the principal metal being a refractory metal

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CPC
H01L23/53257

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/53257the principal metal being a refractory metal

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including through-silicon via and method of fo...
- Patent number 12,183,660
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Jeonil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom lateral expansion of contact plugs through implantation
- Patent number 12,183,632
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite word line structure and method...
- Patent number 12,160,988
- Issue date Dec 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices including different tier pitches, and related electr...
- Patent number 12,160,993
- Issue date Dec 3, 2024
- Yifen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of tungsten on molybdenum templates
- Patent number 12,148,623
- Issue date Nov 19, 2024
- Lam Research Corporation
- Patrick A. van Cleemput
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Memory cell in wafer backside
- Patent number 12,148,682
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Biswanath Senapati
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming stacked trench contacts and structures formed the...
- Patent number 12,142,566
- Issue date Nov 12, 2024
- Intel Corporation
- Bernhard Sell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure having air gap and method of...
- Patent number 12,142,520
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory
- Patent number 12,144,181
- Issue date Nov 12, 2024
- Kioxia Corporation
- Go Oike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating pedestal based memory devices using pocket in...
- Patent number 12,142,310
- Issue date Nov 12, 2024
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase structure for memory device
- Patent number 12,137,558
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peripheral circuitry under array memory device and method of fabric...
- Patent number 12,137,566
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with a contact to source/drain layers and f...
- Patent number 12,131,990
- Issue date Oct 29, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon buried power rail implemented backside power distri...
- Patent number 12,125,788
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device suppressing leakage current...
- Patent number 12,125,785
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Junghoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die, memory and method of manufacturing die
- Patent number 12,119,286
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- ChihCheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual color via patterning
- Patent number 12,113,013
- Issue date Oct 8, 2024
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conduction enhancement layers for electrical contact regions in pow...
- Patent number 12,094,876
- Issue date Sep 17, 2024
- Wolfspeed, Inc.
- Daniel Jenner Lichtenwalner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned via to metal line for interconnect
- Patent number 12,080,640
- Issue date Sep 3, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor memory device having stacked shifted axis ch...
- Patent number 12,082,413
- Issue date Sep 3, 2024
- Kioxia Corporation
- Toshiyuki Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Molybdenum deposition
- Patent number 12,074,029
- Issue date Aug 27, 2024
- Lam Research Corporation
- Patrick A. Van Cleemput
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structures and methods for reducing process charging damages
- Patent number 12,068,227
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pocket integration process for embedded memory
- Patent number 12,069,866
- Issue date Aug 20, 2024
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with two-dimensional conductive structures
- Patent number 12,068,253
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell structure of a three-dimensional memory device
- Patent number 12,063,780
- Issue date Aug 13, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xiaowang Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive features having varying resistance
- Patent number 12,057,392
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jia-En Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for barrier-less plug
- Patent number 12,051,592
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including voids neighboring conductive cont...
- Patent number 12,040,223
- Issue date Jul 16, 2024
- Micron Technology, Inc.
- Darwin A. Clampitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with a bit line in a different configuratio...
- Patent number 12,022,644
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhon-Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer feature fill
- Patent number 12,014,928
- Issue date Jun 18, 2024
- Lam Research Corporation
- Xiaolan Ba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME
- Publication number 20240413007
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- CHIH-WEI HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE RUTHENIUM DEPOSITION AND RELATED SYSTEMS AND METHODS
- Publication number 20240412981
- Publication date Dec 12, 2024
- Entegris, Inc.
- Phil S.H. Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME
- Publication number 20240413008
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- CHIH-WEI HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413081
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Sun Jung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT N/P LOCAL INTERCONNECT
- Publication number 20240404872
- Publication date Dec 5, 2024
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240395697
- Publication date Nov 28, 2024
- KIOXIA Corporation
- Mitsuhiko NODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERIPHERAL CIRCUITRY UNDER ARRAY MEMORY DEVICE AND METHOD OF FABRIC...
- Publication number 20240397724
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chih LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A RUTHENIUM-CONTAINING LAYER AND LAMINATE
- Publication number 20240384400
- Publication date Nov 21, 2024
- L'air Liquide, Societe Anonyme Pour L'Etude et L'Exploitation Des Procedes Ge...
- Rocio Alejandra ARTEAGA MULLER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240387646
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CONTACT STRUCTURE
- Publication number 20240387261
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240381648
- Publication date Nov 14, 2024
- KIOXIA Corporation
- Toshiyuki SASAKI
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...
- Publication number 20240379435
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE WORD LINE STRUCTURE AND METHOD...
- Publication number 20240365537
- Publication date Oct 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Chi LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240363538
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-WEI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR REDUCING PROCESS CHARGING DAMAGES
- Publication number 20240363495
- Publication date Oct 31, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Kuan-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240363330
- Publication date Oct 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Szu Yu HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D NAND CELLS WITH ENHANCED ERASE SPEED THROUGH DIPOLE ENGINEERING...
- Publication number 20240365551
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Chang Seok Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURES HAVING VARYING RESISTANCE
- Publication number 20240355730
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jia-En Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR BARRIER-LESS PLUG
- Publication number 20240347342
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI LEVEL CONTACT ETCH
- Publication number 20240339328
- Publication date Oct 10, 2024
- TOKYO ELECTRON LIMITED
- Alec Dorfner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING VOIDS NEIGHBOR...
- Publication number 20240339357
- Publication date Oct 10, 2024
- Micron Technology, Inc.
- Darwin A. Clampitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Formation Method and Related Structure
- Publication number 20240332374
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR MULTI-THICKNESS SEMICONDUCTOR DEVICE
- Publication number 20240332065
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Hong You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF DIELECTRIC MATERIAL UPON...
- Publication number 20240332071
- Publication date Oct 3, 2024
- Intel Corporation
- Alireza Narimannezhad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BACK SIDE INTERCONNECT PATTERNING AND FRONT SIDE METAL INTERCONNECT...
- Publication number 20240332064
- Publication date Oct 3, 2024
- Intel Corporation
- Ehren MANNEBACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE (BEOL) INTERCONNECTS WITH DIFFERENT AIRGAP HEIGHTS...
- Publication number 20240321631
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STITCHED GUARD RINGS WITH OVERLAY ERROR RESILIENCY
- Publication number 20240321660
- Publication date Sep 26, 2024
- Intel Corporation
- Shakul Tandon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH A BIT LINE IN A DIFFERENT CONFIGURATIO...
- Publication number 20240314996
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhon-Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CONTROL IN CONTACT FORMATION
- Publication number 20240282626
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER FEATURE FILL
- Publication number 20240282580
- Publication date Aug 22, 2024
- LAM RESEARCH CORPORATION
- Xiaolan BA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

the principal metal being a refractory metal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device including through-silicon via and method of fo...

Bottom lateral expansion of contact plugs through implantation

Semiconductor device with composite word line structure and method...

Memory devices including different tier pitches, and related electr...

Deposition of tungsten on molybdenum templates

Memory cell in wafer backside

Method of forming stacked trench contacts and structures formed the...

Middle-of-line interconnect structure having air gap and method of...

Semiconductor memory

Method of fabricating pedestal based memory devices using pocket in...

Staircase structure for memory device

Peripheral circuitry under array memory device and method of fabric...

Semiconductor structure with a contact to source/drain layers and f...

Through silicon buried power rail implemented backside power distri...

Semiconductor integrated circuit device suppressing leakage current...

Die, memory and method of manufacturing die

Dual color via patterning

Conduction enhancement layers for electrical contact regions in pow...

Self-aligned via to metal line for interconnect

Vertical semiconductor memory device having stacked shifted axis ch...

Molybdenum deposition

Structures and methods for reducing process charging damages

Pocket integration process for embedded memory

Semiconductor structure with two-dimensional conductive structures

Memory cell structure of a three-dimensional memory device

Conductive features having varying resistance

Method and structure for barrier-less plug

Microelectronic devices including voids neighboring conductive cont...

Semiconductor structure with a bit line in a different configuratio...

Multi-layer feature fill

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME

SELECTIVE RUTHENIUM DEPOSITION AND RELATED SYSTEMS AND METHODS

SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

DIRECT N/P LOCAL INTERCONNECT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

PERIPHERAL CIRCUITRY UNDER ARRAY MEMORY DEVICE AND METHOD OF FABRIC...

METHOD OF FORMING A RUTHENIUM-CONTAINING LAYER AND LAMINATE

SEMICONDUCTOR DEVICE AND METHOD

GATE CONTACT STRUCTURE

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...

SEMICONDUCTOR DEVICE WITH COMPOSITE WORD LINE STRUCTURE AND METHOD...

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

STRUCTURES AND METHODS FOR REDUCING PROCESS CHARGING DAMAGES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

3D NAND CELLS WITH ENHANCED ERASE SPEED THROUGH DIPOLE ENGINEERING...

CONDUCTIVE FEATURES HAVING VARYING RESISTANCE

METHOD AND STRUCTURE FOR BARRIER-LESS PLUG

MULTI LEVEL CONTACT ETCH

METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING VOIDS NEIGHBOR...

Contact Formation Method and Related Structure

INTERCONNECT STRUCTURE FOR MULTI-THICKNESS SEMICONDUCTOR DEVICE

PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF DIELECTRIC MATERIAL UPON...

BACK SIDE INTERCONNECT PATTERNING AND FRONT SIDE METAL INTERCONNECT...

BACK-END-OF-LINE (BEOL) INTERCONNECTS WITH DIFFERENT AIRGAP HEIGHTS...

STITCHED GUARD RINGS WITH OVERLAY ERROR RESILIENCY

SEMICONDUCTOR STRUCTURE WITH A BIT LINE IN A DIFFERENT CONFIGURATIO...

PHASE CONTROL IN CONTACT FORMATION

MULTI-LAYER FEATURE FILL