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for routing local interconnect structure at same level as re...
- Patent number 11,916,077
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat metal features for microelectronics applications
- Patent number 11,908,739
- Issue date Feb 20, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having electrode pads arranged between groups...
- Patent number 11,901,251
- Issue date Feb 13, 2024
- Rohm Co., Ltd.
- Kunihiro Komiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having an oxygen free platinum group metal film
- Patent number 11,894,233
- Issue date Feb 6, 2024
- Applied Materials, Inc.
- Yixiong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Through silicon buried power rail implemented backside power distri...
- Patent number 11,881,455
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 11,881,432
- Issue date Jan 23, 2024
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts having a geometry to reduce resistance
- Patent number 11,875,987
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240413080
- Publication date Dec 12, 2024
- Fuji Electric Co., Ltd.
- Naoyuki OHSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...
- Publication number 20240395606
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via Structures
- Publication number 20240379546
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR BARRIER-LESS PLUG
- Publication number 20240347342
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240321750
- Publication date Sep 26, 2024
- Mitsubishi Electric Corporation
- Ryuji UENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240321751
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STITCHED GUARD RINGS WITH OVERLAY ERROR RESILIENCY
- Publication number 20240321660
- Publication date Sep 26, 2024
- Intel Corporation
- Shakul Tandon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER AMPLIFIER INCLUDING THE SAME
- Publication number 20240312932
- Publication date Sep 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Suyeon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED ELECTRONIC...
- Publication number 20240292623
- Publication date Aug 29, 2024
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER FEATURE FILL
- Publication number 20240282580
- Publication date Aug 22, 2024
- LAM RESEARCH CORPORATION
- Xiaolan BA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20240274687
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hung CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240234228
- Publication date Jul 11, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING PLATINUM-CONTAINING THIN FILM USING PROTECTIVE CAP LAYER
- Publication number 20240222470
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING INTEGRATED SUBSTRATE STRUCTURE
- Publication number 20240222277
- Publication date Jul 4, 2024
- Dyi-Chung HU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOCAL INTERCONNECT STRUCTURE
- Publication number 20240194682
- Publication date Jun 13, 2024
- Tiawan Semiconductor Manufacturing Co., Ltd.
- Chih-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240136241
- Publication date Apr 25, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20240112952
- Publication date Apr 4, 2024
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20240105598
- Publication date Mar 28, 2024
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DEVICE WITH HYBRID METAL LAYER
- Publication number 20240096785
- Publication date Mar 21, 2024
- Intel Corporation
- June Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC CAPS FOR POWER AND SIGNAL LINE ROUTING
- Publication number 20240071929
- Publication date Feb 29, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND METHOD FOR TREATING SUBSTRATE
- Publication number 20240002725
- Publication date Jan 4, 2024
- FUJIFILM CORPORATION
- Moe NARITA
- B08 - CLEANING
Information Patent Application
TWO-DIMENSIONAL PMOS DEVICES FOR PROVIDING CMOS IN BACK-END LAYERS...
- Publication number 20230411390
- Publication date Dec 21, 2023
- Intel Corporation
- Kevin P. O'Brien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH CONTACTS EXTENDING THROUGH METAL OXIDE...
- Publication number 20230395510
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Mithun Kumar Ramasahayam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liner-Free Conductive Structures With Anchor Points
- Publication number 20230387017
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...
- Publication number 20230369103
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20230361072
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUITS WITH NARROW WIDTH INTERCONNECTS AND REDUCED RC...
- Publication number 20230317605
- Publication date Oct 5, 2023
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WORKING ELECTRODE FOR BIOSENSOR INCLUDING...
- Publication number 20230296552
- Publication date Sep 21, 2023
- Korea Electronics Technology Institute
- Seong Eun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20230282583
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREFOR
- Publication number 20230276617
- Publication date Aug 31, 2023
- Changxin Memory Technologies, Inc.
- Shuai GUO
- H01 - BASIC ELECTRIC ELEMENTS

the principal metal being a noble metal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of performing selective low resistivity Ru atomic layer dep...

Memory cell in wafer backside

Method of fabricating pedestal based memory devices using pocket in...

Staircase structure for memory device

Semiconductor structure with a contact to source/drain layers and f...

Through silicon buried power rail implemented backside power distri...

Bonded structures

Pocket integration process for embedded memory

Method and structure for barrier-less plug

Multi-layer feature fill

Semiconductor device and method for forming the same

Staircase structure for memory device

Contact structure for semiconductor device

Staircase formation in three-dimensional memory device

Semiconductor package and a method for manufacturing of a semicondu...

Semiconductor device and method for making the same

Integrated substrate structure, redistribution structure, and manuf...

Microelectronic devices with slit structures including metal plugs...

Integrated circuit devices including a via and methods of forming t...

Electronic package and heat dissipation structure thereof, comprisi...

Pedestal-based pocket integration process for embedded memory

Etching platinum-containing thin film using protective cap layer

Semiconductor device, solid-state image pickup element, image picku...

Method for routing local interconnect structure at same level as re...

Flat metal features for microelectronics applications

Semiconductor device having electrode pads arranged between groups...

Electronic device having an oxygen free platinum group metal film

Through silicon buried power rail implemented backside power distri...

Interconnect wires including relatively low resistivity cores

Contacts having a geometry to reduce resistance

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...

Via Structures

METHOD AND STRUCTURE FOR BARRIER-LESS PLUG

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

STITCHED GUARD RINGS WITH OVERLAY ERROR RESILIENCY

SEMICONDUCTOR DEVICE AND POWER AMPLIFIER INCLUDING THE SAME

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED ELECTRONIC...

MULTI-LAYER FEATURE FILL

CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

ETCHING PLATINUM-CONTAINING THIN FILM USING PROTECTIVE CAP LAYER

METHOD FOR MANUFACTURING INTEGRATED SUBSTRATE STRUCTURE

LOCAL INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...

INTEGRATED CIRCUIT (IC) DEVICE WITH HYBRID METAL LAYER

DIELECTRIC CAPS FOR POWER AND SIGNAL LINE ROUTING

COMPOSITION AND METHOD FOR TREATING SUBSTRATE

TWO-DIMENSIONAL PMOS DEVICES FOR PROVIDING CMOS IN BACK-END LAYERS...

MICROELECTRONIC DEVICES WITH CONTACTS EXTENDING THROUGH METAL OXIDE...

Liner-Free Conductive Structures With Anchor Points

SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...

BONDED STRUCTURES

INTEGRATED CIRCUITS WITH NARROW WIDTH INTERCONNECTS AND REDUCED RC...

METHOD FOR MANUFACTURING WORKING ELECTRODE FOR BIOSENSOR INCLUDING...

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREFOR