the principal metal being a refractory metal

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/53257the principal metal being a refractory metal

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Patents Grantslast 30 patents

Information Patent Grant
Self-aligned metal gate for multigate device and method of forming...
- Patent number 12,322,653
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jia-Chuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including through substrate via barrier structure...
- Patent number 12,322,679
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching to reduce line wiggling
- Patent number 12,322,651
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact for thermal displacement in a multi-wafer stacked...
- Patent number 12,300,669
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with silicide portion between conduc...
- Patent number 12,288,748
- Issue date Apr 29, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase control in contact formation
- Patent number 12,288,716
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,283,557
- Issue date Apr 22, 2025
- United Microelectronics Corp.
- Aaron Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate contact structure over active gate and method to fabricate same
- Patent number 12,278,144
- Issue date Apr 15, 2025
- Intel Corporation
- Abhijit Jayant Pethe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including through substrate via barrier structure...
- Patent number 12,278,167
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature of a semiconductor device
- Patent number 12,272,598
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- U-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked FET sidewall strap connections between gates
- Patent number 12,274,089
- Issue date Apr 8, 2025
- International Business Machines Corporation
- Chen Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device to reduce signal loss in a transmission line
- Patent number 12,266,603
- Issue date Apr 1, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Pablo Jesús Gardella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 12,266,568
- Issue date Apr 1, 2025
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via patterning using metal as hard mask and via conductor
- Patent number 12,261,056
- Issue date Mar 25, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure having raised via...
- Patent number 12,243,826
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional vertical nor flash thin-film transistor strings
- Patent number 12,245,430
- Issue date Mar 4, 2025
- SUNRISE MEMORY CORPORATION
- Eli Harari
- G11 - INFORMATION STORAGE
Information Patent Grant
Word line structure of three-dimensional memory device
- Patent number 12,232,320
- Issue date Feb 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with buried power rail and methods of manufactur...
- Patent number 12,230,570
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Joon Goo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal heterojunction structure with capping metal layer
- Patent number 12,224,179
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Sheng Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Backside contact to improve thermal dissipation away from semicondu...
- Patent number 12,218,106
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide semiconductor device
- Patent number 12,211,840
- Issue date Jan 28, 2025
- NXP B.V.
- Jozef Reinerus Maria Bergervoet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication thereof
- Patent number 12,211,787
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having staircase structure and meth...
- Patent number 12,205,895
- Issue date Jan 21, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices including tiered stacks including conductive str...
- Patent number 12,191,254
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Sidhartha Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through-silicon via and method of fo...
- Patent number 12,183,660
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Jeonil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom lateral expansion of contact plugs through implantation
- Patent number 12,183,632
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite word line structure and method...
- Patent number 12,160,988
- Issue date Dec 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices including different tier pitches, and related electr...
- Patent number 12,160,993
- Issue date Dec 3, 2024
- Yifen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of tungsten on molybdenum templates
- Patent number 12,148,623
- Issue date Nov 19, 2024
- Lam Research Corporation
- Patrick A. van Cleemput
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250176182
- Publication date May 29, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SVIA FORMATION USING VFTL SCHEME
- Publication number 20250174549
- Publication date May 29, 2025
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF FABRICATION THEREOF
- Publication number 20250174553
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING METAL LINES HAVING DIFFERENT METAL...
- Publication number 20250167106
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- JAEMYUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING UPPER LINES WITH DIFFERENT METALS AND WID...
- Publication number 20250157916
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- JAEMYUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING RAISED VIA CONTACTS
- Publication number 20250157938
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...
- Publication number 20250149509
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140696
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Tang HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES...
- Publication number 20250140691
- Publication date May 1, 2025
- Micron Technology, Inc.
- Sidhartha Gupta
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250132257
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Hyo Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE-FREE AND CMP-FRIENDLY INTERCONNECT STRUCTURE IN SEMICONDUCTO...
- Publication number 20250125253
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Joongsuk OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENT ENABLING SUPER-CONFORMAL METAL CAP PROFILE ON MID...
- Publication number 20250112091
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Jianqiu GUO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW RESISTIVITY METAL STACKS AND METHODS OF DEPOSITING THE SAME
- Publication number 20250105013
- Publication date Mar 27, 2025
- Applied Materials, Inc.
- Zhaoxuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20250105148
- Publication date Mar 27, 2025
- Intel Corporation
- Marvin PAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM LATERAL EXPANSION OF CONTACT PLUGS THROUGH IMPLANTATION
- Publication number 20250096041
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING DIFFERENT TIER PITCHES
- Publication number 20250063733
- Publication date Feb 20, 2025
- Lodestar Licensing Group LLC
- Yifen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA AND METHOD OF FO...
- Publication number 20250062193
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Jeonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES
- Publication number 20250038044
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yingcheng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...
- Publication number 20250029926
- Publication date Jan 23, 2025
- Intel Corporation
- Bernhard SELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLYBDENUM DEPOSITION
- Publication number 20250029840
- Publication date Jan 23, 2025
- LAM RESEARCH CORPORATION
- Patrick A. VAN CLEEMPUT
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STAIRCASE STRUCTURE FOR MEMORY DEVICE
- Publication number 20250031366
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY
- Publication number 20250031378
- Publication date Jan 23, 2025
- KIOXIA Corporation
- Go OIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS
- Publication number 20250022752
- Publication date Jan 16, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING METAL LINE AND TOP VIA FORMED THRO...
- Publication number 20250022797
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Jaemyung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE SUPPRESSING LEAKAGE CURRENT...
- Publication number 20250014998
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- JUNGHOO SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME
- Publication number 20240413007
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- CHIH-WEI HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE RUTHENIUM DEPOSITION AND RELATED SYSTEMS AND METHODS
- Publication number 20240412981
- Publication date Dec 12, 2024
- Entegris, Inc.
- Phil S.H. Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME
- Publication number 20240413008
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- CHIH-WEI HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413081
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Sun Jung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT N/P LOCAL INTERCONNECT
- Publication number 20240404872
- Publication date Dec 5, 2024
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS

the principal metal being a refractory metal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Self-aligned metal gate for multigate device and method of forming...

Semiconductor die including through substrate via barrier structure...

Etching to reduce line wiggling

Backside contact for thermal displacement in a multi-wafer stacked...

Semiconductor device structure with silicide portion between conduc...

Phase control in contact formation

Integrated circuit structure

Gate contact structure over active gate and method to fabricate same

Semiconductor die including through substrate via barrier structure...

Conductive feature of a semiconductor device

Stacked FET sidewall strap connections between gates

Semiconductor device to reduce signal loss in a transmission line

Interconnect wires including relatively low resistivity cores

Top via patterning using metal as hard mask and via conductor

Method for manufacturing semiconductor structure having raised via...

Three-dimensional vertical nor flash thin-film transistor strings

Word line structure of three-dimensional memory device

Integrated circuit with buried power rail and methods of manufactur...

Metal heterojunction structure with capping metal layer

Backside contact to improve thermal dissipation away from semicondu...

Metal oxide semiconductor device

Interconnect structures and methods of fabrication thereof

Three-dimensional memory device having staircase structure and meth...

Semiconductor device and a manufacturing method thereof

Electronic devices including tiered stacks including conductive str...

Semiconductor device including through-silicon via and method of fo...

Bottom lateral expansion of contact plugs through implantation

Semiconductor device with composite word line structure and method...

Memory devices including different tier pitches, and related electr...

Deposition of tungsten on molybdenum templates

Patents Applicationslast 30 patents

WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

SVIA FORMATION USING VFTL SCHEME

INTERCONNECT STRUCTURES AND METHODS OF FABRICATION THEREOF

INTERCONNECT STRUCTURE INCLUDING METAL LINES HAVING DIFFERENT METAL...

INTEGRATED CIRCUIT HAVING UPPER LINES WITH DIFFERENT METALS AND WID...

SEMICONDUCTOR STRUCTURE HAVING RAISED VIA CONTACTS

BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...

INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES...

SEMICONDUCTOR DEVICE

BRIDGE-FREE AND CMP-FRIENDLY INTERCONNECT STRUCTURE IN SEMICONDUCTO...

SURFACE TREATMENT ENABLING SUPER-CONFORMAL METAL CAP PROFILE ON MID...

LOW RESISTIVITY METAL STACKS AND METHODS OF DEPOSITING THE SAME

DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...

BOTTOM LATERAL EXPANSION OF CONTACT PLUGS THROUGH IMPLANTATION

MEMORY DEVICES INCLUDING DIFFERENT TIER PITCHES

SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA AND METHOD OF FO...

MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES

METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...

MOLYBDENUM DEPOSITION

STAIRCASE STRUCTURE FOR MEMORY DEVICE

SEMICONDUCTOR MEMORY

FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS

INTERCONNECT STRUCTURE INCLUDING METAL LINE AND TOP VIA FORMED THRO...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE SUPPRESSING LEAKAGE CURRENT...

SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME

SELECTIVE RUTHENIUM DEPOSITION AND RELATED SYSTEMS AND METHODS

SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

DIRECT N/P LOCAL INTERCONNECT