the principal metal being a refractory metal

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/53257the principal metal being a refractory metal

Industries

Patents Grantslast 30 patents

Information Patent Grant
Group VI metal deposition process
- Patent number 12,359,309
- Issue date Jul 15, 2025
- Entegris, Inc.
- Philip S. H. Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,356,611
- Issue date Jul 8, 2025
- SK Hynix Inc.
- Sung Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including metal lines spaced apart from...
- Patent number 12,347,774
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Janggeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor within a via
- Patent number 12,347,769
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device
- Patent number 12,349,355
- Issue date Jul 1, 2025
- Kioxia Corporation
- Shinya Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for barrier-less plug
- Patent number 12,341,013
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal interconnect
- Patent number 12,341,066
- Issue date Jun 24, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned metal gate for multigate device and method of forming...
- Patent number 12,322,653
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jia-Chuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including through substrate via barrier structure...
- Patent number 12,322,679
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching to reduce line wiggling
- Patent number 12,322,651
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact for thermal displacement in a multi-wafer stacked...
- Patent number 12,300,669
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with silicide portion between conduc...
- Patent number 12,288,748
- Issue date Apr 29, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase control in contact formation
- Patent number 12,288,716
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,283,557
- Issue date Apr 22, 2025
- United Microelectronics Corp.
- Aaron Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate contact structure over active gate and method to fabricate same
- Patent number 12,278,144
- Issue date Apr 15, 2025
- Intel Corporation
- Abhijit Jayant Pethe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including through substrate via barrier structure...
- Patent number 12,278,167
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature of a semiconductor device
- Patent number 12,272,598
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- U-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked FET sidewall strap connections between gates
- Patent number 12,274,089
- Issue date Apr 8, 2025
- International Business Machines Corporation
- Chen Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device to reduce signal loss in a transmission line
- Patent number 12,266,603
- Issue date Apr 1, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Pablo Jesús Gardella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 12,266,568
- Issue date Apr 1, 2025
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via patterning using metal as hard mask and via conductor
- Patent number 12,261,056
- Issue date Mar 25, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure having raised via...
- Patent number 12,243,826
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional vertical nor flash thin-film transistor strings
- Patent number 12,245,430
- Issue date Mar 4, 2025
- SUNRISE MEMORY CORPORATION
- Eli Harari
- G11 - INFORMATION STORAGE
Information Patent Grant
Word line structure of three-dimensional memory device
- Patent number 12,232,320
- Issue date Feb 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with buried power rail and methods of manufactur...
- Patent number 12,230,570
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Joon Goo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal heterojunction structure with capping metal layer
- Patent number 12,224,179
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Sheng Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Backside contact to improve thermal dissipation away from semicondu...
- Patent number 12,218,106
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide semiconductor device
- Patent number 12,211,840
- Issue date Jan 28, 2025
- NXP B.V.
- Jozef Reinerus Maria Bergervoet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication thereof
- Patent number 12,211,787
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having staircase structure and meth...
- Patent number 12,205,895
- Issue date Jan 21, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
GATE CONTACT STRUCTURE OVER ACTIVE GATE AND METHOD TO FABRICATE SAME
- Publication number 20250233020
- Publication date Jul 17, 2025
- Intel Corporation
- Abhijit Jayant PETHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTIVITY TUNGSTEN INTERCONNECT STRUCTURES
- Publication number 20250233073
- Publication date Jul 17, 2025
- VEECO INSTRUMENTS INC.
- Rutvik J. MEHTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TRANSISTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250227979
- Publication date Jul 10, 2025
- UNITED MICROELECTRONICS CORP.
- Kuan-Liang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250226010
- Publication date Jul 10, 2025
- STMicroelectronics International N.V.
- Olivier WEBER
- G11 - INFORMATION STORAGE
Information Patent Application
INTERCONNECT WITH TOPVIA
- Publication number 20250226319
- Publication date Jul 10, 2025
- International Business Machines Corporation
- Gideon Oyibo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTOR, ELECTRONIC APPARATUS INCLUDING THE INTERCONNECTOR,...
- Publication number 20250218947
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Youngchul LEEM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE...
- Publication number 20250210468
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR PERFORMANCE IMPROVEMENT FOR STACKED DEVICES USING SELECT...
- Publication number 20250210460
- Publication date Jun 26, 2025
- Intel Corporation
- Rahul Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET VIA FUSE STRUCTURE IN INTERCONNECT REGION
- Publication number 20250201698
- Publication date Jun 19, 2025
- Intel Corporation
- Yao-Feng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20250201629
- Publication date Jun 19, 2025
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE OF A SEMICONDUCTOR DEVICE
- Publication number 20250201627
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- U-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED METAL JUMPER STRUCTURE FOR BEOL
- Publication number 20250192037
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SVIA FORMATION USING VFTL SCHEME
- Publication number 20250174549
- Publication date May 29, 2025
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF FABRICATION THEREOF
- Publication number 20250174553
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250176182
- Publication date May 29, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING METAL LINES HAVING DIFFERENT METAL...
- Publication number 20250167106
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- JAEMYUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING UPPER LINES WITH DIFFERENT METALS AND WID...
- Publication number 20250157916
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- JAEMYUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING RAISED VIA CONTACTS
- Publication number 20250157938
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...
- Publication number 20250149509
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140696
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Tang HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES...
- Publication number 20250140691
- Publication date May 1, 2025
- Micron Technology, Inc.
- Sidhartha Gupta
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250132257
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Hyo Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE-FREE AND CMP-FRIENDLY INTERCONNECT STRUCTURE IN SEMICONDUCTO...
- Publication number 20250125253
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Joongsuk OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENT ENABLING SUPER-CONFORMAL METAL CAP PROFILE ON MID...
- Publication number 20250112091
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Jianqiu GUO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW RESISTIVITY METAL STACKS AND METHODS OF DEPOSITING THE SAME
- Publication number 20250105013
- Publication date Mar 27, 2025
- Applied Materials, Inc.
- Zhaoxuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20250105148
- Publication date Mar 27, 2025
- Intel Corporation
- Marvin PAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM LATERAL EXPANSION OF CONTACT PLUGS THROUGH IMPLANTATION
- Publication number 20250096041
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA AND METHOD OF FO...
- Publication number 20250062193
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Jeonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING DIFFERENT TIER PITCHES
- Publication number 20250063733
- Publication date Feb 20, 2025
- Lodestar Licensing Group LLC
- Yifen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES
- Publication number 20250038044
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yingcheng Zhao
- H01 - BASIC ELECTRIC ELEMENTS

the principal metal being a refractory metal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Group VI metal deposition process

Semiconductor device and method for fabricating the same

Integrated circuit devices including metal lines spaced apart from...

Resistor within a via

Three-dimensional semiconductor memory device

Method and structure for barrier-less plug

Advanced metal interconnect

Self-aligned metal gate for multigate device and method of forming...

Semiconductor die including through substrate via barrier structure...

Etching to reduce line wiggling

Backside contact for thermal displacement in a multi-wafer stacked...

Semiconductor device structure with silicide portion between conduc...

Phase control in contact formation

Integrated circuit structure

Gate contact structure over active gate and method to fabricate same

Semiconductor die including through substrate via barrier structure...

Conductive feature of a semiconductor device

Stacked FET sidewall strap connections between gates

Semiconductor device to reduce signal loss in a transmission line

Interconnect wires including relatively low resistivity cores

Top via patterning using metal as hard mask and via conductor

Method for manufacturing semiconductor structure having raised via...

Three-dimensional vertical nor flash thin-film transistor strings

Word line structure of three-dimensional memory device

Integrated circuit with buried power rail and methods of manufactur...

Metal heterojunction structure with capping metal layer

Backside contact to improve thermal dissipation away from semicondu...

Metal oxide semiconductor device

Interconnect structures and methods of fabrication thereof

Three-dimensional memory device having staircase structure and meth...

Patents Applicationslast 30 patents

GATE CONTACT STRUCTURE OVER ACTIVE GATE AND METHOD TO FABRICATE SAME

LOW RESISTIVITY TUNGSTEN INTERCONNECT STRUCTURES

SEMICONDUCTOR TRANSISTOR STRUCTURE AND FABRICATION METHOD THEREOF

ELECTRONIC DEVICE

INTERCONNECT WITH TOPVIA

INTERCONNECTOR, ELECTRONIC APPARATUS INCLUDING THE INTERCONNECTOR,...

SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE...

TRANSISTOR PERFORMANCE IMPROVEMENT FOR STACKED DEVICES USING SELECT...

OFFSET VIA FUSE STRUCTURE IN INTERCONNECT REGION

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

CONDUCTIVE FEATURE OF A SEMICONDUCTOR DEVICE

BURIED METAL JUMPER STRUCTURE FOR BEOL

SVIA FORMATION USING VFTL SCHEME

INTERCONNECT STRUCTURES AND METHODS OF FABRICATION THEREOF

WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

INTERCONNECT STRUCTURE INCLUDING METAL LINES HAVING DIFFERENT METAL...

INTEGRATED CIRCUIT HAVING UPPER LINES WITH DIFFERENT METALS AND WID...

SEMICONDUCTOR STRUCTURE HAVING RAISED VIA CONTACTS

BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...

INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES...

SEMICONDUCTOR DEVICE

BRIDGE-FREE AND CMP-FRIENDLY INTERCONNECT STRUCTURE IN SEMICONDUCTO...

SURFACE TREATMENT ENABLING SUPER-CONFORMAL METAL CAP PROFILE ON MID...

LOW RESISTIVITY METAL STACKS AND METHODS OF DEPOSITING THE SAME

DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...

BOTTOM LATERAL EXPANSION OF CONTACT PLUGS THROUGH IMPLANTATION

SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA AND METHOD OF FO...

MEMORY DEVICES INCLUDING DIFFERENT TIER PITCHES

MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES