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H01L23/53242
the principal metal being a noble metal
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last 30 patents
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Patent Grant
Electronic package and heat dissipation structure thereof, comprisi...
Patent number
11,955,404
Issue date
Apr 9, 2024
AURAS TECHNOLOGY CO., LTD.
Jian-Dih Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pedestal-based pocket integration process for embedded memory
Patent number
11,942,133
Issue date
Mar 26, 2024
Kepler Computing Inc.
Noriyuki Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Etching platinum-containing thin film using protective cap layer
Patent number
11,929,423
Issue date
Mar 12, 2024
Texas Instruments Incorporated
Sebastian Meier
C01 - INORGANIC CHEMISTRY
Information
Patent Grant
Semiconductor device, solid-state image pickup element, image picku...
Patent number
11,923,395
Issue date
Mar 5, 2024
Sony Group Corporation
Yoshiaki Masuda
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for routing local interconnect structure at same level as re...
Patent number
11,916,077
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Liang Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Flat metal features for microelectronics applications
Patent number
11,908,739
Issue date
Feb 20, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device having electrode pads arranged between groups...
Patent number
11,901,251
Issue date
Feb 13, 2024
Rohm Co., Ltd.
Kunihiro Komiya
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Electronic device having an oxygen free platinum group metal film
Patent number
11,894,233
Issue date
Feb 6, 2024
Applied Materials, Inc.
Yixiong Yang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Through silicon buried power rail implemented backside power distri...
Patent number
11,881,455
Issue date
Jan 23, 2024
Samsung Electronics Co., Ltd.
Saehan Park
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Interconnect wires including relatively low resistivity cores
Patent number
11,881,432
Issue date
Jan 23, 2024
Hui Jae Yoo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Contacts having a geometry to reduce resistance
Patent number
11,875,987
Issue date
Jan 16, 2024
International Business Machines Corporation
Lawrence A. Clevenger
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Ferroelectric memory devices
Patent number
11,871,583
Issue date
Jan 9, 2024
Kepler Computing Inc.
Noriyuki Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ferroelectric memory device integrated with a transition electrode
Patent number
11,854,593
Issue date
Dec 26, 2023
Kepler Computing Inc.
Noriyuki Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Liner-free conductive structures with anchor points
Patent number
11,837,544
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Hsu-Kai Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device structure and method for manufacturing the same
Patent number
11,837,595
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Data lines in three-dimensional memory devices
Patent number
11,830,767
Issue date
Nov 28, 2023
Micron Technology, Inc.
Yi Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-metal interconnects for semiconductor device structures
Patent number
11,817,389
Issue date
Nov 14, 2023
International Business Machines Corporation
Hsueh-Chung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with connecting structure having a doped layer...
Patent number
11,791,204
Issue date
Oct 17, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Kuo-Ju Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,764,131
Issue date
Sep 19, 2023
ABLIC Inc.
Koji Tsukagoshi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Methods and apparatus for processing a substrate
Patent number
11,749,532
Issue date
Sep 5, 2023
Applied Materials, Inc.
Hao Jiang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of forming metal interconnection
Patent number
11,715,689
Issue date
Aug 1, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Shin-Yi Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Spin on scaffold film for forming topvia
Patent number
11,688,636
Issue date
Jun 27, 2023
International Business Machines Corporation
Somnath Ghosh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Bonded structures
Patent number
11,670,615
Issue date
Jun 6, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Liang Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Patent Grant
Semiconductor element with electrode having first section and secon...
Patent number
11,658,093
Issue date
May 23, 2023
Rohm Co., Ltd.
Hirofumi Tanaka
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method for forming the same
Patent number
11,652,053
Issue date
May 16, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Kuo-Ju Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-level backside metallization (BSM)
Patent number
11,652,061
Issue date
May 16, 2023
Intel Corporation
Shenavia S. Howell
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
11,626,352
Issue date
Apr 11, 2023
Rohm Co., Ltd.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Structures and methods for reducing thermal expansion mismatch duri...
Patent number
11,621,235
Issue date
Apr 4, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Kuen-Shian Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High-efficiency packaged chip structure and electronic device inclu...
Patent number
11,588,036
Issue date
Feb 21, 2023
Vanguard International Semiconductor Corporation
Hsiu-Mei Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Interconnect wires including relatively low resistivity cores
Patent number
11,569,126
Issue date
Jan 31, 2023
Intel Corporation
Hui Jae Yoo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
Publication number
20240112952
Publication date
Apr 4, 2024
Intel Corporation
HUI JAE YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...
Publication number
20240105598
Publication date
Mar 28, 2024
Intel Corporation
Leonard P. GULER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT (IC) DEVICE WITH HYBRID METAL LAYER
Publication number
20240096785
Publication date
Mar 21, 2024
Intel Corporation
June Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIELECTRIC CAPS FOR POWER AND SIGNAL LINE ROUTING
Publication number
20240071929
Publication date
Feb 29, 2024
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITION AND METHOD FOR TREATING SUBSTRATE
Publication number
20240002725
Publication date
Jan 4, 2024
FUJIFILM CORPORATION
Moe NARITA
B08 - CLEANING
Information
Patent Application
TWO-DIMENSIONAL PMOS DEVICES FOR PROVIDING CMOS IN BACK-END LAYERS...
Publication number
20230411390
Publication date
Dec 21, 2023
Intel Corporation
Kevin P. O'Brien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES WITH CONTACTS EXTENDING THROUGH METAL OXIDE...
Publication number
20230395510
Publication date
Dec 7, 2023
Micron Technology, Inc.
Mithun Kumar Ramasahayam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Liner-Free Conductive Structures With Anchor Points
Publication number
20230387017
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsu-Kai Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...
Publication number
20230369103
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Kuo-Ju Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED STRUCTURES
Publication number
20230361072
Publication date
Nov 9, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Liang Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
INTEGRATED CIRCUITS WITH NARROW WIDTH INTERCONNECTS AND REDUCED RC...
Publication number
20230317605
Publication date
Oct 5, 2023
Intel Corporation
Abhishek Anil Sharma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING WORKING ELECTRODE FOR BIOSENSOR INCLUDING...
Publication number
20230296552
Publication date
Sep 21, 2023
Korea Electronics Technology Institute
Seong Eun KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
Publication number
20230282583
Publication date
Sep 7, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Kuo-Ju Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREFOR
Publication number
20230276617
Publication date
Aug 31, 2023
Changxin Memory Technologies, Inc.
Shuai GUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
Publication number
20230238329
Publication date
Jul 27, 2023
Samsung Electronics Co., Ltd.
Keunwook SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURES AND METHODS FOR REDUCING THERMAL EXPANSION MISMATCH DURI...
Publication number
20230215820
Publication date
Jul 6, 2023
Taiwan Semiconductor Manufacturing Co., LTD
Kuen-Shian CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230207432
Publication date
Jun 29, 2023
ROHM CO., LTD.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY CELL IN WAFER BACKSIDE
Publication number
20230187314
Publication date
Jun 15, 2023
International Business Machines Corporation
Biswanath Senapati
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230178489
Publication date
Jun 8, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih-Ming CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method
Publication number
20230163075
Publication date
May 25, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Wan-Hsien Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH ASPECT RATIO VIA FILL PROCESS EMPLOYING SELECTIVE METAL DEPOSI...
Publication number
20230130849
Publication date
Apr 27, 2023
SANDISK TECHNOLOGIES LLC
Takashi YAMAHA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
Publication number
20230130273
Publication date
Apr 27, 2023
Intel Corporation
HUI JAE YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
Publication number
20230120515
Publication date
Apr 20, 2023
Shinko Electric Industries Co., Ltd.
Hikaru TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF ALIGNED QUADRUPLE PATTERNING INTERCONNECTS
Publication number
20230086420
Publication date
Mar 23, 2023
International Business Machines Corporation
Hsueh-Chung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STAIRCASE STRUCTURE FOR MEMORY DEVICE
Publication number
20230084008
Publication date
Mar 16, 2023
Yangtze Memory Technologies Co., Ltd.
Zhenyu LU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STAIRCASE STRUCTURE FOR MEMORY DEVICE
Publication number
20230083030
Publication date
Mar 16, 2023
Yangtze Memory Technologies Co., Ltd.
Zhenyu LU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A VIA AND METHODS OF FORMING T...
Publication number
20230074982
Publication date
Mar 9, 2023
Samsung Electronics Co., Ltd.
MING HE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FERROELECTRIC MEMORY DEVICES
Publication number
20230076825
Publication date
Mar 9, 2023
Kepler Computing, Inc.
Noriyuki Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE AND FLEXIBLE SANDWICH-STRUCTURED COMPOSITES
Publication number
20230077018
Publication date
Mar 9, 2023
Hongbin Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FERROELECTRIC MEMORY DEVICE INTEGRATED WITH A TRANSITION ELECTRODE
Publication number
20230073071
Publication date
Mar 9, 2023
Kepler Computing, Inc.
Noriyuki Sato
H01 - BASIC ELECTRIC ELEMENTS